BQ24251RGER >
BQ24251RGER
Texas Instruments
IC BATT CHG LI-ION 1CELL 24VQFN
17049 Pcs New Original In Stock
Charger IC Lithium Ion 24-VQFN (4x4)
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BQ24251RGER Texas Instruments
5.0 / 5.0 - (190 Ratings)

BQ24251RGER

Product Overview

1232138

DiGi Electronics Part Number

BQ24251RGER-DG

Manufacturer

Texas Instruments
BQ24251RGER

Description

IC BATT CHG LI-ION 1CELL 24VQFN

Inventory

17049 Pcs New Original In Stock
Charger IC Lithium Ion 24-VQFN (4x4)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 1.3527 1.3527
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BQ24251RGER Technical Specifications

Category Power Management (PMIC), Battery Chargers

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Not For New Designs

Battery Chemistry Lithium Ion

Number of Cells 1

Current - Charging Constant - Programmable

Programmable Features Current

Fault Protection Over Current, Over Temperature, Over Voltage

Charge Current - Max 2A

Battery Pack Voltage 4.2V

Voltage - Supply (Max) 10.5V

Interface I2C

Operating Temperature -40°C ~ 85°C (TA)

Mounting Type Surface Mount

Package / Case 24-VFQFN Exposed Pad

Supplier Device Package 24-VQFN (4x4)

Base Product Number BQ24251

Datasheet & Documents

Manufacturer Product Page

BQ24251RGER Specifications

HTML Datasheet

BQ24251RGER-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
296-39915-6-DG
296-BQ24251RGERCT
-296-39915-1-DG
296-39915-6
296-39915-1
296-39915-1-DG
296-39915-2-DG
296-39915-2
BQ24251RGER-DG
296-BQ24251RGERTR
296-BQ24251RGERDKR
Standard Package
3,000

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
BQ24250RGER
Texas Instruments
40798
BQ24250RGER-DG
0.0179
MFR Recommended
BQ24253RGER
Texas Instruments
4109
BQ24253RGER-DG
2.2901
Parametric Equivalent
BQ24251RGET
Texas Instruments
6743
BQ24251RGET-DG
0.0135
Parametric Equivalent
BQ24250RGET
Texas Instruments
3123
BQ24250RGET-DG
0.7194
Parametric Equivalent
BQ24253RGET
Texas Instruments
6171
BQ24253RGET-DG
1.9976
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
Morn***Bliss
de desembre 02, 2025
5.0
I have confidence in DiGi Electronics' products for both personal and professional use.
Purel***sitive
de desembre 02, 2025
5.0
Their packaging strategies successfully prevent common shipping damages like crushing and static discharge.
Velv***reams
de desembre 02, 2025
5.0
Their post-purchase support makes my experience with them very enjoyable.
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Frequently Asked Questions (FAQ)

What are the key design risks when replacing the BQ24251RGER with a competitor's single-cell Li-ion charger IC in a space-constrained portable device?

When replacing the BQ24251RGER with alternatives like the MCP73831T-I/OT or MAX1555EZK+, you must account for differences in thermal performance, control interface, and fault handling. The BQ24251RGER’s I2C programmability and integrated safety timers offer precise charge current control and system-level diagnostics—features often missing in simpler linear chargers. Additionally, its 24-VQFN (4x4) exposed pad package enables better heat dissipation than smaller packages like SOT-23 or DFN-6 used by competitors, which can lead to premature thermal shutdown under high ambient temperatures or poor PCB layout. Always validate thermal behavior under worst-case load and ensure the substitute supports equivalent overvoltage, overcurrent, and overtemperature protection thresholds to avoid battery safety hazards.

Can the BQ24251RGER safely charge a deeply discharged Li-ion cell below 2.5V, and what precautions are needed during design-in?

The BQ24251RGER does not support pre-charge or trickle charging for cells below approximately 2.8V—it will typically disable charging and flag a fault condition. If your application may encounter deeply discharged batteries (e.g., after long storage), you must implement an external pre-charge circuit or select a charger with built-in pre-charge capability like the BQ24253RGER (a direct substitute with enhanced low-voltage recovery). Relying solely on the BQ24251RGER in such scenarios risks leaving the battery uncharged or triggering permanent fault states. Always include a voltage monitoring circuit to detect deeply discharged packs before insertion and consider system-level safeguards to prevent user frustration or perceived product failure.

How does the BQ24251RGER’s lack of Power Path management impact system design in always-on portable applications?

Unlike PMICs with Power Path (e.g., BQ24075 or BQ25895), the BQ24251RGER charges the battery and powers the system through separate paths, meaning the system load must be supplied independently during charging. This requires an external regulator or power multiplexer to avoid draining the battery while charging, increasing BOM complexity and board space. In always-on devices (e.g., IoT sensors or wearables), this can lead to inefficient power use or unexpected shutdowns if the input source is unstable. Designers should evaluate whether the added complexity of a discrete power path solution outweighs migrating to a more integrated charger—especially since the BQ24251RGER is marked 'Not For New Designs' by TI, signaling limited long-term support.

What layout and thermal considerations are critical when using the BQ24251RGER in high-ambient-temperature environments near its 85°C limit?

The BQ24251RGER’s 24-VQFN exposed pad must be soldered to a sufficiently large ground plane (≥ 400 mm² recommended) with multiple thermal vias to dissipate heat effectively—especially when operating near the 2A max charge current. In high-ambient environments (e.g., industrial handhelds or automotive cabins), inadequate copper area or poor airflow can cause junction temperatures to exceed safe limits, triggering thermal shutdown and interrupting charging cycles. Use thermal simulation or IR imaging during prototyping to validate temperature rise. Also, avoid placing heat-sensitive components (e.g., crystals or sensors) within 5 mm of the IC. If thermal headroom is insufficient, consider derating the charge current via I2C or switching to a more thermally robust alternative like the BQ24250RGER with similar specs but improved thermal characterization.

Is it safe to use the BQ24251RGER in a design that occasionally sees input voltages above 10.5V due to adapter overshoot or hot-plug transients?

No—the BQ24251RGER has a maximum input voltage rating of 10.5V, and sustained or transient overvoltage (e.g., from poorly regulated wall adapters or USB hot-plugging) can damage the IC or compromise reliability. Even brief spikes above 11V may exceed the absolute maximum ratings, leading to latent failures or immediate breakdown. To mitigate this, include a TVS diode (e.g., SMAJ5.0A) and input filter capacitor close to the VIN pin, and consider an upstream load switch with overvoltage lockout (like the TPS22916). For designs in harsh environments, evaluate more robust alternatives such as the BQ24253RGER, which offers higher input tolerance and enhanced transient protection, reducing field failure risk despite the BQ24251RGER’s current availability.

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