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AM4379BZDNA80
Texas Instruments
IC MPU SITARA 800MHZ 491NFBGA
1368 Pcs New Original In Stock
ARM® Cortex®-A9 Microprocessor IC Sitara™ 1 Core, 32-Bit 800MHz 491-NFBGA (17x17)
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5.0 / 5.0
- (384 Ratings)
AM4379BZDNA80
Product Overview
1415197
DiGi Electronics Part Number
AM4379BZDNA80-DGManufacturer
Texas Instruments
AM4379BZDNA80
Description
IC MPU SITARA 800MHZ 491NFBGAInventory
1368 Pcs New Original In Stock
ARM® Cortex®-A9 Microprocessor IC Sitara™ 1 Core, 32-Bit 800MHz 491-NFBGA (17x17)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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AM4379BZDNA80 Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
Sitara™
Product Status
Active
Core Processor
ARM® Cortex®-A9
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
800MHz
Co-Processors/DSP
Multimedia; NEON™ SIMD
RAM Controllers
LPDDR2, DDR3, DDR3L
Graphics Acceleration
Yes
Display & Interface Controllers
TSC, WXGA
Ethernet
10/100/1000Mbps (2)
SATA
-
USB
USB 2.0 + PHY (2)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
Crypto Accelerator
Mounting Type
Surface Mount
Package / Case
491-LFBGA
Supplier Device Package
491-NFBGA (17x17)
Additional Interfaces
CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART
Base Product Number
AM4379
Datasheet & Documents
Manuals
AM437x Tech Ref Manual
Manufacturer Product Page
AM4379BZDNA80 Specifications
HTML Datasheet
AM4379BZDNA80-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
-296-42763-DG
TEXTISAM4379BZDNA80
2156-AM4379BZDNA80
296-42763
AM4379BZDNA80-DG
Standard Package
90
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Le processus d’inscription et de connexion est simple et sécurisé.
de desembre 02, 2025
Durch die vielfältigen Produktangebote können wir unsere Ausstattung regelmäßig modernisieren.
de desembre 02, 2025
Fast shipping helped me get my work started without delays.
de desembre 02, 2025
Their attention to detail ensures every product meets superior quality criteria.
de desembre 02, 2025
I appreciate the honesty in their pricing, which fosters a lasting relationship of trust.
de desembre 02, 2025
Customer support was quick to respond to my inquiries, complementing the smooth shopping process.
de desembre 02, 2025
Their customer support is responsive and always willing to assist.
de desembre 02, 2025
Their after-sales support includes fantastic troubleshooting assistance, making the purchase experience seamless.
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Frequently Asked Questions (FAQ)
Can the AM4379BZDNA80 be safely used as a drop-in replacement for the AM3359 in an existing 3.3V industrial control design, and what are the critical hardware compatibility risks?
While both the AM4379BZDNA80 and AM3359 are Sitara™ ARM Cortex-A9 MPUs from Texas Instruments and share similar peripheral sets, they are not direct drop-in replacements due to key differences in power sequencing, I/O voltage tolerance, and package pinout. The AM4379BZDNA80 requires stricter power-on sequencing (VDDSHVx rails must ramp in correct order) and has different MMC/SDIO and USB PHY configurations. Additionally, the 491-NFBGA package of the AM4379BZDNA80 has a different ball map than the AM3359’s 298-NFBGA, making PCB reuse impractical without layout changes. Always validate power integrity, signal termination, and boot configuration before migration—TI’s AM437x Evaluation Module schematics should be used as a reference to mitigate integration risks.
What are the thermal design constraints when operating the AM4379BZDNA80 at 800MHz in a sealed industrial enclosure with ambient temperatures up to 85°C, and how can junction temperature be reliably estimated?
The AM4379BZDNA80 has a maximum junction temperature (TJ) of 105°C, but sustained operation near this limit significantly reduces long-term reliability. In a sealed enclosure at 85°C ambient, passive cooling may be insufficient without a well-designed thermal pad and copper pour acting as a heat spreader. Use the thermal resistance junction-to-board (ΘJB ≈ 8.5°C/W, typical) from the datasheet and measure board temperature near the package to estimate TJ: TJ ≈ TB + (ΘJB × Pdiss). Power dissipation (Pdiss) should be modeled using TI’s Power Estimator Tool under real workload conditions. For margin, maintain TJ below 95°C—consider adding a small heatsink or vented enclosure if power exceeds 2.5W under load.
How does the AM4379BZDNA80 compare to the NXP i.MX6UL in terms of real-time performance, peripheral flexibility, and long-term supply stability for a 10-year industrial HMI application?
The AM4379BZDNA80 offers superior real-time performance with its dual PRU-ICSS subsystems (not present on i.MX6UL), making it better suited for deterministic industrial protocols like EtherCAT or precise PWM control. It also includes two Gigabit Ethernet ports with hardware timestamping, which the i.MX6UL lacks. However, the i.MX6UL typically has a lower BOM cost and simpler power architecture. For long-term supply, TI has committed to 15-year availability for AM437x, while NXP’s i.MX6UL lifecycle is less certain beyond 2030. If your HMI requires hard real-time I/O or dual GbE, the AM4379BZDNA80 is the more future-proof choice despite higher complexity in power and layout.
What are the risks of using the internal DDR3 controller on the AM4379BZDNA80 with low-cost commercial-grade memory in an automotive-grade temperature environment (-40°C to 105°C), and how can signal integrity be ensured?
Using commercial-grade DDR3 memory with the AM4379BZDNA80 in an extended temperature range (-40°C to 105°C) introduces significant risk of data corruption due to timing drift and reduced noise margins at temperature extremes. The AM4379BZDNA80’s DDR controller is sensitive to trace impedance, length matching (±50ps skew max), and power supply noise. Always use automotive-qualified DDR3 chips (e.g., Micron MT41K256M16HA-125:A) and follow TI’s DDR Layout Guidelines strictly: 4-layer minimum PCB, controlled impedance routing, on-die termination (ODT), and decoupling within 2mm of power pins. Perform eye diagram testing at both temperature extremes to validate setup/hold margins—failure to do so may result in intermittent boot failures or runtime crashes.
Can the AM4379BZDNA80’s crypto accelerator be used to implement secure boot and encrypted firmware updates in a field-deployed IoT gateway without an external HSM, and what are the limitations?
Yes, the AM4379BZDNA80’s integrated crypto accelerator supports secure boot via RSA-2048/SHA-256 signature verification and AES-256 for encrypted firmware updates, enabling a root-of-trust without an external HSM. However, the private key must be stored in one-time programmable (OTP) fuses, which are irreversible—any programming error bricks the device. Additionally, the crypto engine lacks true random number generation (TRNG is present but must be validated), and side-channel attack resistance is limited compared to dedicated security ICs like the ATECC608B. For high-assurance applications, pair the AM4379BZDNA80 with an external secure element. For moderate-risk deployments, use TI’s Processor SDK Linux with verified secure boot chain and rotate update keys via OTP sparingly to avoid fuse exhaustion.
Quality Assurance (QC)
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AM4379BZDNA80 CAD Models
Texas Instruments AM4379BZDNA80 PCB symbols & footprints
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