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AM26LV31EIRGYR
Texas Instruments
IC DRIVER 4/0 16VQFN
2226 Pcs New Original In Stock
4/0 Driver RS422, RS485 16-VQFN (4x3.5)
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*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (479 Ratings)
AM26LV31EIRGYR
Product Overview
1233701
DiGi Electronics Part Number
AM26LV31EIRGYR-DGManufacturer
Texas Instruments
AM26LV31EIRGYR
Description
IC DRIVER 4/0 16VQFNInventory
2226 Pcs New Original In Stock
4/0 Driver RS422, RS485 16-VQFN (4x3.5)
Quantity
Minimum 1
Minimum 1
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AM26LV31EIRGYR Technical Specifications
Category
Interface, Drivers, Receivers, Transceivers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
Type
Driver
Protocol
RS422, RS485
Number of Drivers/Receivers
4/0
Duplex
-
Data Rate
-
Voltage - Supply
3V ~ 3.6V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-VFQFN Exposed Pad
Supplier Device Package
16-VQFN (4x3.5)
Base Product Number
AM26LV31
Datasheet & Documents
HTML Datasheet
AM26LV31EIRGYR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-24693-1
296-24693-2
-AM26LV31EIRGYR-NDR
AM26LV31EIRGYR-DG
-AM26LV31EIRGYRG4
2156-AM26LV31EIRGYR
-296-24693-1-DG
296-24693-6
-AM26LV31EIRGYRG4-NDR
TEXTISAM26LV31EIRGYR
Standard Package
3,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Detailed and professional logistics tracking reassured me throughout the delivery journey.
de desembre 02, 2025
My package arrived intact and well-packaged, thanks to their reliable logistics.
de desembre 02, 2025
I love how simple and quick it is to browse and purchase items on DiGi Electronics’ website.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the AM26LV31EIRGYR in a high-noise industrial environment with long cable runs?
When integrating the AM26LV31EIRGYR in high-noise environments with long RS485/RS422 cabling, the primary risks include ground potential differences and EMI-induced signal corruption. Since the AM26LV31EIRGYR is a driver-only device with no receiver for feedback monitoring, ensure system-level noise immunity through proper PCB layout: use a dedicated ground plane, route differential pairs tightly coupled with controlled impedance (~100Ω), and place series termination resistors (120Ω) at the physical network endpoints, not at the driver. Additionally, supplement with transient voltage suppression (TVS) diodes rated for ESD and surge protection on the bus lines to prevent latch-up or degradation over time, especially in environments prone to inductive switching or lightning strikes. Isolation should be implemented externally if ground shifts exceed the device’s common-mode range.
Can the AM26LV31EIRGYR replace the SP339H in an existing 3.3V RS485 design, and what are the key compatibility concerns?
The AM26LV31EIRGYR can functionally replace the SP339H in a 3.3V RS485 driver application, but key compatibility issues must be addressed. The SP339H supports higher driver output swing (up to 5V-tolerant outputs even on 3.3V supply), while the AM26LV31EIRGYR is strictly limited to 3V to 3.6V operation with RS485-compliant differential output. If the legacy design relies on higher voltage swing for noise margin in long-distance runs, validate link robustness with the AM26LV31EIRGYR’s reduced output under the same conditions. Also, the SP339H includes driver slew rate control options; the AM26LV31EIRGYR does not, so ensure EMI compliance through external filtering if operating above 1 Mbps in sensitive environments.
How does the exposed pad in the AM26LV31EIRGYR 16-VQFN package affect thermal and electrical performance, and how should it be handled during PCB assembly?
The exposed pad on the AM26LV31EIRGYR’s 16-VQFN (4x3.5) package is critical for both thermal dissipation and electrical grounding. To maximize reliability, securely connect the exposed pad to a solid ground plane using multiple vias arranged in a grid pattern under the footprint to reduce thermal resistance (θJA). This helps maintain junction temperature within safe limits, particularly when operating at high ambient temperatures (up to 85°C). Electrically, failing to properly solder the exposed pad can result in ground instability and increased susceptibility to EMI. Follow Texas Instruments' recommended land pattern and reflow profile to prevent solder voiding, and ensure the pad is not floating—tie it directly to ground with low impedance.
What are the reliability implications of operating the AM26LV31EIRGYR at the upper limit of its 3.6V supply voltage, especially in automotive applications with voltage transients?
Operating the AM26LV31EIRGYR close to its maximum 3.6V supply increases the risk of permanent damage during power supply transients common in automotive or industrial systems. Voltage spikes from load dump or switching inductive loads can exceed 3.6V even on nominal 3.3V rails, potentially breaching the absolute maximum rating. To ensure reliability, use a tightly regulated LDO with overvoltage protection and transient suppression (e.g., a TVS diode on the VCC line) before the AM26LV31EIRGYR. Avoid relying solely on DC-DC converters without sufficient filtering. Additionally, verify power sequencing if the device interfaces with external components that may back-drive the supply.
How does the lack of integrated failsafe biasing in the AM26LV31EIRGYR impact system design, and what external circuitry should be used to ensure predictable bus states?
The AM26LV31EIRGYR does not include internal failsafe biasing, so during idle bus conditions or when all drivers on the network are undriven, the receiver at the far end may produce undefined output states. This creates a reliability risk in multi-node RS485 networks. To mitigate this, add external biasing resistors: place a pull-up on A and a pull-down on B (typical values 560Ω to 1kΩ, depending on termination scheme) to maintain a differential voltage that ensures logic-high idle state. Alternatively, design system-level control logic that avoids floating bus states through timely driver enable/disable sequencing. Always include termination resistors at the ends of the bus to prevent reflections, and verify biasing does not exceed the AM26LV31EIRGYR driver’s current capability during active operation.
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AM26LV31EIRGYR CAD Models
Texas Instruments AM26LV31EIRGYR PCB symbols & footprints
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