ADS1292RIRSMT >
ADS1292RIRSMT
Texas Instruments
IC AFE 2 CHAN 24BIT 32VQFN
2745 Pcs New Original In Stock
2 Channel AFE 24 Bit 740 µW 32-VQFN (4x4)
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ADS1292RIRSMT Texas Instruments
5.0 / 5.0 - (363 Ratings)

ADS1292RIRSMT

Product Overview

1394657

DiGi Electronics Part Number

ADS1292RIRSMT-DG

Manufacturer

Texas Instruments
ADS1292RIRSMT

Description

IC AFE 2 CHAN 24BIT 32VQFN

Inventory

2745 Pcs New Original In Stock
2 Channel AFE 24 Bit 740 µW 32-VQFN (4x4)
Quantity
Minimum 1

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In Stock (All prices are in USD)
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  • 1 74.7492 74.7492
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ADS1292RIRSMT Technical Specifications

Category Data Acquisition, Analog Front End (AFE)

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

Number of Bits 24

Number of Channels 2

Power (Watts) 740 µW

Voltage - Supply, Analog 2.7V ~ 5.25V

Voltage - Supply, Digital 1.7V ~ 3.6V

Mounting Type Surface Mount

Package / Case 32-VFQFN Exposed Pad

Supplier Device Package 32-VQFN (4x4)

Base Product Number ADS1292

Datasheet & Documents

Manufacturer Product Page

ADS1292RIRSMT Specifications

HTML Datasheet

ADS1292RIRSMT-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
296-35020-2
ADS1292RIRSMT-DG
296-35020-1
296-35020-6
-296-35020-1
-296-35020-1-DG
TEXTISADS1292RIRSMT
-ADS1292RIRSMT-NDR
2156-ADS1292RIRSMT
Standard Package
250

Reviews

5.0/5.0-(Show up to 5 Ratings)
Moons***ePath
de desembre 02, 2025
5.0
Their ongoing commitment to customer care fosters long-term trust.
Cal***irit
de desembre 02, 2025
5.0
Their prices are some of the best in the market, combined with excellent service.
Golde***urney
de desembre 02, 2025
5.0
I appreciate their commitment to providing detailed updates during delivery.
Gold***hade
de desembre 02, 2025
5.0
Shipping times are excellent, and the support team is second to none.
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Frequently Asked Questions (FAQ)

What are the key design risks when integrating the ADS1292RIRSMT into a low-power wearable ECG monitor, and how can I mitigate signal integrity issues due to its dual-supply architecture?

The ADS1292RIRSMT requires separate analog (2.7V–5.25V) and digital (1.7V–3.6V) supplies, which introduces ground bounce and noise coupling risks in compact wearable designs. To mitigate this, use a star-ground topology with separate analog and digital ground planes connected at a single point near the device’s exposed pad. Place low-ESR decoupling capacitors (100nF + 1µF) as close as possible to both AVDD and DVDD pins. Additionally, avoid routing high-speed digital traces near analog input channels (IN1/IN2) to prevent crosstalk—this is critical given the 24-bit resolution where microvolt-level signals are susceptible to interference.

Can the ADS1292RIRSMT be safely replaced with the ADS1291 or ADS1292 in an existing patient monitoring design without firmware changes?

Direct replacement of the ADS1292RIRSMT with the ADS1291 or non-R versions (e.g., ADS1292IRGTR) is not recommended without validation. While pin-compatible, the ADS1292R includes an integrated respiration impedance measurement block and right-leg drive amplifier that the base ADS1292 lacks. Firmware expecting these features will fail or produce erroneous data. Conversely, substituting the ADS1292RIRSMT into a design built for the ADS1292 may leave unused circuits active, increasing power consumption beyond expected limits (740 µW typical). Always verify register map compatibility and disable unused modules via SPI configuration.

How does the thermal performance of the 32-VQFN (4x4) package in the ADS1292RIRSMT affect long-term reliability in enclosed medical devices with limited airflow?

The ADS1292RIRSMT’s 32-VQFN package relies on its exposed thermal pad for heat dissipation. In enclosed, low-airflow environments typical of portable medical devices, inadequate PCB thermal vias under the pad can cause junction temperatures to rise, accelerating drift in the internal reference and increasing noise floor over time. To ensure reliability, connect the exposed pad to a solid ground plane using at least nine 0.3mm thermal vias. Monitor self-heating during continuous operation—TI’s datasheet specifies a thermal resistance (θJA) of 38°C/W; even minor power dissipation can elevate die temperature if thermal design is neglected, risking long-term calibration stability.

What are the trade-offs when using the ADS1292RIRSMT’s internal oscillator versus an external clock source in a multi-channel EEG acquisition system?

Using the ADS1292RIRSMT’s internal oscillator simplifies layout and reduces component count but introduces jitter that may degrade SNR in high-precision EEG applications requiring synchronized sampling across multiple units. For systems with more than two channels or requiring phase coherence (e.g., evoked potential studies), an external low-jitter crystal oscillator (e.g., 2.048 MHz) shared across all ADS1292RIRSMT devices is preferred. However, this increases BOM cost and board space. If using the internal oscillator, ensure the CLKSEL pin is properly tied high and avoid routing sensitive analog signals near the oscillator circuitry to minimize EMI-induced artifacts.

Is the ADS1292RIRSMT suitable for industrial ECG applications operating in high-EMI environments, and what layout precautions are necessary to maintain 24-bit performance?

The ADS1292RIRSMT can be used in industrial ECG applications, but its 24-bit resolution demands rigorous EMI mitigation. High electromagnetic interference from motors or switching power supplies can couple into the high-impedance analog front-end, overwhelming the signal. Use guarded differential input traces with driven shield rings around IN1P/N and IN2P/N, and implement a 4-layer PCB with dedicated analog and digital ground planes. Ferrite beads on analog supply lines and RC filters (10Ω + 100pF) at each input channel help suppress RF ingress. Additionally, leverage the built-in lead-off detection and RLD feedback to maintain common-mode rejection—critical when electrode-skin impedance varies in harsh environments.

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