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ADS4226IRGCT
Texas Instruments
IC ADC 12BIT PIPELINED 64VQFN
1493 Pcs New Original In Stock
12 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-VQFN (9x9)
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5.0 / 5.0
- (424 Ratings)
ADS4226IRGCT
Product Overview
1237076
DiGi Electronics Part Number
ADS4226IRGCT-DGManufacturer
Texas Instruments
ADS4226IRGCT
Description
IC ADC 12BIT PIPELINED 64VQFNInventory
1493 Pcs New Original In Stock
12 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-VQFN (9x9)
Quantity
Minimum 1
Minimum 1
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ADS4226IRGCT Technical Specifications
Category
Data Acquisition, Analog to Digital Converters (ADC)
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
Number of Bits
12
Sampling Rate (Per Second)
160M
Number of Inputs
2
Input Type
Differential
Data Interface
LVDS - Parallel, Parallel
Configuration
S/H-ADC
Ratio - S/H:ADC
1:1
Number of A/D Converters
2
Architecture
Pipelined
Reference Type
Internal
Voltage - Supply, Analog
1.7V ~ 1.9V
Voltage - Supply, Digital
1.7V ~ 1.9V
Features
Simultaneous Sampling
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN Exposed Pad
Supplier Device Package
64-VQFN (9x9)
Mounting Type
Surface Mount
Base Product Number
ADS4226
Datasheet & Documents
HTML Datasheet
ADS4226IRGCT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991C2
HTSUS
8542.39.0001
Additional Information
Other Names
296-28366-6
-296-28366-1-DG
296-28366-1
296-28366-2
-ADS4226IRGCT-NDR
Standard Package
250
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
物流安排得很好，快速又可靠，推薦給大家！
de desembre 02, 2025
注文から配達までとてもスムーズで、忙しい学校運営において大変助かっています。
de desembre 02, 2025
DiGi Electronics assures quality support at a price that’s hard to beat.
de desembre 02, 2025
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de desembre 02, 2025
Reliable shipping combined with excellent after-sales support—highly recommend DiGi Electronics.
de desembre 02, 2025
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)
Can the ADS4226IRGCT be safely used in a high-vibration industrial environment where board flexing is a concern, and what layout practices mitigate mechanical stress on the 64-VQFN exposed pad package?
The ADS4226IRGCT's 64-VQFN (9x9) package with an exposed thermal pad is sensitive to mechanical stress under high vibration or thermal cycling. To ensure reliability, use a symmetrically balanced solder stencil (typically 80–90% aperture ratio) for the exposed pad, include multiple via-in-pad connections (filled and plated over if possible), and avoid placing heavy components nearby that could induce board warpage. Additionally, follow TI’s recommended land pattern in the datasheet and consider underfill if the system exceeds typical industrial vibration profiles (e.g., IEC 60068-2-6). Mechanical anchoring of the PCB or conformal coating may also help reduce strain on the package leads.
What are the key risks when replacing the ADS4226IRGCT with a lower-cost 12-bit 160MSPS ADC like the Analog Devices AD9250, and how do input interface and power sequencing differ?
Replacing the ADS4226IRGCT with the AD9250 introduces several design risks: first, the AD9250 uses CMOS parallel output instead of LVDS, requiring level shifting and increasing digital noise coupling into the analog front-end. Second, the ADS4226IRGCT supports simultaneous sampling on both channels—critical for phase-coherent applications like beamforming—while the AD9250 samples sequentially unless using dual devices with matched latency, which adds complexity. Additionally, the ADS4226IRGCT has tighter supply voltage tolerance (1.7–1.9V) compared to the AD9250’s 1.8V ±5%, so power supply design must be re-evaluated. Always verify timing skew and jitter performance, as pipeline delay differences can disrupt downstream DSP synchronization.
How should I handle power supply decoupling for the ADS4226IRGCT in a mixed-signal system where digital switching noise from LVDS outputs could couple back into the analog supply rails?
To minimize noise coupling in the ADS4226IRGCT, implement a split ground plane strategy with a single-point connection between analog and digital grounds near the device’s exposed pad. Use separate LDOs or ferrite-bead-filtered rails for the analog (AVDD) and digital (DVDD) supplies, even though both operate at 1.8V. Place high-frequency decoupling capacitors (100nF X7R) as close as possible to each supply pin, supplemented by 1–10μF bulk caps. Route LVDS traces differentially with controlled impedance (100Ω) and keep them away from analog input traces. Adding a small RC filter (e.g., 10Ω + 100pF) on the reference input can further suppress high-frequency noise, preserving SNR in sensitive measurements.
Is the internal reference of the ADS4226IRGCT stable enough for precision DC measurement applications over its full operating temperature range (-40°C to 85°C), or should an external reference be used?
While the ADS4226IRGCT includes an internal reference, its initial accuracy and drift (typically ±25 mV over temperature) make it unsuitable for high-precision DC measurements such as calibration standards or low-offset sensor interfaces. For applications requiring better than ±0.1% gain accuracy over temperature, use a low-drift external reference like the REF5025 (2.5V, ±0.05% initial accuracy, 3ppm/°C drift). Bypass the REFIN pin properly and ensure the external reference can source the required current (~1mA). Note that enabling an external reference disables the internal buffer; verify drive strength compatibility to avoid settling errors at 160MSPS.
What are the thermal management implications of operating the ADS4226IRGCT at maximum sampling rate (160MSPS) in an enclosed 85°C ambient environment, and how does this affect long-term reliability?
Operating the ADS4226IRGCT at 160MSPS in an 85°C ambient significantly increases power dissipation due to dynamic switching losses, potentially pushing junction temperatures beyond safe limits despite the low-voltage operation. With MSL 3 rating (168-hour floor life), prolonged exposure to high temps accelerates moisture-related failures if not properly handled during assembly. Use the exposed pad as a primary heat path: connect it to a solid ground plane with at least nine thermal vias (0.3mm diameter) to dissipate heat to inner or bottom layers. Monitor case temperature during validation; if >85°C, consider airflow or a small heatsink. TI’s thermal resistance (θJA ≈ 28°C/W) suggests active cooling may be needed in sealed enclosures to maintain MTBF and prevent parametric drift in SNR or DNL.
Quality Assurance (QC)
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ADS4226IRGCT CAD Models
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