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AM26LV31ESDREP
Texas Instruments
IC DRIVER 4/0 16SOIC
6569 Pcs New Original In Stock
4/0 Driver RS422, RS485 16-SOIC
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5.0 / 5.0
- (434 Ratings)
AM26LV31ESDREP
Product Overview
1231265
DiGi Electronics Part Number
AM26LV31ESDREP-DGManufacturer
Texas Instruments
AM26LV31ESDREP
Description
IC DRIVER 4/0 16SOICInventory
6569 Pcs New Original In Stock
4/0 Driver RS422, RS485 16-SOIC
Quantity
Minimum 1
Minimum 1
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AM26LV31ESDREP Technical Specifications
Category
Interface, Drivers, Receivers, Transceivers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
Type
Driver
Protocol
RS422, RS485
Number of Drivers/Receivers
4/0
Duplex
-
Data Rate
-
Voltage - Supply
3V ~ 3.6V
Operating Temperature
-55°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
Supplier Device Package
16-SOIC
Base Product Number
AM26LV31
Datasheet & Documents
HTML Datasheet
AM26LV31ESDREP-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-23925-2
296-23925-6INACTIVE
296-23925-1
296-23925-6
296-23925-1-NDR
296-23925-2INACTIVE
-V62/09603-01XE-NDR
296-23925-1INACTIVE
296-23925-6-NDR
296-23925-2-NDR
-AM26LV31ESDREP-NDR
-296-23925-1-DG
-296-23925-1-NDR
-AM26LV31ESDREPINACTIVE
-V62/09603-01XE
Standard Package
2,500
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Sehr zufrieden mit der transparenten Logistik und dem professionellen Service.
de desembre 02, 2025
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de desembre 02, 2025
The inventory management at DiGi Electronics is impressive, with accurate stock levels and timely updates.
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Frequently Asked Questions (FAQ)
Can the AM26LV31ESDREP be safely used in a 5V-tolerant industrial RS485 network without damaging the device, and what protection circuitry is recommended?
The AM26LV31ESDREP is not 5V tolerant—its absolute maximum supply voltage is 3.6V. Applying 5V to its inputs or outputs can cause latch-up or permanent damage. If interfacing with 5V logic or legacy industrial buses, use a level-shifting buffer (e.g., SN74LVC8T245) on the logic side and ensure bus transients are clamped with TVS diodes (e.g., SMAJ5.0A). Always isolate the 3.3V supply domain from higher-voltage rails using proper PCB partitioning and consider galvanic isolation (e.g., ISO1500) for robust system-level protection in harsh environments.
What are the key reliability risks when replacing a legacy SN75174BD with the AM26LV31ESDREP in an existing 3.3V RS485 design, and how do I validate compatibility?
While both are quad RS485 drivers, the AM26LV31ESDREP has tighter output voltage swing specs and lower propagation delay, which may affect timing margins in long-daisy-chain topologies. The pinout differs significantly—verify footprint compatibility before layout reuse. Critically, the AM26LV31ESDREP lacks internal fail-safe biasing; add external pull-up/pull-down resistors (typically 1–10 kΩ) on the bus lines to prevent floating states during startup. Perform signal integrity simulations and conduct EMI/EMC pre-compliance testing, especially if the original design relied on the SN75174BD’s higher output impedance for damping.
How does the AM26LV31ESDREP perform under sustained short-circuit conditions on the RS485 bus, and what thermal management practices should I follow?
The AM26LV31ESDREP includes built-in current limiting and thermal shutdown, but sustained shorts can still cause junction temperatures to exceed safe limits—especially near the 105°C operating ceiling. In high-ambient-temperature applications (>85°C), derate output current and ensure adequate copper pour under the 16-SOIC package for heat dissipation. Avoid placing heat-generating components nearby. For mission-critical systems, implement external fault detection (e.g., monitoring bus current with a sense resistor and comparator) to disable the driver before thermal stress accumulates.
Is it safe to parallel two AM26LV31ESDREP drivers on the same RS485 bus segment to increase drive strength for long cable runs or high-capacitance loads?
No—paralleling AM26LV31ESDREP drivers is strongly discouraged. Even minor mismatches in propagation delay or output impedance can cause destructive shoot-through currents during state transitions, leading to premature failure. Instead, use a single driver with higher drive capability (e.g., THVD1550) or reduce load capacitance by segmenting the bus with repeaters. If extended reach is needed, opt for lower data rates and proper termination (120 Ω at both ends) rather than increasing drive strength, as this preserves signal integrity and avoids violating RS485 standard load limits.
What design considerations are critical when using the AM26LV31ESDREP in a battery-powered IoT node that must wake from sleep and transmit data within 1 ms?
The AM26LV31ESDREP’s enable time from shutdown is fast (<1 µs typical), but total system latency depends on MCU wake-up, regulator stabilization, and driver biasing. Ensure your 3.3V LDO can source peak current quickly (e.g., TPS7A02) and minimize decoupling capacitor ESR to avoid voltage droop. Since the device has no integrated bias network, pre-charge the bus lines via weak pull resistors during wake-up to avoid glitches. Also, verify that the MCU’s GPIO slew rate control doesn’t conflict with the driver’s edge rates—excessive ringing can trigger false receptions. Test worst-case cold-start scenarios at -40°C, where capacitor behavior and semiconductor response degrade significantly.
Quality Assurance (QC)
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AM26LV31ESDREP CAD Models
Texas Instruments AM26LV31ESDREP PCB symbols & footprints
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