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AM3517AZCNA
Texas Instruments
IC MPU SITARA 600MHZ 491NFBGA
1546 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 491-NFBGA (17x17)
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5.0 / 5.0
- (121 Ratings)
AM3517AZCNA
Product Overview
1425913
DiGi Electronics Part Number
AM3517AZCNA-DGManufacturer
Texas Instruments
AM3517AZCNA
Description
IC MPU SITARA 600MHZ 491NFBGAInventory
1546 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 491-NFBGA (17x17)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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AM3517AZCNA Technical Specifications
Category
Embedded, Microprocessors
Packaging
Tray
Series
Sitara™
Product Status
Active
Core Processor
ARM® Cortex®-A8
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
600MHz
Co-Processors/DSP
Multimedia; NEON™ SIMD
RAM Controllers
LPDDR, DDR2
Graphics Acceleration
Yes
Display & Interface Controllers
LCD
Ethernet
10/100Mbps (1)
SATA
-
USB
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
-
Mounting Type
Surface Mount
Package / Case
491-LFBGA
Supplier Device Package
491-NFBGA (17x17)
Additional Interfaces
CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
Base Product Number
AM3517
Datasheet & Documents
Manufacturer Product Page
AM3517AZCNA Specifications
HTML Datasheet
AM3517AZCNA-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A002A1 TI
HTSUS
8542.31.0001
Additional Information
Other Names
-296-36028-DG
296-36028
AM3517AZCNA-DG
Standard Package
90
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
DiGi的售後服務真是無可挑剔，讓我用得很放心，價格也非常實惠。
de desembre 02, 2025
Their technical support helped customize solutions for my specific application, showing genuine care.
de desembre 02, 2025
Their reliability gives me peace of mind in my daily operations.
de desembre 02, 2025
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Frequently Asked Questions (FAQ)
Can the AM3517AZCNA be safely used as a drop-in replacement for the AM3358BZCEA in an existing industrial control design, and what are the key integration risks?
While both the AM3517AZCNA and AM3358BZCEA are Sitara™ ARM Cortex-A8-based MPUs from Texas Instruments, they are not direct drop-in replacements due to significant architectural and I/O differences. The AM3517AZCNA integrates a 3D graphics accelerator and supports DDR2/LPDDR memory, whereas the AM3358BZCEA uses PRU-ICSS for real-time control and supports only DDR3L. Additionally, the AM3517AZCNA’s 491-NFBGA package has a different pinout and power sequencing requirements. Replacing one with the other would require PCB layout changes, updated boot configuration, and potential firmware modifications to handle peripheral mapping differences—especially for USB, display, and memory interfaces. Always validate power rail compatibility and thermal performance under load before committing to a redesign.
What are the critical thermal design considerations when using the AM3517AZCNA in a sealed industrial enclosure operating at 85°C ambient temperature?
The AM3517AZCNA has a maximum junction temperature (TJ) of 105°C, so operating in an 85°C ambient environment leaves only a 20°C margin for self-heating—a tight constraint under full CPU and graphics load. Without proper thermal management, sustained operation can trigger thermal throttling or reduce long-term reliability. You must implement a low-thermal-resistance PCB design with adequate copper pour, thermal vias under the 491-NFBGA package, and consider a small heatsink or thermal interface material if airflow is restricted. TI’s thermal modeling tools (e.g., WebTHERM) should be used to simulate worst-case power dissipation, especially when enabling the NEON™ SIMD unit and LCD controller simultaneously.
How does the AM3517AZCNA compare to the NXP i.MX6Solo (MCIMX6S7CVM08AB) for cost-sensitive HMI applications requiring 24/7 operation and OpenGL ES 2.0 support?
The AM3517AZCNA offers integrated 3D graphics acceleration and lower BOM cost for basic HMI designs, but the NXP i.MX6Solo (MCIMX6S7CVM08AB) provides superior long-term reliability features such as ECC memory support, wider industrial temperature validation, and more robust power management for 24/7 operation. While both support OpenGL ES 2.0, the i.MX6Solo delivers better GPU performance and lower dynamic power under load. If your application demands high MTBF and error-resilient operation—such as medical or transportation HMIs—the i.MX6Solo is a safer choice despite its higher unit cost. However, for moderate-duty HMIs where cost dominates, the AM3517AZCNA can be viable with careful thermal and power design.
What are the risks of using the AM3517AZCNA’s USB 2.0 interfaces in a multi-device industrial network, and how can signal integrity be ensured?
The AM3517AZCNA provides three USB 2.0 ports (one with integrated PHY), but driving multiple peripherals—especially high-speed devices like cameras or storage—can strain the shared bandwidth and introduce signal integrity issues due to impedance mismatches or long PCB traces. In industrial environments with EMI, inadequate termination or lack of ESD protection can lead to enumeration failures or data corruption. To mitigate risk, route USB differential pairs with controlled impedance (90Ω ±10%), keep traces short (<10 cm), use shielded connectors, and add TVS diodes near connectors. Avoid daisy-chaining multiple high-bandwidth devices; instead, use an external USB hub with individual port power management for reliable operation.
Is it safe to operate the AM3517AZCNA at its maximum 600MHz frequency continuously in a high-vibration automotive-like environment, and what reliability factors should be considered?
Continuous operation at 600MHz pushes the AM3517AZCNA near its thermal and electrical limits, and in high-vibration environments—such as automotive or heavy machinery—this increases the risk of solder joint fatigue in the 491-NFBGA package over time. The MSL 3 rating (168 hours floor life) also demands strict handling to avoid moisture-induced cracking during reflow. While the device is rated for -40°C to 105°C junction temperature, vibration can exacerbate microcracks in BGA solder balls, especially if the PCB lacks stiffeners or conformal coating. For mission-critical applications, consider derating the CPU frequency to 500MHz to reduce heat output, implement underfill for the BGA, and conduct HALT (Highly Accelerated Life Testing) to validate long-term mechanical reliability.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
AM3517AZCNA CAD Models
Texas Instruments AM3517AZCNA PCB symbols & footprints
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