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AM3351BZCEA60
Texas Instruments
IC MPU SITARA 600MHZ 298NFBGA
65914 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 298-NFBGA (13x13)
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5.0 / 5.0
- (428 Ratings)
AM3351BZCEA60
Product Overview
1238778
DiGi Electronics Part Number
AM3351BZCEA60-DGManufacturer
Texas Instruments
AM3351BZCEA60
Description
IC MPU SITARA 600MHZ 298NFBGAInventory
65914 Pcs New Original In Stock
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 298-NFBGA (13x13)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
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AM3351BZCEA60 Technical Specifications
Category
Embedded, Microprocessors
Packaging
Tray
Series
Sitara™
Product Status
Active
Core Processor
ARM® Cortex®-A8
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
600MHz
Co-Processors/DSP
Multimedia; NEON™ SIMD
RAM Controllers
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration
Yes
Display & Interface Controllers
LCD, Touchscreen
Ethernet
10/100/1000Mbps (1)
SATA
-
USB
USB 2.0 + PHY (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
Cryptography, Random Number Generator
Mounting Type
Surface Mount
Package / Case
298-LFBGA
Supplier Device Package
298-NFBGA (13x13)
Additional Interfaces
I2C, McASP, McSPI, MMC/SD/SDIO, UART
Base Product Number
AM3351
Datasheet & Documents
Manuals
AM335x, AMIC110 Ref Manual
HTML Datasheet
AM3351BZCEA60-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-44507
Standard Package
160
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
오래 쓸 수 있도록 견고하게 만들어졌고, 포장도 정성 들여 포장되어 왔어요.
de desembre 02, 2025
包裝材料用得很好，即使經過運送也能保持商品的完整與乾淨，令人印象深刻。
de desembre 02, 2025
I appreciate how straightforward their pricing is, making my planning easier.
de desembre 02, 2025
The staff was courteous and professional, making the whole experience pleasant.
de desembre 02, 2025
Their commitment to sustainable packaging and rapid logistics makes shopping there a pleasure.
de desembre 02, 2025
The after-sales support from DiGi Electronics is prompt and effective, which is critical for remote users.
de desembre 02, 2025
Exceptional build quality, and it arrived faster than expected.
de desembre 02, 2025
Their customer support team is always available and incredibly helpful after purchase.
de desembre 02, 2025
DiGi Electronics sets the bar high in quality, making my DIY experiences smoother.
de desembre 02, 2025
Transparent pricing and consistent product quality make this my go-to shopping choice.
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Frequently Asked Questions (FAQ)
What are the key thermal design considerations when integrating the AM3351BZCEA60 into a compact industrial control system?
When integrating the AM3351BZCEA60 into space-constrained industrial applications, managing junction temperature is critical due to its 105°C max TJ rating. Even though the device supports industrial temperature ranges, continuous operation at high ambient temperatures (above 85°C) without adequate PCB thermal vias or a heatsink can lead to throttling or reliability degradation. We recommend using at least 4-layer PCBs with internal ground planes and thermal vias under the exposed pad to dissipate heat effectively. Monitor power consumption of the DDR3L and USB peripherals, as these can significantly increase thermal load. Consider dynamic voltage and frequency scaling (DVFS) software policies to reduce power during low-activity cycles.
Can the AM3351BZCEA60 replace the AM3352B for cost-sensitive embedded designs without sacrificing interface compatibility?
Yes, the AM3351BZCEA60 can serve as a direct replacement for the AM3352B in cost-sensitive designs where Gigabit Ethernet and certain additional ADC channels in the AM3352B are not required. Both share the same ARM Cortex-A8 core, 600MHz speed, and 298-NFBGA package, ensuring pin-to-pin compatibility. However, the AM3351BZCEA60 lacks some of the AM3352B’s industrial interfaces like dual CAN and enhanced high-res ADC. Verify your BOM for Ethernet speed needs—AM3351BZCEA60 supports 10/100/1000Mbps, so Gigabit is retained, but missing CAN may require an external transceiver. Validate peripheral register mapping and device tree settings in Linux to avoid runtime mismatches.
How does the AM3351BZCEA60 handle DDR3L memory initialization in low-voltage industrial environments and what are the design-in risks?
The AM3351BZCEA60 integrates an LPDDR/DDR2/DDR3/DDR3L memory controller, but reliable DDR3L initialization at 1.35V in noisy or low-power industrial systems requires careful design. Key risks include improper termination, inadequate power rail stability, and signal integrity issues on long traces. Use TI’s Memory Interface Design Guide to set up controlled impedance for address/command and data lines (typically 50Ω single-ended, 100Ω differential), and ensure VDD_MPU and VDD_CORE supplies are low-noise with sufficient decoupling. Always validate the memory training phase in U-Boot and consider margin testing under temperature extremes to catch marginal timing setups early.
What are the reliability implications of using the AM3351BZCEA60 in automotive under-the-hood applications despite its industrial temperature rating?
Although the AM3351BZCEA60 supports -40°C to 105°C (TJ) and meets industrial standards, it is not qualified for automotive AEC-Q100, making it unsuitable for under-the-hood automotive use where extended reliability, shock/vibration tolerance, and long-term failure rate requirements are stricter. Even if temperature ranges appear adequate, the absence of automotive process controls and qualification testing presents significant field failure risks. For similar performance in automotive contexts, consider upgrading to TI’s AM335x automotive-grade variants like the AM3357B where available. If insisting on AM3351BZCEA60, add conformal coating, rigorous burn-in testing, and extended HALT during validation to mitigate risks.
How can I mitigate signal integrity risks when routing high-speed interfaces like LCD and USB 2.0 on an AM3351BZCEA60-based PCB?
To mitigate signal integrity risks on the AM3351BZCEA60, treat all high-speed signals—especially USB 2.0 differential pairs and LCD data/control lines—as controlled impedance traces. Maintain 90Ω differential impedance for USB with tight length matching (<50mil skew) and minimize vias. For LCD interfaces running at pixel clocks up to 50MHz, route data lines with matched trace lengths within 100 mils to prevent timing skew. Use series termination resistors near the AM3351BZCEA60 output if reflections are observed. Avoid routing sensitive signals under noisy components like DC-DC converters, and use ground shielding for critical signals. Perform post-layout simulation if possible, and verify eye diagrams during prototype testing.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
AM3351BZCEA60 CAD Models
Texas Instruments AM3351BZCEA60 PCB symbols & footprints
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