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AFE5808ZCF
Texas Instruments
IC AFE 8 CHAN 12/14BIT 135NFBGA
1933 Pcs New Original In Stock
8 Channel AFE 12, 14 Bit 158 mW 135-NFBGA (15x9)
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5.0 / 5.0
- (345 Ratings)
AFE5808ZCF
Product Overview
1398695
DiGi Electronics Part Number
AFE5808ZCF-DGManufacturer
Texas Instruments
AFE5808ZCF
Description
IC AFE 8 CHAN 12/14BIT 135NFBGAInventory
1933 Pcs New Original In Stock
8 Channel AFE 12, 14 Bit 158 mW 135-NFBGA (15x9)
Quantity
Minimum 1
Minimum 1
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AFE5808ZCF Technical Specifications
Category
Data Acquisition, Analog Front End (AFE)
Packaging
-
Series
-
Product Status
Active
Number of Bits
12, 14
Number of Channels
8
Power (Watts)
158 mW
Voltage - Supply, Analog
1.7V ~ 1.9V, 3.15V ~ 3.6V, 5V
Voltage - Supply, Digital
1.7V ~ 1.9V
Mounting Type
Surface Mount
Package / Case
135-BGA
Supplier Device Package
135-NFBGA (15x9)
Base Product Number
AFE5808
Datasheet & Documents
HTML Datasheet
AFE5808ZCF-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
-AFE5808ZCF-NDR
TEXTISAFE5808ZCF
2156-AFE5808ZCF
296-28095
-296-28095-DG
Standard Package
160
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
구매 과정이 간편하고 체계적이라 재고 파악이 쉽습니다.
de desembre 02, 2025
Ma récente commande est arrivée très rapidement, même en période de forte demande, ce qui témoigne de leur excellente logistique.
de desembre 02, 2025
Der Versandprozess bei DiGi Electronics ist äußerst effizient. Ich habe nur zwei Tage gewartet, bis meine Bestellung bei mir war, was bei vorherigen Anbietern nicht der Fall war.
de desembre 02, 2025
The speed of delivery was impressive, and the packaging ensured my items arrived in perfect condition.
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Frequently Asked Questions (FAQ)
What are the critical power sequencing requirements when designing with the AFE5808ZCF to avoid latch-up or damage during startup?
The AFE5808ZCF requires careful power sequencing due to its multiple supply rails (analog 1.8V/3.3V/5V and digital 1.8V). TI recommends powering the analog supplies before or simultaneously with the digital supply to prevent forward-biasing internal ESD diodes, which can cause latch-up or excessive current draw. A safe sequence is: 5V analog → 3.3V analog → 1.8V analog → 1.8V digital. Use power sequencers or supervisor ICs (e.g., TPS3890) to enforce this; failing to do so may lead to reliability issues or device failure in high-channel-count medical or ultrasound systems where the AFE5808ZCF is commonly used.
Can the AFE5808ZCF be safely replaced with the Analog Devices AD9273 in an existing 8-channel ultrasound front-end design without major board modifications?
Direct replacement of the AFE5808ZCF with the AD9273 is not recommended without significant redesign. While both are 8-channel, 12/14-bit AFECs for medical imaging, the AD9273 uses a different package (196-ball CSP vs. AFE5808ZCF’s 135-NFBGA), distinct power rail requirements (no 5V analog rail), and incompatible control interfaces (SPI vs. parallel). Additionally, the AFE5808ZCF integrates variable-gain amplifiers and anti-aliasing filters optimized for piezoelectric transducers, whereas the AD9273 targets different impedance and bandwidth profiles. Mismatched impedance or timing could degrade SNR and image quality—requiring PCB layout, firmware, and possibly transducer matching network changes.
How does the AFE5808ZCF’s 158 mW per channel power dissipation impact thermal management in compact handheld ultrasound devices?
At 158 mW total power (≈19.75 mW per channel), the AFE5808ZCF generates minimal heat, but in densely packed handheld ultrasound probes with limited airflow, localized heating near the 135-NFBGA package can still affect analog performance. TI specifies an operating junction temperature range of –40°C to +105°C, but sustained operation near the upper limit may increase noise and offset drift. Designers should ensure adequate copper pour under the BGA, avoid placing heat-sensitive components nearby, and validate thermal performance under worst-case ambient conditions. Passive cooling is typically sufficient, but thermal vias and grounding planes are essential to maintain SNR and prevent gain drift in battery-powered diagnostic equipment.
What are the risks of using a lower-cost 1.8V LDO for the AFE5808ZCF’s digital supply if it has higher output noise than the datasheet-recommended regulator?
Using a noisy or poorly regulated 1.8V LDO for the AFE5808ZCF’s digital supply can couple switching noise into the analog sections through substrate coupling or shared ground planes, degrading SNR and increasing jitter in the ADC outputs—especially critical in Doppler ultrasound applications. The AFE5808ZCF’s digital I/O is sensitive to supply ripple above 10–20 mVpp. To mitigate risk, use a low-noise LDO like the TPS7A4700 (4.17 µV RMS) with proper decoupling (100 nF + 10 µF per pin) and star grounding. Avoid switching regulators directly powering the digital rail unless heavily filtered; otherwise, you may observe elevated noise floors or spurious tones in the sampled data.
Is the AFE5808ZCF suitable for industrial NDT (non-destructive testing) applications operating in high-vibration environments, given its 135-NFBGA package?
The AFE5808ZCF’s 135-NFBGA package is surface-mount only and susceptible to mechanical stress under high vibration, which is common in industrial NDT ultrasonic testing equipment. While the device itself is electrically robust, solder joint fatigue over time can lead to intermittent failures. To ensure reliability, implement underfill epoxy (e.g., Hysol FP4530) around the BGA perimeter, use a rigid-flex PCB if mounted on moving parts, and avoid mounting near motors or actuators. Additionally, perform HALT (Highly Accelerated Life Testing) to validate long-term durability. For extreme environments, consider conformal coating and redundant grounding—though the AFE5808ZCF remains a strong choice if mechanical design mitigations are properly applied.
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AFE5808ZCF CAD Models
Texas Instruments AFE5808ZCF PCB symbols & footprints
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