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AM3358ZCZD72
Texas Instruments
IC MPU SITARA 720MHZ 324NFBGA
2080 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 720MHz 324-NFBGA (15x15)
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5.0 / 5.0
- (256 Ratings)
AM3358ZCZD72
Product Overview
1421868
DiGi Electronics Part Number
AM3358ZCZD72-DGManufacturer
Texas Instruments
AM3358ZCZD72
Description
IC MPU SITARA 720MHZ 324NFBGAInventory
2080 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 720MHz 324-NFBGA (15x15)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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365 - Day Quality Guarantee - Every part fully backed.
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AM3358ZCZD72 Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
Sitara™
Product Status
Obsolete
Core Processor
ARM® Cortex®-A8
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
720MHz
Co-Processors/DSP
Multimedia; NEON™ SIMD
RAM Controllers
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration
Yes
Display & Interface Controllers
LCD, Touchscreen
Ethernet
10/100/1000Mbps (2)
SATA
-
USB
USB 2.0 + PHY (2)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 90°C (TJ)
Security Features
Cryptography, Random Number Generator
Mounting Type
Surface Mount
Package / Case
324-LFBGA
Supplier Device Package
324-NFBGA (15x15)
Additional Interfaces
CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
Base Product Number
AM3358
Datasheet & Documents
HTML Datasheet
AM3358ZCZD72-DG
Environmental & Export Classification
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-30466
Standard Package
126
Alternative Parts
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MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
素早い発送と安全な梱包に感動しました。信頼できるショップです。
de desembre 02, 2025
Their prices are very competitive, making it easy to choose DiGi Electronics.
de desembre 02, 2025
The craftsmanship and attention to detail in DiGi Electronics’ offerings are outstanding.
de desembre 02, 2025
Their support staff demonstrates genuine care and expertise.
de desembre 02, 2025
DiGi Electronics offers unbeatable prices without compromising on quality. Highly recommended!
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing AM3358ZCZD72 with AM3358BZCZA80 in an existing industrial control system, and how do clock speed and thermal performance differ in real-world deployment?
Replacing AM3358ZCZD72 (720MHz) with AM3358BZCZA80 (800MHz) introduces subtle but critical risks: the higher clock speed increases power dissipation and junction temperature, which may exceed thermal limits in tightly enclosed designs without adequate airflow or heatsinking. While both share the same 324-NFBGA package and pinout, the AM3358BZCZA80’s increased dynamic power can push TJ beyond 90°C under sustained load—especially problematic in -40°C to 90°C operating environments. Additionally, DDR memory timing margins tighten at 800MHz, requiring re-validation of DDR3/DDR3L signal integrity and possible PCB layout adjustments. Always re-run thermal simulations and validate boot stability under worst-case I/O loading before full production transition.
Can the AM3358ZCZD72 be safely used in a medical device requiring long-term supply assurance, given its obsolete status and non-RoHS compliance?
Using AM3358ZCZD72 in new medical device designs poses significant supply chain and regulatory risks. Its 'Obsolete' status means Texas Instruments no longer manufactures it, and remaining stock is finite—posing obsolescence risk within 2–5 years. Non-RoHS compliance may violate EU MDR or other regional regulations, complicating certification. For medical applications requiring 10+ year lifecycles, consider migrating to a supported alternative like AM3352BZCZD80 (RoHS-compliant, active status) or AM6442 for future-proofing. If redesign isn’t feasible, secure a lifetime buy and implement rigorous incoming inspection due to potential counterfeit risk in aftermarket channels.
How should I manage DDR3 signal integrity when designing with AM3358ZCZD72 in a compact 4-layer PCB, and what are the trade-offs compared to using DDR2?
Designing DDR3 interfaces with AM3358ZCZD72 on a 4-layer PCB demands strict impedance control (50Ω single-ended, 100Ω differential for DQS), length matching (±50mil tolerance), and careful via minimization to avoid stub effects. Unlike DDR2, DDR3 operates at lower voltages (1.5V vs 1.8V) and higher speeds, increasing sensitivity to crosstalk and power plane noise. On 4-layer boards, dedicate Layer 2 as a solid ground plane beneath the DDR traces on Layer 1, and avoid splitting the reference plane. Trade-offs include higher bandwidth and lower power vs. DDR2, but reduced noise margin and tighter layout constraints. Always perform post-layout SI simulation—especially for CLK, DQS, and ADDR/CMD lines—and consider using fly-by topology if routing more than two DRAM chips.
What integration challenges arise when using both Gigabit Ethernet ports on AM3358ZCZD72 simultaneously in an automotive telemetry unit operating at -40°C?
Simultaneously enabling both 10/100/1000Mbps Ethernet MACs on AM3358ZCZD72 in automotive environments introduces PHY synchronization, EMI, and thermal challenges. At -40°C, crystal oscillator drift can affect Ethernet PLL stability, risking link negotiation failures—use automotive-grade PHYs (e.g., TI DP83867CR) with extended temp support and ensure reference clock accuracy within ±50ppm. Concurrent traffic on both ports increases MPU load and DDR bandwidth contention, potentially starving real-time CAN or McASP streams. Additionally, simultaneous switching noise from dual RGMII interfaces can couple into analog sections; isolate PHY power supplies and use guard rings. Validate cold-start behavior and perform long-duration soak testing across the full temperature range to catch marginal timing issues.
Is it feasible to repurpose the AM3358ZCZD72’s NEON SIMD unit for real-time sensor fusion in a drone navigation system, and what performance bottlenecks should I anticipate?
Yes, the AM3358ZCZD72’s NEON SIMD unit can accelerate sensor fusion algorithms (e.g., Kalman filtering, IMU data processing), but performance is constrained by the single-core Cortex-A8 architecture and shared L2 cache. While NEON enables 4x32-bit parallel operations, memory bandwidth becomes the primary bottleneck—especially when streaming data from multiple MMC/SDIO or I2C sensors into DDR3. At 720MHz, sustained NEON throughput rarely exceeds 1.5–2 GOPS in practice due to cache misses and bus arbitration delays. Optimize by aligning data to 128-bit boundaries, minimizing heap allocation in ISRs, and using DMA for sensor data ingress. For latency-critical drone control, offload preprocessing to a co-processor (e.g., PRU-ICSS) and reserve NEON for batched, predictable workloads.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
AM3358ZCZD72 CAD Models
Texas Instruments AM3358ZCZD72 PCB symbols & footprints
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