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CC1190RGVT
Texas Instruments
IC RF FRONT-END 16VQFN
6086 Pcs New Original In Stock
RF Front End 850MHz ~ 950MHz ISM 16-VQFN (4x4)
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5.0 / 5.0
- (31 Ratings)
CC1190RGVT
Product Overview
1251134
DiGi Electronics Part Number
CC1190RGVT-DGManufacturer
Texas Instruments
CC1190RGVT
Description
IC RF FRONT-END 16VQFNInventory
6086 Pcs New Original In Stock
RF Front End 850MHz ~ 950MHz ISM 16-VQFN (4x4)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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CC1190RGVT Technical Specifications
Category
RF Front End (LNA + PA)
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
RF Type
ISM
Frequency
850MHz ~ 950MHz
Features
-
Package / Case
16-VQFN Exposed Pad
Supplier Device Package
16-VQFN (4x4)
Base Product Number
CC1190
Datasheet & Documents
Manufacturer Product Page
CC1190RGVT Specifications
HTML Datasheet
CC1190RGVT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A991G
HTSUS
8542.39.0001
Additional Information
Other Names
296-25826-1
2156-CC1190RGVT
TEXTISCC1190RGVT
296-25826-6
296-25826-2
-296-25826-1-DG
Standard Package
250
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
每次購物都很放心，商品和服務都讓我感到滿意又放心。
de desembre 02, 2025
L'emballage est extrêmement résistant, ce qui est rassurant en cas de livraison par transporteur chargé.
de desembre 02, 2025
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de desembre 02, 2025
DiGi Electronics' packaging is innovative and solid, providing peace of mind for customers.
de desembre 02, 2025
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de desembre 02, 2025
Their discounts and pricing promotions make high-quality electronic components accessible for everyone.
de desembre 02, 2025
The positive attitude of their customer service team truly enhances my experience.
de desembre 02, 2025
DiGi Electronics offers top-notch after-sales service that I can rely on.
de desembre 02, 2025
The consistency in product quality from Di Digi Electronics is truly commendable.
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Frequently Asked Questions (FAQ)
What are the key thermal and PCB layout considerations when designing a high-density RF system with the CC1190RGVT to avoid performance degradation or overheating?
The CC1190RGVT’s 16-VQFN exposed pad package requires careful thermal management due to its compact 4x4 mm footprint and high-power RF output. Ensure the exposed pad is soldered directly to a grounded thermal plane with multiple vias to dissipate heat efficiently—TI recommends at least nine 0.3 mm vias under the pad. Avoid placing sensitive analog traces near the RF output path, and maintain a continuous ground plane beneath the device to minimize parasitic inductance. Poor layout can lead to impedance mismatches, reduced gain, or thermal runaway under sustained transmission, especially in enclosed enclosures without airflow.
Can the CC1190RGVT be used as a drop-in replacement for the Semtech SX1276 in an 868 MHz LoRaWAN gateway, and what design changes would be required?
While both the CC1190RGVT and Semtech SX1276 operate in the 850–950 MHz ISM band, the CC1190RGVT is an RF front-end (PA/LNA) and not a transceiver, so it cannot directly replace the SX1276, which includes a complete modem. However, the CC1190RGVT can be paired with a compatible transceiver (e.g., CC1120 or CC1310) to boost range in a LoRaWAN system. You’ll need to redesign the RF chain: add impedance-matching networks, ensure proper bias sequencing for the PA/LNA modes, and integrate control logic for RX/TX switching. This adds complexity but can improve link budget by up to 20 dB compared to standalone SX1276 designs.
How does the moisture sensitivity level (MSL 3) of the CC1190RGVT impact high-volume manufacturing, and what handling procedures are critical to prevent field failures?
The CC1190RGVT’s MSL 3 rating means it can be exposed to ambient conditions for up to 168 hours after dry packaging is opened before reflow soldering. In high-volume production, this requires strict FIFO (first-in, first-out) inventory control and climate-controlled storage (≤30°C/60% RH). If moisture absorption exceeds limits, vapor expansion during reflow can cause delamination or ‘popcorning,’ leading to latent reliability issues like increased insertion loss or intermittent RF performance. Always bake trays at 125°C for 24 hours if exposure exceeds 168 hours, and validate solder joint integrity with X-ray inspection on initial batches.
What are the risks of using the CC1190RGVT in battery-powered IoT devices operating at the upper end of its 850–950 MHz range, and how can power efficiency be optimized without sacrificing range?
Operating the CC1190RGVT near 950 MHz increases current consumption in PA mode due to higher harmonic losses and reduced efficiency of matching networks tuned for lower frequencies. In battery-powered applications like remote sensors, this can significantly shorten operational life. To mitigate this, use dynamic frequency selection to stay below 920 MHz where possible, implement duty-cycled transmission with fast LNA/PA enable/disable timing (<10 µs), and optimize the output matching network for the specific carrier frequency using Smith chart tuning. Also, ensure the supply voltage remains stable—voltage drops below 3.0V can cause gain compression and spectral regrowth, violating regulatory masks.
When integrating the CC1190RGVT with a low-cost microcontroller lacking dedicated RF control pins, how can reliable RX/TX mode switching be achieved without introducing timing glitches or signal distortion?
The CC1190RGVT requires precise control of its PA_EN and LNA_EN pins for mode switching, typically managed by a transceiver or FPGA. When using a basic MCU (e.g., STM32G0 or ESP32), use GPIOs with hardware-timed interrupts or PWM outputs synchronized to the RF frame timing to avoid software-induced jitter. Add small RC filters (e.g., 1 kΩ + 100 pF) on enable lines to suppress glitches during transitions. Ensure the MCU and CC1190RGVT share a clean ground reference and that switching occurs during guard intervals—mis-timed transitions can cause transient IMD products or receiver desense. Validate timing with an oscilloscope and spectrum analyzer to confirm compliance with duty cycle and spectral emission limits.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
CC1190RGVT CAD Models
Texas Instruments CC1190RGVT PCB symbols & footprints
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