AM3703CUSD100 >
AM3703CUSD100
Texas Instruments
IC MPU SITARA 1.0GHZ 423FCBGA
2252 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 1.0GHz 423-FCBGA (16x16)
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AM3703CUSD100 Texas Instruments
5.0 / 5.0 - (39 Ratings)

AM3703CUSD100

Product Overview

1252444

DiGi Electronics Part Number

AM3703CUSD100-DG

Manufacturer

Texas Instruments
AM3703CUSD100

Description

IC MPU SITARA 1.0GHZ 423FCBGA

Inventory

2252 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 1.0GHz 423-FCBGA (16x16)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 98.1960 98.1960
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AM3703CUSD100 Technical Specifications

Category Embedded, Microprocessors

Manufacturer Texas Instruments

Packaging -

Series Sitara™

Product Status Active

Core Processor ARM® Cortex®-A8

Number of Cores/Bus Width 1 Core, 32-Bit

Speed 1.0GHz

Co-Processors/DSP Multimedia; NEON™ SIMD

RAM Controllers SDRAM

Graphics Acceleration No

Display & Interface Controllers LCD

Ethernet -

SATA -

USB USB 2.0 (4)

Voltage - I/O 1.8V

Operating Temperature -40°C ~ 90°C (TJ)

Security Features -

Mounting Type Surface Mount

Package / Case 423-LFBGA, FCBGA

Supplier Device Package 423-FCBGA (16x16)

Additional Interfaces HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Base Product Number AM3703

Datasheet & Documents

Manufacturer Product Page

AM3703CUSD100 Specifications

HTML Datasheet

AM3703CUSD100-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001

Additional Information

Other Names
-296-42741-DG
296-42741
AM3703CUSD100-DG
TEXTISAM3703CUSD100
2156-AM3703CUSD100
Standard Package
90

Reviews

5.0/5.0-(Show up to 5 Ratings)
눈***살
de desembre 02, 2025
5.0
Di Digi Electronics는 경쟁력 있는 가격과 효율적인 물류 서비스로 믿을 수 있는 곳입니다.
Natu***ktar
de desembre 02, 2025
5.0
Ich schätze die prompte Kommunikation nach dem Kauf, die mein Vertrauen in DiGi Electronics gestärkt hat.
Peac***lMoon
de desembre 02, 2025
5.0
The company’s large and well-maintained stock levels help us meet tight deadlines.
Silve***nings
de desembre 02, 2025
5.0
Always receives my orders on schedule with secure packaging.
Wil***irit
de desembre 02, 2025
5.0
Delivery was timely, and I was kept updated every step of the way.
CherryB***somPixie
de desembre 02, 2025
5.0
We highly appreciate the proactive support from Di Digi Electronics after purchases.
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de desembre 02, 2025
5.0
I enjoyed the minimalistic design, which made browsing a pleasant experience.
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Frequently Asked Questions (FAQ)

Can the AM3703CUSD100 replace an older AM3517 in an industrial HMI design without requiring major firmware or PCB layout changes?

The AM3703CUSD100 is not a drop-in replacement for the AM3517 due to differences in package (423-FCBGA vs. 324-FCBGA), I/O voltage levels, and peripheral pin multiplexing. While both are ARM Cortex-A8-based Sitara MPUs, the AM3703CUSD100 supports 1.8V I/O and includes additional interfaces like McSPI and enhanced MMC/SD/SDIO, which may require PCB rerouting and power domain adjustments. Firmware will also need updates to handle clocking, DDR memory controller configuration, and GPIO mapping. A full pinout and power integrity review is recommended before substitution to avoid signal integrity or boot failure risks.

What are the critical thermal design considerations when using the AM3703CUSD100 in a sealed enclosure operating at 85°C ambient temperature?

At 85°C ambient, the AM3703CUSD100’s junction temperature can approach or exceed its 90°C limit under load, risking thermal throttling or long-term reliability degradation. Since it lacks integrated thermal diodes, external thermal monitoring is essential. Use a heatsink or thermal via array under the 423-FCBGA package, ensure adequate airflow or conduction paths, and derate CPU frequency if sustained workloads exceed 700 MHz. TI’s thermal modeling tools (e.g., WebTHERM) should be used early in layout to validate θJA under real-world conditions and prevent field failures due to overheating.

How does the AM3703CUSD100 compare to the NXP i.MX6Solo (MCIMX6S7CVM08AB) for cost-sensitive, low-power industrial control applications?

The AM3703CUSD100 offers lower BOM cost and simpler power management than the i.MX6Solo, but lacks key features like dual-display support, hardware video encoding, and industrial temperature grading beyond 90°C. The i.MX6Solo (MCIMX6S7CVM08AB) supports -40°C to 105°C and includes EPD controller and advanced power gating, making it better suited for always-on systems. If your application requires only basic LCD output, USB 2.0, and moderate processing, the AM3703CUSD100 is viable—but for extended temp ranges or lower sleep currents, the i.MX6Solo reduces long-term risk despite higher unit cost.

What are the risks of using the internal RAM controller of the AM3703CUSD100 with low-cost commercial-grade DDR2 memory in an automotive-grade prototype?

Using commercial DDR2 with the AM3703CUSD100 in an automotive environment introduces reliability risks due to mismatched temperature specs—the MPU supports up to 90°C junction, but automotive under-hood temps can exceed this. Commercial DDR2 typically operates only to 85°C, risking data corruption during thermal cycling. Additionally, the AM3703CUSD100’s DDR controller requires precise trace-length matching and impedance control; low-cost memory modules may lack consistent timing margins. For automotive prototypes, use automotive-qualified DDR2 (e.g., Micron MT47H64M16HR-3:L) and validate signal integrity with eye diagrams to prevent intermittent crashes.

Can the AM3703CUSD100’s NEON SIMD unit be reliably used for real-time sensor fusion in a drone navigation system without floating-point hardware?

Yes, but with caveats. The AM3703CUSD100 includes a VFPv3-D16 FPU and NEON SIMD, enabling efficient fixed-point and single-precision floating-point operations for sensor fusion algorithms. However, deterministic real-time performance is not guaranteed due to cache contention and lack of a memory protection unit (MPU). For drone navigation, isolate time-critical tasks in tightly coupled memory (if available) or use a real-time OS with careful scheduling. Benchmark latency under worst-case cache pressure—delays in IMU data processing could destabilize flight control. Consider pairing with a dedicated Cortex-M4 co-processor for hard real-time tasks to mitigate risk.

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