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AM5728BABCXA
Texas Instruments
IC MPU SITARA 1.5GHZ 760FCBGA
1476 Pcs New Original In Stock
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)
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5.0 / 5.0
- (473 Ratings)
AM5728BABCXA
Product Overview
1250910
DiGi Electronics Part Number
AM5728BABCXA-DGManufacturer
Texas Instruments
AM5728BABCXA
Description
IC MPU SITARA 1.5GHZ 760FCBGAInventory
1476 Pcs New Original In Stock
ARM® Cortex®-A15 Microprocessor IC Sitara™ 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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AM5728BABCXA Technical Specifications
Category
Embedded, Microprocessors
Packaging
Tray
Series
Sitara™
Product Status
Active
Core Processor
ARM® Cortex®-A15
Number of Cores/Bus Width
2 Core, 32-Bit
Speed
1.5GHz
Co-Processors/DSP
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers
DDR3, SRAM
Graphics Acceleration
Yes
Display & Interface Controllers
-
Ethernet
GbE
SATA
SATA 3Gbps (1)
USB
USB 2.0 (1), USB 3.0 (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
-
Mounting Type
Surface Mount
Package / Case
760-BFBGA, FCBGA
Supplier Device Package
760-FCBGA (23x23)
Base Product Number
AM5728
Datasheet & Documents
Manufacturer Product Page
AM5728BABCXA Specifications
HTML Datasheet
AM5728BABCXA-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-45333
-296-45333-DG
Standard Package
60
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
주문 후 배송이 빠르고, 문제 해결도 신속해서 믿고 구매할 수 있는 곳입니다.
de desembre 02, 2025
L’expédition express est un vrai plus, permettant de recevoir ses achats en un éclair.
de desembre 02, 2025
DiGi Electronics' delivery was prompt, and the product's finish and material quality were beyond my standards.
de desembre 02, 2025
DiGi Electronics offers a huge range of components and stands out for their reliable after-sales support.
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Frequently Asked Questions (FAQ)
Can the AM5728BABCXA be used as a drop-in replacement for the AM5726BABCXA in an existing industrial control system design, and what are the key integration risks to evaluate?
While the AM5728BABCXA shares the same 760-FCBGA package and pinout compatibility with the AM5726BABCXA, it features a higher maximum CPU frequency (1.5GHz vs 1.3GHz) and includes additional co-processors like the IVA and VPE that may affect power sequencing, thermal management, and boot configuration. You must verify that your power delivery network can support the increased dynamic current during peak loads and ensure your boot ROM or U-Boot configuration accounts for potential differences in clock tree initialization. Additionally, DDR3 memory timing margins should be re-validated due to the higher core speed, especially if operating near the upper end of the -40°C to 105°C junction temperature range.
What are the critical layout and signal integrity considerations when designing a PCB with the AM5728BABCXA, particularly for the DDR3 and high-speed USB 3.0 interfaces?
The AM5728BABCXA requires strict adherence to high-speed design rules due to its 1.5GHz Cortex-A15 cores and integrated DDR3 controller supporting up to 800MHz data rates. For DDR3, maintain length-matched differential pairs (±50ps skew), controlled impedance (typically 50Ω single-ended), and minimize via stubs. Use a solid ground reference plane beneath all DDR traces and place decoupling capacitors as close as possible to the BGA balls. For the USB 3.0 SuperSpeed interface, route differential pairs with 90Ω differential impedance, avoid crossing split planes, and keep traces under 10 inches to minimize insertion loss. Given the 760-FCBGA’s fine pitch (0.8mm), use microvias and HDI stackups to escape inner rows without compromising return paths.
How does the thermal performance of the AM5728BABCXA compare to the NXP i.MX 8M Plus in a sealed industrial enclosure, and what heatsinking strategy is recommended for sustained 1.5GHz operation?
The AM5728BABCXA has a higher thermal design power (TDP) than the i.MX 8M Plus under full CPU and DSP load due to its dual Cortex-A15 cores running at 1.5GHz and active IVA/GPU blocks. In a sealed enclosure, passive cooling may be insufficient unless paired with a well-designed thermal pad connected to the PCB’s ground plane or an external heatsink. TI recommends using a thermal interface material (TIM) with ≥3 W/mK conductivity and ensuring adequate airflow or conduction paths. Monitor junction temperature via the on-die thermal sensor; sustained operation above 95°C may require throttling or derating. Unlike the i.MX 8M Plus, which integrates a neural processing unit (NPU) optimized for low-power AI workloads, the AM5728BABCXA’s DSP-based vision acceleration draws more power under similar tasks—factor this into your thermal budget.
Is it safe to operate the AM5728BABCXA at its maximum junction temperature of 105°C in a automotive-grade application, and what long-term reliability risks should be mitigated?
Operating the AM5728BABCXA continuously at 105°C TJ significantly accelerates electromigration and time-dependent dielectric breakdown (TDDB), reducing mean time between failures (MTBF) compared to operation at 85°C or below. While the device is rated for -40°C to 105°C, TI’s reliability data shows exponential wear-out mechanisms above 90°C. For automotive or mission-critical industrial use, implement dynamic thermal management (DTM) using the built-in temperature sensor to throttle performance before reaching 100°C. Also, ensure your PCB uses high-Tg laminates (e.g., FR4-HT) and complies with MSL 3 handling procedures to prevent moisture-induced popcorning during reflow, which can compromise long-term thermal interface integrity.
What are the main software and firmware challenges when migrating from an older TI Sitara AM3359 to the AM5728BABCXA, especially regarding DSP and GPU resource sharing?
Migrating from the AM3359 (single-core Cortex-A8, no GPU/IVA) to the AM5728BABCXA introduces complexity in resource partitioning and real-time coordination. The AM5728BABCXA’s heterogeneous architecture—with dual Cortex-A15, C66x DSP, IVA-HD, and SGX544 GPU—requires careful scheduling to avoid contention. Linux-based systems must use TI’s Processor SDK with OpenCL or CMEM for DSP offload, while GPU tasks need proper buffer management via the BB2D/OpenGL ES stack. Misconfiguration can lead to memory coherency issues or latency spikes in time-sensitive applications. Additionally, the AM5728BABCXA uses a different PRU-ICSS subsystem than the AM3359’s PRU-SS, so existing real-time firmware must be rewritten. Always validate inter-processor communication (IPC) mechanisms like RPMsg early in the design phase to prevent deadlocks under load.
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AM5728BABCXA CAD Models
Texas Instruments AM5728BABCXA PCB symbols & footprints
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