AM3517AZERA >
AM3517AZERA
Texas Instruments
IC MPU SITARA 600MHZ 484BGA
1416 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 484-BGA (23x23)
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AM3517AZERA Texas Instruments
5.0 / 5.0 - (178 Ratings)

AM3517AZERA

Product Overview

1401824

DiGi Electronics Part Number

AM3517AZERA-DG

Manufacturer

Texas Instruments
AM3517AZERA

Description

IC MPU SITARA 600MHZ 484BGA

Inventory

1416 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 484-BGA (23x23)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 131.1310 131.1310
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AM3517AZERA Technical Specifications

Category Embedded, Microprocessors

Manufacturer Texas Instruments

Packaging -

Series Sitara™

Product Status Active

Core Processor ARM® Cortex®-A8

Number of Cores/Bus Width 1 Core, 32-Bit

Speed 600MHz

Co-Processors/DSP Multimedia; NEON™ SIMD

RAM Controllers LPDDR, DDR2

Graphics Acceleration Yes

Display & Interface Controllers LCD

Ethernet 10/100Mbps (1)

SATA -

USB USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O 1.8V, 3.3V

Operating Temperature -40°C ~ 105°C (TJ)

Security Features -

Mounting Type Surface Mount

Package / Case 484-BBGA Exposed Pad

Supplier Device Package 484-BGA (23x23)

Additional Interfaces CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Base Product Number AM3517

Datasheet & Documents

Manufacturer Product Page

AM3517AZERA Specifications

HTML Datasheet

AM3517AZERA-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Additional Information

Other Names
296-42737
-296-42737-DG
TEXTISAM3517AZERA
AM3517AZERA-DG
2156-AM3517AZERA
Standard Package
60

Reviews

5.0/5.0-(Show up to 5 Ratings)
開***刻
de desembre 02, 2025
5.0
公司出貨非常準時,從未因物流問題而延誤,效率值得肯定。
みず***物語
de desembre 02, 2025
5.0
アフターサービスがとても良く、問題があった際も迅速に解決してくれました。
星***使
de desembre 02, 2025
5.0
品質の高さと配送の速さにおいて、他社と比べて突出しています。
Cle***kies
de desembre 02, 2025
5.0
The robustness of DiGi Electronics’ devices is evident—I’ve dropped mine multiple times, and it still works perfectly.
Crys***Light
de desembre 02, 2025
5.0
The broad spectrum of products indicates flexibility and innovation in their offerings.
BoldA***nturer
de desembre 02, 2025
5.0
After my purchase, I received prompt assistance, which was very reassuring.
ClearS***sAhead
de desembre 02, 2025
5.0
The staff at DiGi Electronics are incredibly welcoming and eager to assist.
Celest***Voyage
de desembre 02, 2025
5.0
Shopping is a breeze thanks to their open pricing policy and reliable product standards.
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Frequently Asked Questions (FAQ)

When designing a rugged industrial control system, how does the AM3517AZERA’s thermal performance at 105°C junction temperature impact long-term reliability, and what PCB layout strategies should I use to avoid premature failure?

The AM3517AZERA is rated for a maximum junction temperature of 105°C, but sustained operation near this limit significantly accelerates electromigration and reduces mean time between failures (MTBF). To mitigate risk, implement a robust thermal design: use a 4-layer or higher PCB with internal ground/power planes, place thermal vias under the exposed pad (EP), and ensure adequate airflow or heatsinking. Monitor case temperature with an onboard sensor and derate clock speed if necessary—keeping TJ below 90°C improves long-term reliability in harsh environments.

Can I replace the AM3517AZERA with the AM3359 in an existing design that uses DDR2 memory and USB 2.0 peripherals without major firmware changes?

While the AM3359 (also from TI’s Sitara family) shares some peripherals like USB 2.0 and DDR2 support, it uses a different ARM Cortex-A8 implementation with distinct memory map, power sequencing, and clocking architecture. Direct drop-in replacement of the AM3517AZERA is not recommended without validating boot configuration, DDR2 timing parameters, and peripheral register compatibility. Additionally, the AM3359 lacks the AM3517AZERA’s integrated graphics accelerator and LCD controller, which may require hardware redesign if your application relies on display output.

What are the critical signal integrity risks when routing the 484-BGA package of the AM3517AZERA on a cost-optimized 4-layer PCB, especially for DDR2 and high-speed USB interfaces?

Routing the AM3517AZERA’s 484-BGA on a 4-layer board introduces significant signal integrity challenges due to tight pitch (0.8 mm) and high-speed interfaces like DDR2 and USB 2.0. Key risks include impedance mismatch, crosstalk, and insufficient return paths. Mitigate these by using controlled-impedance routing (50Ω single-ended, 100Ω differential for USB), minimizing via stubs, assigning solid ground planes adjacent to signal layers, and length-matching DDR2 data/address lines within ±50 mils. Avoid splitting reference planes under high-speed traces—this can cause EMI and timing violations that lead to intermittent failures.

How does the AM3517AZERA’s MSL 3 rating affect my assembly process, and what steps must I take to prevent moisture-related defects during reflow?

The AM3517AZERA has a Moisture Sensitivity Level (MSL) of 3, meaning it can be exposed to ambient conditions for up to 168 hours before requiring dry packing. If stored beyond this window or in humid environments (>60% RH), the device is at high risk of popcorning during reflow. To prevent this, bake the components at 125°C for 24 hours if exposure exceeds 168 hours, and always follow JEDEC J-STD-033 guidelines. Use nitrogen-assisted reflow profiling and ensure your SMT line maintains strict humidity control (<10% RH) during assembly to avoid delamination or internal cracking.

In a medical device application requiring long-term supply stability, how does the AM3517AZERA compare to newer alternatives like the AM62x series, and what lifecycle risks should I consider before committing to a design-in?

Although the AM3517AZERA is currently marked as 'Active,' it is based on an older ARM Cortex-A8 architecture and lacks the extended lifecycle commitments typical of medical-grade components. In contrast, TI’s AM62x series offers pin-compatible upgrades, longer product longevity (15+ years), enhanced security, and lower power consumption. Designing in the AM3517AZERA today carries obsolescence risk within 5–7 years, potentially forcing costly re-certification. If your medical device requires regulatory recertification with any BOM change, consider migrating to the AM623 or AM625 early—even if it means a moderate upfront cost increase—to avoid mid-lifecycle redesigns and ensure supply continuity.

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