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ADS801U
Texas Instruments
IC ADC 12BIT PIPELINED 28SOIC
1887 Pcs New Original In Stock
12 Bit Analog to Digital Converter 1 Input 1 Pipelined 28-SOIC
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5.0 / 5.0
- (392 Ratings)
ADS801U
Product Overview
1438596
DiGi Electronics Part Number
ADS801U-DGManufacturer
Texas Instruments
ADS801U
Description
IC ADC 12BIT PIPELINED 28SOICInventory
1887 Pcs New Original In Stock
12 Bit Analog to Digital Converter 1 Input 1 Pipelined 28-SOIC
Quantity
Minimum 1
Minimum 1
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ADS801U Technical Specifications
Category
Data Acquisition, Analog to Digital Converters (ADC)
Packaging
Tube
Series
-
Product Status
Last Time Buy
Number of Bits
12
Sampling Rate (Per Second)
25M
Number of Inputs
1
Input Type
Differential, Single Ended
Data Interface
Parallel
Configuration
S/H-ADC
Ratio - S/H:ADC
1:1
Number of A/D Converters
1
Architecture
Pipelined
Reference Type
External, Internal
Voltage - Supply, Analog
5V
Voltage - Supply, Digital
5V
Features
-
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (0.295", 7.50mm Width)
Supplier Device Package
28-SOIC
Mounting Type
Surface Mount
Base Product Number
ADS801
Datasheet & Documents
Datasheets
Download ADS801U Product Specification (PDF)
Manufacturer Product Page
ADS801U Specifications
HTML Datasheet
ADS801U-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
TEXTISADS801U
-ADS801U-DG
2156-ADS801U
-ADS801U-NDR
-ADS801UG4
-ADS801UG4-NDR
ADS801U-NDR
Standard Package
20
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
가성비와 배송 속도 모두 뛰어나서 앞으로도 계속 이용할 계획입니다.
de desembre 02, 2025
包裝設計專業且用心，感覺非常有品質，值得信賴。
de desembre 02, 2025
Their shipping reliability contributes significantly to my workflow efficiency.
de desembre 02, 2025
For reliable, cost-effective solutions, DiGi Electronics is hard to beat.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing the ADS801U with the ADC12040CIVYX/NOPB in a high-speed data acquisition system, and how can they be mitigated?
Replacing the ADS801U with the ADC12040CIVYX/NOPB introduces several design risks despite similar 12-bit resolution and 25 MSPS sampling rates. The ADC12040CIVYX/NOPB uses a different pipelined architecture with higher latency (6 cycles vs. 4 in the ADS801U), which may disrupt timing in real-time control loops. Additionally, its input voltage range is 2.0 Vpp differential vs. the ADS801U’s 2.5 Vpp, requiring gain adjustment in the front-end amplifier stage. Power supply sequencing is also more critical on the ADC12040 due to stricter digital I/O voltage tolerance. To mitigate, validate timing margins in your FPGA or microcontroller interface, recalibrate analog front-end gain, and ensure power rails meet the ADC12040’s power-up sequence requirements. Always prototype the substitution on a test board before full integration.
How should I handle the end-of-life status and last-time-buy implications of the ADS801U in a long-lifecycle industrial product design?
The ADS801U is under Last Time Buy status, meaning long-term supply is uncertain—this poses a significant risk for industrial or medical products with 10+ year lifecycles. To mitigate obsolescence, immediately secure sufficient inventory based on your projected production volume and buffer for potential scrap or field failures. Simultaneously, begin a drop-in replacement assessment using pin-compatible or functionally equivalent ADCs such as the ADC12040CIVYX/NOPB or newer TI parts like the ADS5400 series. Perform full electrical and thermal characterization of alternatives under worst-case conditions (e.g., -40°C and 85°C) to ensure performance parity. Document a migration plan with qualification testing protocols to enable rapid transition if the ADS801U becomes unavailable.
What layout and grounding considerations are critical when designing a PCB for the ADS801U to maintain 12-bit accuracy at 25 MSPS?
To preserve 12-bit effective resolution in the ADS801U at 25 MSPS, strict high-speed layout practices are essential. Use a solid ground plane beneath the device and isolate analog and digital grounds, connecting them at a single point near the ADC’s power supply. Keep the analog input traces short, differential, and impedance-controlled (typically 100 Ω differential), routed away from digital signals and clock lines. Place decoupling capacitors (0.1 µF ceramic + 10 µF tantalum) as close as possible to the AVDD and DVDD pins. Avoid vias in the signal path and ensure the reference voltage source has low output impedance and is filtered with a 10 Ω resistor and 10 µF capacitor. Failure to follow these guidelines can introduce noise, crosstalk, or ground bounce that degrades SNR and ENOB below datasheet specifications.
Can the ADS801U be safely operated with a single 5V supply, and what are the trade-offs compared to using separate analog and digital supplies?
Yes, the ADS801U can operate with a single 5V supply for both analog and digital domains (AVDD = DVDD = 5V), as specified in its datasheet. However, this configuration increases the risk of digital switching noise coupling into the sensitive analog front end, potentially degrading SNR and increasing code transition noise. For high-precision applications (e.g., motor control or sensor interfaces), it's strongly recommended to use separate, well-regulated 5V supplies with independent LC filtering for AVDD and DVDD, even if voltage levels are identical. This isolation minimizes ground bounce and supply-induced jitter. If board space or cost constraints force a shared supply, implement aggressive decoupling, star grounding, and keep digital output lines physically separated from analog input traces to reduce interference.
What reliability concerns should I evaluate when deploying the ADS801U in an automotive under-hood environment operating near its -40°C to 85°C limit?
When using the ADS801U in automotive under-hood applications approaching its 85°C maximum operating temperature, thermal derating and long-term reliability become critical. Prolonged operation near Tjmax (125°C junction temperature) accelerates electromigration and increases the risk of parametric drift, especially in offset and gain error. Ensure adequate PCB copper pour for heat dissipation and avoid enclosing the device in thermally insulating enclosures. Monitor ambient temperature with an onboard sensor and implement thermal shutdown logic if necessary. Additionally, the MSL 2 rating means the device can be exposed to ambient conditions for up to 1 year before assembly—beyond that, bake per J-STD-033 before reflow to prevent moisture-induced cracking. For mission-critical systems, consider derating the sampling rate slightly at high temperatures to reduce self-heating and extend MTBF.
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ADS801U CAD Models
Texas Instruments ADS801U PCB symbols & footprints
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