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ADS114S06BIRHBT
Texas Instruments
IC ADC 16BIT SIGMA-DELTA 32VQFN
29605 Pcs New Original In Stock
16 Bit Analog to Digital Converter 4, 6 Input 1 Sigma-Delta 32-VQFN (5x5)
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5.0 / 5.0
- (465 Ratings)
ADS114S06BIRHBT
Product Overview
1256656
DiGi Electronics Part Number
ADS114S06BIRHBT-DGManufacturer
Texas Instruments
ADS114S06BIRHBT
Description
IC ADC 16BIT SIGMA-DELTA 32VQFNInventory
29605 Pcs New Original In Stock
16 Bit Analog to Digital Converter 4, 6 Input 1 Sigma-Delta 32-VQFN (5x5)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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ADS114S06BIRHBT Technical Specifications
Category
Data Acquisition, Analog to Digital Converters (ADC)
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
Number of Bits
16
Sampling Rate (Per Second)
4k
Number of Inputs
4, 6
Input Type
Differential, Pseudo-Differential, Single Ended
Data Interface
SPI
Configuration
MUX-PGA-ADC
Ratio - S/H:ADC
-
Number of A/D Converters
1
Architecture
Sigma-Delta
Reference Type
External, Internal
Voltage - Supply, Analog
±2.5V, 2.7V ~ 5.25V
Voltage - Supply, Digital
2.7V ~ 3.6V
Features
PGA, Temperature Sensor
Operating Temperature
-40°C ~ 125°C (TA)
Package / Case
32-VFQFN Exposed Pad
Supplier Device Package
32-VQFN (5x5)
Mounting Type
Surface Mount
Base Product Number
ADS114S06
Datasheet & Documents
Manufacturer Product Page
ADS114S06BIRHBT Specifications
HTML Datasheet
ADS114S06BIRHBT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-47423-6
2156-ADS114S06BIRHBT
296-47423-1
296-47423-2
TEXTISADS114S06BIRHBT
Standard Package
250
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
The value I get from DiGi Electronics is unmatched in the market.
de desembre 02, 2025
Shopping with DiGi Electronics feels safe and reliable every single time.
de desembre 02, 2025
DiGi Electronics offers excellent value through their cost-effective products and green packaging practices.
de desembre 02, 2025
The packaging is not only attractive but also durable, protecting the products during transit.
de desembre 02, 2025
Their after-sales team provided excellent support, including troubleshooting tips that solved my problems rapidly.
de desembre 02, 2025
Fast processing and shipping, with packaging that shows attention to detail.
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Frequently Asked Questions (FAQ)
Can the ADS114S06BIRHBT be safely used in a 5V industrial sensor interface where the analog supply is 5V but the microcontroller runs on 3.3V logic?
Yes, the ADS114S06BIRHBT supports a digital supply voltage (DVDD) range of 2.7V to 3.6V and an analog supply (AVDD) range of 2.7V to 5.25V, allowing it to interface directly with 3.3V microcontrollers while powering analog front-end circuits at 5V. However, ensure that the SPI signals from the MCU do not exceed DVDD + 0.3V; if the MCU outputs 5V logic, use level-shifting circuitry or configure the MCU pins for 3.3V I/O to avoid damaging the ADC’s digital inputs.
What are the key risks when replacing the ADS114S06BIRHBT with a lower-cost 16-bit sigma-delta ADC like the ADS1115 in a precision thermocouple measurement system?
Replacing the ADS114S06BIRHBT with the ADS1115 introduces significant performance trade-offs: the ADS1115 lacks an integrated PGA with high input impedance, has only 4kSPS max throughput vs. the ADS114S06BIRHBT’s flexible data rates up to 4kSPS with better noise performance, and offers no internal temperature sensor for cold-junction compensation. Additionally, the ADS1115 uses a smaller package without an exposed pad, reducing thermal dissipation capability. In high-precision or high-temperature environments, these omissions can lead to measurement drift, reduced accuracy, and reliability issues—making the ADS114S06BIRHBT a superior choice for demanding thermocouple applications.
How should I handle grounding and layout for the ADS114S06BIRHBT’s exposed thermal pad in a mixed-signal PCB design to minimize noise coupling?
The ADS114S06BIRHBT’s 32-VQFN exposed pad must be connected directly to a clean analog ground (AGND) plane using multiple vias to ensure low-impedance thermal and electrical connection. Avoid routing digital signals or high-speed traces under the package. Split the ground plane only if absolutely necessary—prefer a single, solid ground plane with careful partitioning of analog and digital return currents. Place decoupling capacitors (100nF ceramic + 10µF tantalum) as close as possible to AVDD and DVDD pins, referencing the same AGND node connected to the thermal pad. Poor grounding here can elevate noise floor and degrade effective resolution in low-level signal measurements.
Is the internal reference of the ADS114S06BIRHBT stable enough for long-term strain gauge measurements without periodic recalibration, or should I use an external reference like the REF5025?
While the ADS114S06BIRHBT includes an internal reference, its long-term drift and temperature coefficient may not meet the stability requirements for precision strain gauge applications over wide temperature ranges or extended durations. For critical measurements, TI recommends using a high-stability external reference such as the REF5025 (2.5V, ±0.05% initial accuracy, 3ppm/°C drift). The ADS114S06BIRHBT supports external references via the VREFP pin, allowing you to bypass the internal reference and achieve sub-0.01% system accuracy. This is especially important in bridge-based sensors where reference drift directly translates to measurement error.
Can the ADS114S06BIRHBT operate reliably in an automotive under-hood environment given its -40°C to 125°C rating, and what derating considerations apply for continuous operation near 125°C?
The ADS114S06BIRHBT is rated for operation up to 125°C ambient (TA), making it suitable for many automotive under-hood applications. However, continuous operation near the upper limit requires careful thermal management: power dissipation increases with supply voltage and sampling rate, and junction temperature can exceed TA by 20–30°C depending on PCB layout. Derate performance parameters such as SNR and offset drift at elevated temperatures—consult Figure 12 in the datasheet for drift vs. temperature. Ensure adequate copper area connected to the exposed pad and avoid stacking heat-generating components nearby. For mission-critical systems, consider periodic self-calibration or margin testing to validate long-term reliability under thermal stress.
Quality Assurance (QC)
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