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CC2541F256RHAT
Texas Instruments
IC RF TXRX+MCU BLE 5.0 40VFQFN
1914 Pcs New Original In Stock
IC RF TxRx + MCU Bluetooth Bluetooth v5.0 2.4GHz 40-VFQFN Exposed Pad
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5.0 / 5.0
- (361 Ratings)
CC2541F256RHAT
Product Overview
1250342
DiGi Electronics Part Number
CC2541F256RHAT-DGManufacturer
Texas Instruments
CC2541F256RHAT
Description
IC RF TXRX+MCU BLE 5.0 40VFQFNInventory
1914 Pcs New Original In Stock
IC RF TxRx + MCU Bluetooth Bluetooth v5.0 2.4GHz 40-VFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
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CC2541F256RHAT Technical Specifications
Category
RF Transceiver ICs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
Bluetooth
Protocol
Bluetooth v5.0
Modulation
GFSK, MSK
Frequency
2.4GHz
Data Rate (Max)
2Mbps
Power - Output
0dBm
Sensitivity
-99dBm
Memory Size
256kB Flash, 8kB RAM
Serial Interfaces
I2C, SPI, USART
GPIO
23
Voltage - Supply
2V ~ 3.6V
Current - Receiving
17.9mA ~ 20.2mA
Current - Transmitting
16.8mA ~ 18.2mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
40-VFQFN Exposed Pad
Supplier Device Package
40-VQFN (6x6)
Base Product Number
CC2541
Datasheet & Documents
Manufacturer Product Page
CC2541F256RHAT Specifications
HTML Datasheet
CC2541F256RHAT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.39.0001
Additional Information
Other Names
-296-35514-1-DG
296-35514-2
296-35514-1
2156-CC2541F256RHAT
296-35514-6
TEXTISCC2541F256RHAT
CC2541F256RHAT-DG
-296-35514-1
Standard Package
250
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
빠른 응대와 꼼꼼한 추적 시스템이 인상적입니다.
de desembre 02, 2025
DiGi Electronics 在庫存調度方面表現出色，幫助我們降低了過剩庫存的風險，值得推薦！
de desembre 02, 2025
Der Kundenservice ist proaktiv und kümmert sich schnell um alle Anliegen.
de desembre 02, 2025
Ich bin sehr zufrieden mit der hochwertigen Verpackung und der zuverlässigen Logistik.
de desembre 02, 2025
The customer service experience is consistently positive and supportive.
de desembre 02, 2025
I love how affordable DiGi Electronics products are without compromising on environmental responsibility.
de desembre 02, 2025
I always receive high-quality products without surprises, thanks to their consistency.
de desembre 02, 2025
DiGi Electronics's transportation and packaging standards are outstanding.
de desembre 02, 2025
I’ve never waited long for a delivery from them, and their products have proven to be highly durable over time.
de desembre 02, 2025
Excellent packaging! It kept the product secure and pristine during transportation.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when integrating the CC2541F256RHAT into a compact IoT device with limited PCB space?
When integrating the CC2541F256RHAT into space-constrained IoT designs, engineers must account for its 40-VFQFN (6x6 mm) package, which requires careful RF layout and thermal management despite its small footprint. A major risk is inadequate ground plane design under the exposed pad, which can compromise thermal performance and RF stability. Ensure a minimum 3x3 mm copper pad with through vias to inner-layer ground planes to maintain signal integrity and reliable operation at 2.4GHz. Additionally, keep sensitive analog supply (AVDD) and RF traces short and isolated from digital noise sources to avoid degraded receiver sensitivity or transmission errors, especially in high-noise environments. Using a controlled-impedance microstrip layout for RF traces and avoiding right-angle routing helps maintain 50Ω matching and minimize EMI.
Can the CC2541F256RHAT replace the Nordic nRF51822 in an existing BLE 4.2 design while maintaining backward compatibility?
The CC2541F256RHAT can technically replace the Nordic nRF51822 in BLE 4.2 applications due to similar Bluetooth v5.0 support and 2.4GHz operation, but several integration risks must be addressed. Unlike the nRF51822, the CC2541F256RHAT lacks built-in ARM Cortex-M0+ and instead uses an 8051-based core, requiring significant firmware rework. Memory constraints are tighter—256kB flash and 8kB RAM versus larger options in modern nRF variants—potentially limiting OTA update capability. Additionally, TI's BLE stack (BLE-Stack) differs in API structure and driver integration from Nordic’s SoftDevice, demanding thorough validation of application-layer compatibility. Always verify RF performance with on-device testing, as -99dBm sensitivity and 0dBm output power may yield shorter range than higher-output competitors.
How does the CC2541F256RHAT perform under low-voltage conditions, and what supply regulation strategies minimize brown-out risks?
The CC2541F256RHAT operates from 2V to 3.6V, making it suitable for battery-powered applications, but drops below 2.0V can trigger brown-out resets or erratic behavior due to insufficient core voltage. To mitigate risks in coin-cell or single-cell Li-ion designs, use a low-quiescent-current LDO (e.g., TPS78233) regulated to 2.5V or higher, ensuring stable AVDD and DVDD supplies. Avoid direct battery connection when voltage dips below 2.2V under load, as RF sensitivity and GPIO drive strength degrade. Implement software monitoring via the internal ADC to track supply levels and initiate graceful sleep modes. Consider pairing with a supervisory circuit (e.g., TLV809E) to prevent MCU lockup during cold-start or deep discharge scenarios.
What EMI and RF coexistence challenges arise when the CC2541F256RHAT operates alongside Wi-Fi or other 2.4GHz devices?
The CC2541F256RHAT shares the crowded 2.4GHz ISM band with Wi-Fi, Zigbee, and other BLE devices, increasing interference risk in dense RF environments. While its GFSK/MSK modulation and 2Mbps data rate offer decent robustness, adjacent-channel interference may degrade throughput or increase retransmissions. To improve coexistence, implement adaptive frequency hopping using TI's BLE stack to avoid congested channels. Physically isolate the CC2541F256RHAT's antenna from Wi-Fi modules by at least 15mm and use separate ground zones with minimal overlap. Include a pi-network matching circuit and ensure proper RF filtering on transmit lines to suppress harmonics. Test in real-world scenarios using tools like a spectrum analyzer to validate link budget and packet error rate under interference.
What long-term reliability issues should engineers consider when using the CC2541F256RHAT in industrial environments near its maximum 85°C operating temperature?
Deploying the CC2541F256RHAT in industrial settings near its 85°C upper thermal limit requires attention to thermal derating and solder joint reliability. Extended exposure to high temperatures accelerates electromigration and can reduce flash memory endurance over time. Ensure the PCB design includes sufficient thermal vias under the exposed pad to transfer heat to internal ground planes. Monitor self-heating during TX bursts (up to 18.2mA at 0dBm), which can raise die temperature above ambient. For MSL-3 handling, store and moisture-reflow the CC2541F256RHAT within 168 hours of opening to prevent popcorning during reflow. Also, validate performance after thermal cycling (-40°C to 85°C) and consider conformal coating for protection in high-humidity environments to prevent leakage currents on the 6x6mm VQFN package.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
CC2541F256RHAT CAD Models
Texas Instruments CC2541F256RHAT PCB symbols & footprints
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