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AM5728BABCXEA
Texas Instruments
IC MPU SITARA 1.5GHZ 760FCBGA
1000483 Pcs New Original In Stock
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)
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5.0 / 5.0
- (294 Ratings)
AM5728BABCXEA
Product Overview
1251093
DiGi Electronics Part Number
AM5728BABCXEA-DGManufacturer
Texas Instruments
AM5728BABCXEA
Description
IC MPU SITARA 1.5GHZ 760FCBGAInventory
1000483 Pcs New Original In Stock
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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365 - Day Quality Guarantee - Every part fully backed.
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AM5728BABCXEA Technical Specifications
Category
Embedded, Microprocessors
Packaging
Tray
Series
Sitara™
Product Status
Active
Core Processor
ARM® Cortex®-A15
Number of Cores/Bus Width
2 Core, 32-Bit
Speed
1.5GHz
Co-Processors/DSP
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers
DDR3, SRAM
Graphics Acceleration
Yes
Display & Interface Controllers
-
Ethernet
GbE
SATA
SATA 3Gbps (1)
USB
USB 2.0 (1), USB 3.0 (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
-
Mounting Type
Surface Mount
Package / Case
760-BFBGA, FCBGA
Supplier Device Package
760-FCBGA (23x23)
Additional Interfaces
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
Base Product Number
AM5728
Datasheet & Documents
Manufacturer Product Page
AM5728BABCXEA Specifications
HTML Datasheet
AM5728BABCXEA-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-45049
-296-45049-DG
Standard Package
60
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
배송 속도가 매우 빠르고, 제품의 신뢰성도 높아서 계속 재구매하고 싶어요.
de desembre 02, 2025
配送の正確さとスピードに大変満足しています。信頼のおける会社です。
de desembre 02, 2025
Shopping at DiGi Electronics is always a positive experience because of their friendly staff and fair prices.
de desembre 02, 2025
The consistent stock availability from DiGi Electronics reduces our inventory worries.
de desembre 02, 2025
Their proactive communication and abundant stock keep my projects running smoothly.
de desembre 02, 2025
Consistent and timely delivery makes DiGi Electronics my go-to supplier for electronic components.
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Frequently Asked Questions (FAQ)
What are the critical thermal design considerations when using the AM5728BABCXEA in a compact industrial enclosure with limited airflow, and how can I mitigate junction temperature risks near the 105°C limit?
The AM5728BABCXEA has a maximum junction temperature (TJ) of 105°C, and in compact enclosures with poor airflow, localized hot spots can easily exceed this under sustained 1.5GHz dual-core load. To mitigate risk, implement a copper-filled thermal via array under the 760-FCBGA package, use a high-conductivity thermal interface material (TIM) to a heatsink or chassis, and monitor die temperature via the built-in thermal sensor. Consider dynamic frequency scaling or workload throttling if ambient temperatures exceed 70°C. Always validate thermal performance with infrared imaging or embedded telemetry during prototype testing.
Can the AM5728BABCXEA reliably replace a legacy AM5726BABCXEA in an existing medical device design without hardware or firmware changes, and what hidden compatibility risks should I evaluate?
While the AM5728BABCXEA shares the same 760-FCBGA footprint and ARM Cortex-A15 architecture as the AM5726BABCXEA, direct drop-in replacement requires careful validation. Key risks include differences in power sequencing tolerances, DDR3 controller timing margins, and subtle variations in I/O voltage thresholds (1.8V/3.3V). Additionally, firmware assumptions about DSP or GPU co-processor behavior may not carry over cleanly. Always re-validate boot reliability, signal integrity on high-speed interfaces like PCIe and USB 3.0, and power-on reset timing. TI’s PinMux tool and errata sheets for both parts must be cross-referenced before qualification.
How does the AM5728BABCXEA compare to the NXP i.MX 8M Plus in terms of real-time control capability for motor drive applications, and what integration challenges arise when using its PRU-ICSS subsystem?
The AM5728BABCXEA offers superior real-time performance for motor control compared to the i.MX 8M Plus due to its dual Programmable Real-Time Units (PRU-ICSS), which provide deterministic, sub-microsecond response times ideal for PWM generation and encoder feedback. However, integrating the PRU requires deep familiarity with TI’s PRU assembly language and compiler toolchain, which lacks the maturity of mainstream ARM development environments. Unlike the i.MX 8M Plus’s Cortex-M7 co-processor, the PRU has limited debugging support and memory constraints. Designers must carefully partition control logic between the A15 cores and PRUs to avoid bottlenecks, and validate timing with oscilloscope measurements on actual hardware.
What are the long-term reliability implications of operating the AM5728BABCXEA at its upper temperature limit (105°C TJ) in an automotive under-hood application, and how does MSL 3 affect board-level assembly?
Operating the AM5728BABCXEA continuously near 105°C TJ accelerates electromigration and reduces mean time between failures (MTBF), especially in automotive environments with thermal cycling. While the part is rated for this temperature, sustained operation above 95°C TJ significantly increases risk of early failure. Additionally, the Moisture Sensitivity Level (MSL) 3 rating means the device can be exposed to ambient conditions for only 168 hours before requiring baking—critical for high-volume assembly lines. To ensure reliability, implement underfill encapsulation, control reflow profiles strictly per J-STD-020, and consider derating the CPU frequency or enabling thermal throttling in firmware to keep TJ below 90°C during normal operation.
When designing a multi-sensor industrial gateway using the AM5728BABCXEA, how should I allocate its heterogeneous processing resources (Cortex-A15, DSP, GPU, IVA) to avoid resource contention and ensure real-time responsiveness?
To optimize the AM5728BABCXEA in a multi-sensor gateway, assign time-critical tasks like sensor fusion and protocol handling to the PRU-ICSS or DSP cores, while reserving the Cortex-A15 pair for Linux-based networking and user interface tasks. Avoid overloading the shared L2 cache and DDR3 memory bandwidth—use the IPU and IVA accelerators for video preprocessing to offload the A15. Be cautious of GPU usage if 2D/3D rendering isn’t needed, as it consumes power and memory bandwidth unnecessarily. Use TI’s Code Composer Studio with system-wide profiling to identify bottlenecks, and consider isolating real-time workloads using CPU affinity and RTOS partitions to prevent Linux scheduler jitter from impacting deterministic behavior.
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AM5728BABCXEA CAD Models
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