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AM3505AZCNA
Texas Instruments
IC MPU SITARA 600MHZ 491NFBGA
1820 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 491-NFBGA (17x17)
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5.0 / 5.0
- (229 Ratings)
AM3505AZCNA
Product Overview
1445817
DiGi Electronics Part Number
AM3505AZCNA-DGManufacturer
Texas Instruments
AM3505AZCNA
Description
IC MPU SITARA 600MHZ 491NFBGAInventory
1820 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 491-NFBGA (17x17)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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AM3505AZCNA Technical Specifications
Category
Embedded, Microprocessors
Packaging
Tray
Series
Sitara™
Product Status
Active
Core Processor
ARM® Cortex®-A8
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
600MHz
Co-Processors/DSP
Multimedia; NEON™ SIMD
RAM Controllers
LPDDR, DDR2
Graphics Acceleration
No
Display & Interface Controllers
LCD
Ethernet
10/100Mbps (1)
SATA
-
USB
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
-
Mounting Type
Surface Mount
Package / Case
491-LFBGA
Supplier Device Package
491-NFBGA (17x17)
Additional Interfaces
CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
Base Product Number
AM3505
Datasheet & Documents
Manufacturer Product Page
AM3505AZCNA Specifications
HTML Datasheet
AM3505AZCNA-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
296-28122
-296-28122-DG
Standard Package
90
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
網站的客服系統整合良好，問題解決速度快，讓我感受到他們的專業與熱情。
de desembre 02, 2025
包裝結實，配送過程中沒有出現任何損壞，非常滿意。
de desembre 02, 2025
我很高興在這裡購物，商品的質量穩定，價格清楚透明，服務一流。
de desembre 02, 2025
每次購買都讓我感受到DiGi Electronics的用心，他們的產品品質絕對值得肯定！
de desembre 02, 2025
DiGi Electronicsさんの製品は丈夫で長持ち、安心して使用できます。カスタマーサービスも素晴らしいです。
de desembre 02, 2025
物流のシステムがしっかりしており、安心して任せられます。
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Frequently Asked Questions (FAQ)
What are the key thermal and PCB layout risks when designing a compact system around the AM3505AZCNA, and how can I mitigate them to avoid overheating or signal integrity issues?
The AM3505AZCNA operates up to 105°C junction temperature and is housed in a 491-NFBGA (17x17mm) package with high pin density, making thermal management and PCB routing critical. A major risk is localized heating due to poor via stitching under the package or inadequate copper pour, which can lead to thermal throttling or long-term reliability degradation. To mitigate this, use a 4–6 layer PCB with solid ground planes, thermal vias (0.3mm diameter, spaced 1mm apart) directly under the BGA, and a 2 oz copper pour on top and bottom layers. Ensure high-speed signals like DDR2 and USB 2.0 are length-matched and impedance-controlled (50Ω single-ended, 100Ω differential). Avoid routing sensitive analog traces (e.g., power supply feedback) near high-frequency digital lines to prevent noise coupling. Thermal simulation using tools like Ansys Icepak is recommended during layout to validate heat dissipation before fabrication.
Can I replace the AM3505AZCNA with a more modern processor like the AM3358 or AM437x in an existing design without major hardware changes, and what are the trade-offs?
Direct replacement of the AM3505AZCNA with the AM3358 (e.g., AM3358BZCEA) or AM437x is not drop-in compatible due to differences in package (AM3505 uses 491-NFBGA vs. AM3358’s 324-NFBGA), pinout, and power sequencing requirements. While the AM3358 offers a faster Cortex-A8 at 1GHz, PRU-ICSS, and DDR3 support, it lacks the AM3505’s integrated USB 2.0 + PHY, requiring external transceivers. Migrating would necessitate a new PCB layout, updated power management (different core voltage requirements), and potential firmware changes for clocking and peripheral drivers. However, if your design relies on the AM3505’s specific I/O mix (e.g., three USB 2.0 ports with one integrated PHY), the AM3358 may require additional components, increasing BOM cost and board complexity. Evaluate whether the performance gain justifies the redesign effort—often, staying with the AM3505AZCNA is more cost-effective for legacy or low-complexity systems.
What are the real-world limitations of using the AM3505AZCNA’s integrated USB 2.0 + PHY interface in industrial environments with long cable runs or EMI exposure?
The AM3505AZCNA includes one USB 2.0 port with an integrated PHY, which simplifies design but introduces reliability risks in industrial settings. The internal PHY is optimized for short PCB traces (typically <15cm) and may struggle with signal integrity over longer cables (>1m), especially in electrically noisy environments. Without proper shielding, termination, or common-mode filtering, you risk data corruption, enumeration failures, or ESD damage. To ensure robustness, add a USB ESD protection diode (e.g., TPIC3USB302) near the connector, use shielded twisted-pair cables, and implement a common-mode choke. Avoid daisy-chaining USB hubs without signal conditioning. For mission-critical applications, consider using an external USB 2.0 PHY with better drive strength and noise immunity, even though it increases component count. Always perform conducted and radiated immunity testing per IEC 61000-4 standards to validate performance under real EMI conditions.
How does the AM3505AZCNA’s memory subsystem (DDR2/LPDDR) constrain system design, and what are the risks of using low-cost or non-automotive-grade memory components?
The AM3505AZCNA supports DDR2 and LPDDR controllers, but its memory interface is sensitive to timing, loading, and signal integrity—especially at 600MHz operation. A common risk is using consumer-grade DDR2 chips with looser timing tolerances or higher capacitance, which can cause boot failures, data corruption, or intermittent crashes under temperature swings. Automotive or industrial-grade memory (e.g., Micron MT47H64M16HR-3E IT) is recommended for designs operating near the -40°C to 105°C range. Additionally, the 32-bit bus requires careful length matching (±50ps skew) and impedance control to prevent reflections. Using memory modules instead of discrete chips increases parasitic inductance and complicates routing. Always validate memory stability with margin testing (e.g., MemTest86+) across the full temperature range and consider adding ECC if data integrity is critical. Poor memory choice is a leading cause of field returns in embedded systems based on the AM3505AZCNA.
What reliability concerns should I address when deploying the AM3505AZCNA in high-vibration or extended-temperature industrial applications, and how does MSL 3 impact manufacturing?
The AM3505AZCNA is rated for -40°C to 105°C junction temperature and is suitable for industrial environments, but mechanical and moisture-related risks must be managed. Its 491-NFBGA package is susceptible to solder joint fatigue under prolonged vibration or thermal cycling, potentially leading to intermittent connections. Use underfill epoxy around the BGA to enhance mechanical stability and conduct HALT (Highly Accelerated Life Testing) to identify weak points. Additionally, the device has Moisture Sensitivity Level (MSL) 3, meaning it can be exposed to ambient conditions for only 168 hours before baking is required. If trays are left unsealed or exposed to humidity >60% RH, moisture absorption can cause 'popcorning' during reflow. Always follow IPC/JEDEC J-STD-033 guidelines: store in dry cabinets (<5% RH), and bake at 125°C for 24 hours if exposure exceeds 168 hours. Implementing these measures prevents costly field failures and ensures long-term reliability in harsh environments.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
AM3505AZCNA CAD Models
Texas Instruments AM3505AZCNA PCB symbols & footprints
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