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ADS62P29IRGCT
Texas Instruments
IC ADC 12BIT PIPELINED 64VQFN
1678 Pcs New Original In Stock
12 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-VQFN (9x9)
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ADS62P29IRGCT
Product Overview
1373169
DiGi Electronics Part Number
ADS62P29IRGCT-DGManufacturer
Texas Instruments
ADS62P29IRGCT
Description
IC ADC 12BIT PIPELINED 64VQFNInventory
1678 Pcs New Original In Stock
12 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-VQFN (9x9)
Quantity
Minimum 1
Minimum 1
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ADS62P29IRGCT Technical Specifications
Category
Data Acquisition, Analog to Digital Converters (ADC)
Packaging
-
Series
-
Product Status
Active
Number of Bits
12
Sampling Rate (Per Second)
250M
Number of Inputs
2
Input Type
Differential
Data Interface
LVDS - Parallel, Parallel
Configuration
S/H-ADC
Ratio - S/H:ADC
1:1
Number of A/D Converters
2
Architecture
Pipelined
Reference Type
External, Internal
Voltage - Supply, Analog
3.15V ~ 3.6V
Voltage - Supply, Digital
1.7V ~ 1.9V
Features
Simultaneous Sampling
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN Exposed Pad
Supplier Device Package
64-VQFN (9x9)
Mounting Type
Surface Mount
Base Product Number
ADS62P29
Datasheet & Documents
HTML Datasheet
ADS62P29IRGCT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991C2
HTSUS
8542.39.0001
Additional Information
Other Names
296-24614-2-NDR
296-24614-1
296-24614-2
TEXTISADS62P29IRGCT
296-24614-1-NDR
2156-ADS62P29IRGCT
296-24614-6-NDR
-296-24614-1-DG
-296-24614-1-NDR
296-24614-6
-ADS62P29IRGCT-NDR
Standard Package
250
Alternative Parts
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MANUFACTURER
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SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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Frequently Asked Questions (FAQ)
What are the critical layout considerations when designing a PCB for the ADS62P29IRGCT to maintain signal integrity at 250 MSPS with differential inputs?
When designing a PCB for the ADS62P29IRGCT, prioritize symmetrical routing of the differential analog input pairs (INP/INN) with tight length matching (<5 mils) and controlled impedance (100 Ω differential). Place the ADC close to the analog front-end to minimize trace length, use a solid ground plane beneath the 64-VQFN exposed pad for thermal and electrical stability, and isolate the 3.3V analog supply from digital noise using ferrite beads and low-ESR decoupling capacitors (e.g., 100 nF + 10 µF) within 2 mm of the pins. Avoid routing high-speed digital lines (especially LVDS outputs) near analog inputs to prevent coupling—this is essential to preserve SNR and avoid metastability in high-speed pipelined operation.
Can the ADS62P29IRGCT be safely replaced with the ADS62P22 or ADS62C17 in a 250 MSPS data acquisition system, and what performance trade-offs should I expect?
Direct replacement of the ADS62P29IRGCT with the ADS62P22 (12-bit, 200 MSPS) or ADS62C17 (14-bit, 170 MSPS) is not recommended without system revalidation. The ADS62P22 has a lower sampling rate (200 MSPS vs. 250 MSPS), which may violate Nyquist requirements in your application, while the ADS62C17, despite higher resolution, operates at only 170 MSPS and uses a different internal architecture that affects latency and power. Additionally, the ADS62C17 lacks simultaneous sampling, a key feature of the ADS62P29IRGCT. If sampling rate or channel synchronization is critical, these substitutes introduce functional risk—consider instead the pin-compatible ADS62P10 (12-bit, 250 MSPS) if higher linearity is needed.
How should I handle power supply sequencing for the ADS62P29IRGCT’s dual voltage domains (3.3V analog and 1.8V digital) to avoid latch-up or performance degradation?
To prevent latch-up and ensure reliable startup, power up the 1.8V digital supply (DVDD) before or simultaneously with the 3.3V analog supply (AVDD) for the ADS62P29IRGCT. TI recommends that AVDD never exceeds DVDD by more than 0.3V during power-up or power-down. Implement a power sequencer IC or use supervisor circuits with adjustable delay to enforce this sequence. Failure to do so can forward-bias internal ESD diodes, causing excessive current flow and potential long-term reliability issues. Always verify sequencing with an oscilloscope during prototype testing, especially in hot-swap or brownout scenarios.
What are the reliability risks of operating the ADS62P29IRGCT near its -40°C to 85°C industrial temperature range limits in high-vibration environments?
Operating the ADS62P29IRGCT at temperature extremes combined with mechanical stress increases the risk of solder joint fatigue due to CTE mismatch between the 64-VQFN package and PCB. At -40°C, brittle fracture risk rises, while at 85°C, thermal cycling accelerates fatigue. Mitigate this by using SAC305 solder with proper reflow profiling, ensuring adequate pad adhesion, and avoiding flexing substrates. Additionally, internal reference drift and clock jitter may degrade SNR near temperature limits—validate performance across the full range with real-world thermal profiles. Consider conformal coating if condensation or particulate exposure is possible, but ensure it doesn’t interfere with the exposed thermal pad.
Is it safe to drive the analog inputs of the ADS62P29IRGCT beyond the specified common-mode range if using an external reference, and what protection circuitry is recommended?
No, driving the analog inputs of the ADS62P29IRGCT outside the valid common-mode range (typically 1.5V ± 0.5V with a 2.0V reference) can cause internal clamping diodes to conduct, leading to distortion, increased power consumption, or device damage. Even with an external reference, input overvoltage risks remain. Implement robust input protection using back-to-back Schottky diodes (e.g., BAT54S) tied to clean analog supply rails, series current-limiting resistors (10–100 Ω), and an anti-aliasing filter. Ensure the protection network bandwidth exceeds your signal frequency to avoid phase distortion—this is especially critical in multi-channel systems where crosstalk can amplify errors.
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ADS62P29IRGCT CAD Models
Texas Instruments ADS62P29IRGCT PCB symbols & footprints
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