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ADS42LB69IRGCT
Texas Instruments
IC ADC 16BIT PIPELINED 64VQFN
1955 Pcs New Original In Stock
16 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-VQFN (9x9)
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ADS42LB69IRGCT
Product Overview
1253595
DiGi Electronics Part Number
ADS42LB69IRGCT-DGManufacturer
Texas Instruments
ADS42LB69IRGCT
Description
IC ADC 16BIT PIPELINED 64VQFNInventory
1955 Pcs New Original In Stock
16 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-VQFN (9x9)
Quantity
Minimum 1
Minimum 1
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ADS42LB69IRGCT Technical Specifications
Category
Data Acquisition, Analog to Digital Converters (ADC)
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
Number of Bits
16
Sampling Rate (Per Second)
250M
Number of Inputs
2
Input Type
Differential
Data Interface
LVDS - Parallel
Configuration
S/H-ADC
Ratio - S/H:ADC
1:1
Number of A/D Converters
2
Architecture
Pipelined
Reference Type
Internal
Voltage - Supply, Analog
1.7V ~ 1.9V
Voltage - Supply, Digital
1.7V ~ 1.9V
Features
Simultaneous Sampling
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN Exposed Pad
Supplier Device Package
64-VQFN (9x9)
Mounting Type
Surface Mount
Base Product Number
ADS42LB69
Datasheet & Documents
Manufacturer Product Page
ADS42LB69IRGCT Specifications
HTML Datasheet
ADS42LB69IRGCT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A001A5A5
HTSUS
8542.39.0001
Additional Information
Other Names
ADS42LB69IRGCT-DG
296-38042-2
-296-38042-1-DG
296-38042-6
296-38042-1
Standard Package
250
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)
Can the ADS42LB69IRGCT be safely replaced with the AD9680BCPZ-250 in a high-speed dual-channel data acquisition system without redesigning the analog front end?
Direct replacement of the ADS42LB69IRGCT with the AD9680BCPZ-250 is not recommended without careful evaluation. While both are 16-bit, 250 MSPS dual-channel ADCs with differential inputs, the ADS42LB69IRGCT uses internal references and LVDS parallel output, whereas the AD9680 requires external references and supports JESD204B serial interface. Mismatched reference architectures and output protocols can introduce gain errors, timing skew, and require significant firmware and PCB layout changes. Additionally, the ADS42LB69IRGCT’s simultaneous sampling feature may be critical in your application—verify if the AD9680’s interleaved sampling meets your phase-matching requirements. Always validate signal integrity and power supply sequencing compatibility before substitution.
What are the key thermal and layout risks when designing a PCB for the ADS42LB69IRGCT in a compact, high-channel-density system operating near 85°C ambient?
The ADS42LB69IRGCT’s 64-VQFN exposed pad package demands rigorous thermal management, especially near its 85°C operating limit. Inadequate grounding of the exposed pad or insufficient thermal vias can cause localized hot spots, leading to thermal drift in offset and gain, degrading SNR. Use a solid ground plane beneath the package with at least 9–16 thermal vias (0.3 mm diameter) to dissipate heat. Avoid placing high-power components nearby, and ensure symmetrical routing of differential input pairs to minimize thermal gradients. Also, consider airflow and enclosure design—passive cooling may not suffice in dense systems. Monitor junction temperature using TI’s thermal models during layout to prevent long-term reliability issues.
How does the internal reference of the ADS42LB69IRGCT impact system accuracy compared to using an external precision reference like the REF5025, and when should I consider bypassing it?
The ADS42LB69IRGCT’s internal reference simplifies design but limits ultimate accuracy due to its typical ±0.5% initial accuracy and higher temperature drift (~10 ppm/°C) compared to external references like the REF5025 (±0.05%, 3 ppm/°C). In high-precision applications such as phased-array radar or medical imaging, where DC accuracy and long-term stability matter, replacing the internal reference with a low-noise, high-stability external reference via the REFIN pin is advised. However, this requires careful filtering and layout to avoid introducing noise. Note that disabling the internal reference increases power supply complexity and may affect startup timing—always validate startup behavior and reference settling time in your firmware sequence.
Is the ADS42LB69IRGCT suitable for direct RF sampling applications above 1 GHz, and what front-end design considerations are critical to avoid aliasing and distortion?
While the ADS42LB69IRGCT supports 250 MSPS sampling, it is not ideal for direct RF sampling above 1 GHz due to its analog input bandwidth (~1.2 GHz typical) and lack of built-in anti-aliasing filtering. At such frequencies, harmonic folding and out-of-band noise can severely degrade SFDR. A well-designed bandpass filter centered on your target band (e.g., 1.2–1.4 GHz) is essential before the ADC input. Use high-linearity baluns and minimize trace length to preserve signal integrity. Also, ensure the driver amplifier (e.g., THS4541) has sufficient bandwidth and low distortion. Simultaneous sampling helps maintain phase coherence across channels, but clock jitter becomes critical—use a low-jitter clock source (<50 fs) to avoid SNR degradation at high input frequencies.
What reliability risks should I consider when deploying the ADS42LB69IRGCT in an industrial environment with frequent power cycling between -40°C and 85°C?
Frequent thermal cycling and power cycling in industrial environments can stress the ADS42LB69IRGCT’s VQFN package and internal bond wires, potentially leading to early fatigue failure, especially if the exposed pad is not properly soldered. Moisture sensitivity level (MSL 3) means the device must be baked and handled per J-STD-033 if exposed to ambient humidity before reflow. Additionally, repeated power cycling may cause latch-up if power supply sequencing (analog and digital 1.8V rails) is not monotonic—use supply supervisors to ensure both rails rise together. Implement input overvoltage protection (e.g., Schottky clamps) to prevent damage during transient events. For long-term reliability, monitor solder joint integrity through X-ray inspection during qualification and consider conformal coating in high-humidity environments.
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ADS42LB69IRGCT CAD Models
Texas Instruments ADS42LB69IRGCT PCB symbols & footprints
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