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AM4377BZDNA80
Texas Instruments
IC MPU SITARA 800MHZ 491NFBGA
1689 Pcs New Original In Stock
ARM® Cortex®-A9 Microprocessor IC Sitara™ 1 Core, 32-Bit 800MHz 491-NFBGA (17x17)
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5.0 / 5.0
- (214 Ratings)
AM4377BZDNA80
Product Overview
1417173
DiGi Electronics Part Number
AM4377BZDNA80-DGManufacturer
Texas Instruments
AM4377BZDNA80
Description
IC MPU SITARA 800MHZ 491NFBGAInventory
1689 Pcs New Original In Stock
ARM® Cortex®-A9 Microprocessor IC Sitara™ 1 Core, 32-Bit 800MHz 491-NFBGA (17x17)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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AM4377BZDNA80 Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
Sitara™
Product Status
Active
Core Processor
ARM® Cortex®-A9
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
800MHz
Co-Processors/DSP
Multimedia; NEON™ SIMD
RAM Controllers
LPDDR2, DDR3, DDR3L
Graphics Acceleration
No
Display & Interface Controllers
TSC, WXGA
Ethernet
10/100/1000Mbps (2)
SATA
-
USB
USB 2.0 + PHY (2)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
Crypto Accelerator
Mounting Type
Surface Mount
Package / Case
491-LFBGA
Supplier Device Package
491-NFBGA (17x17)
Additional Interfaces
CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART
Base Product Number
AM4377
Datasheet & Documents
Manuals
AM437x Tech Ref Manual
Manufacturer Product Page
AM4377BZDNA80 Specifications
HTML Datasheet
AM4377BZDNA80-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
AM4377BZDNA80-DG
296-42754
-296-42754-DG
Standard Package
90
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
急ぎの注文にも関わらず、素早く対応していただき、感謝しています。
de desembre 02, 2025
DiGi Electronics maintains a high standard of service and product reliability.
de desembre 02, 2025
Their inventory management system allows for real-time updates, enhancing reliability.
de desembre 02, 2025
I highly recommend DiGi Electronics for their transparent pricing and consistently high-quality products.
de desembre 02, 2025
Their packaging is thorough, preventing any damage during transit.
de desembre 02, 2025
Their low prices enable me to upgrade my gadgets frequently, and the fast delivery supports my needs.
de desembre 02, 2025
Their rapid response to support inquiries gives me confidence in their service quality.
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Frequently Asked Questions (FAQ)
Can the AM4377BZDNA80 be safely used in an industrial motor control system operating at 95°C ambient temperature, and what thermal design considerations are critical to avoid junction temperature overshoot?
While the AM4377BZDNA80 has a maximum junction temperature (TJ) of 105°C, operating at 95°C ambient leaves only a 10°C margin, which is insufficient for reliable long-term operation under load. You must implement active or passive cooling (e.g., heatsink with airflow) and conduct thermal modeling using TI’s thermal resistance (θJA) values from the datasheet. Consider derating CPU frequency or enabling dynamic voltage and frequency scaling (DVFS) to reduce power dissipation. Without proper thermal management, sustained operation near TJ max can lead to accelerated electromigration and premature failure.
What are the key risks when replacing the AM4377BZDNA80 with the NXP i.MX6Solo (MCIMX6S7CVM08AB) in an existing Sitara-based design, especially regarding memory interface compatibility and boot configuration?
Replacing the AM4377BZDNA80 with the i.MX6Solo introduces significant integration risks: the i.MX6Solo uses a different DDR3/LPDDR2 controller timing architecture and requires distinct power-up sequencing, which may conflict with your existing PMIC design. Additionally, the boot ROM configuration (e.g., QSPI vs. SD) and GPIO strapping requirements differ substantially. The AM4377BZDNA80 supports dual Gigabit Ethernet with hardware timestamping—features not identically implemented on the i.MX6Solo—potentially breaking time-sensitive networking applications. A full hardware and software validation cycle is essential before qualification.
How should I handle signal integrity and PCB layout for the 491-NFBGA package of the AM4377BZDNA80, particularly for high-speed interfaces like DDR3 and Gigabit Ethernet, to avoid EMI and timing failures?
The 491-NFBGA package of the AM4377BZDNA80 demands strict adherence to high-speed design rules: use impedance-controlled routing (50Ω single-ended, 100Ω differential) for DDR3 and Ethernet traces, minimize via stubs, and implement solid reference planes beneath signal layers. For DDR3, length-match data, address, and control lines within ±5 mils and route them as tightly coupled groups. Place decoupling capacitors as close as possible to power balls—TI recommends a distributed 0.1µF + 10µF per power rail. Failure to follow these guidelines can result in setup/hold violations, reduced MTBF, or radiated emissions exceeding FCC/CE limits.
Is the AM4377BZDNA80 suitable for functional safety applications requiring ISO 13849 PLc or IEC 61508 SIL2 compliance, and what architectural limitations should I be aware of?
The AM4377BZDNA80 is not certified for functional safety standards like ISO 13849 or IEC 61508 and lacks built-in hardware safety mechanisms such as lockstep cores, ECC on all critical memories, or diagnostic peripherals required for SIL2/PLc. While you can implement software-based monitoring and external watchdog circuits, the absence of systematic capability (per IEC 61508-2) means you cannot claim compliance solely based on this device. For safety-critical designs, consider TI’s Hercules™ or Sitara™ AM6x families with integrated safety features instead.
What are the long-term reliability implications of using the AM4377BZDNA80 in a high-vibration automotive environment, and how does its MSL 3 rating affect manufacturing and field performance?
The AM4377BZDNA80’s 491-NFBGA package is susceptible to solder joint fatigue under continuous vibration, especially in under-hood automotive applications. Although it meets AEC-Q100 Grade 2 (-40°C to +105°C), mechanical reinforcement (e.g., underfill) is strongly recommended. Its MSL 3 rating (168 hours floor life) requires strict moisture control during assembly—exposure beyond this window without proper baking (per J-STD-033) risks popcorning during reflow. For mission-critical automotive systems, conduct HALT (Highly Accelerated Life Testing) to validate robustness, and consider conformal coating to mitigate humidity and contaminant-induced corrosion over time.
Quality Assurance (QC)
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AM4377BZDNA80 CAD Models
Texas Instruments AM4377BZDNA80 PCB symbols & footprints
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