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AM5718AABCXA
Texas Instruments
IC MPU SITARA 1.5GHZ 760FCBGA
34996 Pcs New Original In Stock
ARM® Cortex®-A15 Microprocessor IC Sitara™ 1 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)
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5.0 / 5.0
- (251 Ratings)
AM5718AABCXA
Product Overview
1413839
DiGi Electronics Part Number
AM5718AABCXA-DGManufacturer
Texas Instruments
AM5718AABCXA
Description
IC MPU SITARA 1.5GHZ 760FCBGAInventory
34996 Pcs New Original In Stock
ARM® Cortex®-A15 Microprocessor IC Sitara™ 1 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)
Quantity
Minimum 1
Minimum 1
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AM5718AABCXA Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
Sitara™
Product Status
Active
Core Processor
ARM® Cortex®-A15
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
1.5GHz
Co-Processors/DSP
Multimedia; GPU, IPU, VFP
RAM Controllers
DDR3, SRAM
Graphics Acceleration
Yes
Display & Interface Controllers
HDMI
Ethernet
10/100/1000Mbps (1)
SATA
SATA 3Gbps (1)
USB
USB 2.0 (1), USB 3.0 (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
-
Mounting Type
Surface Mount
Package / Case
760-BFBGA, FCBGA
Supplier Device Package
760-FCBGA (23x23)
Additional Interfaces
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
Base Product Number
AM5718
Datasheet & Documents
Manufacturer Product Page
AM5718AABCXA Specifications
HTML Datasheet
AM5718AABCXA-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Standard Package
60
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Hier fühlt man sich wirklich gut betreut. Schneller Versand und hervorragender Kundenservice.
de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)
What are the key thermal design considerations when integrating the AM5718AABCXA in an industrial application with limited airflow?
When integrating the AM5718AABCXA in environments with limited airflow, thermal management is critical due to its 1.5GHz ARM® Cortex®-A15 core and integrated multimedia accelerators that can generate significant heat under load. Even though the device supports operation up to 105°C (TJ), sustained high junction temperatures increase the risk of thermal throttling or reliability degradation. To mitigate this, use a properly sized heatsink with thermal interface material (TIM) and ensure the PCB includes adequate thermal vias under the exposed pad to transfer heat to internal ground planes. Additionally, consider dynamic power management through TI’s Power Management Framework (PMF) to reduce active power during peak loads. Monitoring die temperature via the internal sensor through the I2C interface allows for proactive fan or workload control.
Can the AM5718AABCXA replace the AM5728 in a robotics control system, and what are the performance and peripheral trade-offs?
Yes, the AM5718AABCXA can replace the AM5728 in many robotics control applications, but with important trade-offs. While both are Sitara™ processors operating at 1.5GHz, the AM5728 features dual ARM® Cortex®-A15 cores, offering better multicore performance for parallel real-time control and OS virtualization. The AM5718AABCXA has only one A15 core but retains critical robotics peripherals like dual Ethernet (10/100/1000 Mbps), CAN, PCIe, and McSPI for motor drive interfaces. If your application runs lightweight Linux and uses PRU-ICSS for real-time motion control, the AM5718AABCXA is sufficient and offers cost and power savings. However, avoid this substitution if your control stack depends heavily on symmetric multiprocessing or real-time determinism across multiple high-priority threads.
How does the AM5718AABCXA handle DDR3 memory interface skew and signal integrity at maximum clock speeds?
Achieving reliable DDR3 interface performance with the AM5718AABCXA requires careful PCB design to manage trace length matching and signal integrity. TI recommends keeping data (DQ) and strobe (DQS) trace lengths within ±25 mils for byte lanes and address/command traces matched within ±50 mils across the channel. Use controlled impedance routing (typically 50Ω single-ended, 100Ω differential) and minimize vias. Enable on-die termination (ODT) through configuration registers and validate timing margins using the built-in DDR PHY calibration engine (DPC). Simulate the memory interface with IBIS models from TI, especially for 760-FCBGA’s dense routing, and consider adding series resistors for damping if ringing is observed on prototypes.
What power sequencing requirements must be followed to ensure reliable startup of the AM5718AABCXA in automotive applications?
The AM5718AABCXA requires strict adherence to power sequencing to prevent latch-up or I/O stress, especially in automotive environments with unstable power rails. TI specifies that core voltage (VDD_MPU, VDD_CORE) must ramp up before I/O supplies (VDDSHVx, VDD_1V8, VDD_3V3). The recommended sequence: 1) Analog rails (VDDA_1P8), 2) Core voltages (~1.1V), 3) I/O voltages (1.8V, 3.3V). Use a power management IC (PMIC) such as the TPS659037 with programmable sequencing and reset supervision. Include a minimum 100ms delay between rail enables if sequencing is not tightly controlled. Monitor power-good signals via the PMIC and ensure reset (nRESET) is held low until all rails are stable. This prevents bus contention and ensures proper initialization of the HDMI, PCIe, and USB 3.0 interfaces.
Is the AM5718AABCXA suitable for long-term deployment in outdoor telecommunications enclosures, and what reliability risks should be addressed?
The AM5718AABCXA is well-suited for long-term outdoor telecom deployment due to its -40°C to 105°C operating temperature range and robust 760-FCBGA package. However, reliability risks include sustained high temperature exposure reducing MTBF and potential condensation in non-sealed enclosures. Mitigate these by ensuring conformal coating on the PCB, using sealed connectors, and monitoring die temperature via the internal sensor to trigger thermal derating if needed. The MSL 3 rating requires the device to be used within 168 hours after opening the moisture bag unless baked, so plan assembly logistics carefully. Also, leverage the integrated ECC-protected memory interfaces and error reporting in the IPU to detect and log latent memory errors that could degrade performance over time in harsh RF/noise environments.
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AM5718AABCXA CAD Models
Texas Instruments AM5718AABCXA PCB symbols & footprints
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