ADC3444IRTQT >
ADC3444IRTQT
Texas Instruments
IC ADC 14BIT PIPELINED 56QFN
1257 Pcs New Original In Stock
14 Bit Analog to Digital Converter 4 Input 4 Pipelined 56-QFN (8x8)
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ADC3444IRTQT Texas Instruments
5.0 / 5.0 - (105 Ratings)

ADC3444IRTQT

Product Overview

1279657

DiGi Electronics Part Number

ADC3444IRTQT-DG

Manufacturer

Texas Instruments
ADC3444IRTQT

Description

IC ADC 14BIT PIPELINED 56QFN

Inventory

1257 Pcs New Original In Stock
14 Bit Analog to Digital Converter 4 Input 4 Pipelined 56-QFN (8x8)
Quantity
Minimum 1

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In Stock (All prices are in USD)
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  • 1 108.7808 108.7808
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ADC3444IRTQT Technical Specifications

Category Data Acquisition, Analog to Digital Converters (ADC)

Manufacturer Texas Instruments

Packaging -

Series -

Product Status Active

Number of Bits 14

Sampling Rate (Per Second) 125M

Number of Inputs 4

Input Type Differential

Data Interface LVDS - Serial

Configuration ADC

Ratio - S/H:ADC -

Number of A/D Converters 4

Architecture Pipelined

Reference Type External, Internal

Voltage - Supply, Analog 1.7V ~ 1.9V

Voltage - Supply, Digital 1.7V ~ 1.9V

Features Simultaneous Sampling

Operating Temperature -40°C ~ 85°C

Package / Case 56-VFQFN Exposed Pad

Supplier Device Package 56-QFN (8x8)

Mounting Type Surface Mount

Base Product Number ADC3444

Datasheet & Documents

Manufacturer Product Page

ADC3444IRTQT Specifications

HTML Datasheet

ADC3444IRTQT-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991C3
HTSUS 8542.39.0001

Additional Information

Other Names
296-43222-6
296-43222-1
296-43222-2
-296-43222-1-DG
ADC3444IRTQT-DG
Standard Package
250

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
ADC3444IRTQ25
Texas Instruments
883
ADC3444IRTQ25-DG
1.0878
Direct

Reviews

5.0/5.0-(Show up to 5 Ratings)
童***書
de desembre 02, 2025
5.0
每次購買這個品牌都非常放心,產品耐用,物流迅速,是我最信賴的電子品牌之一。
夢***所
de desembre 02, 2025
5.0
注文から配送まで迅速に完了し、いつも信頼できるサービスです。
Wildfl***rPoetry
de desembre 02, 2025
5.0
I am consistently impressed with the reliability of DiGi products; they never disappoint.
Peace***Oasis
de desembre 02, 2025
5.0
After-sales support includes detailed technical advice that consistently helps us troubleshoot effectively.
Skybo***Dream
de desembre 02, 2025
5.0
I appreciate the durable construction, which withstands daily wear and tear without any issues.
Brigh***rning
de desembre 02, 2025
5.0
DiGi Electronics' quick shipping reduces waiting time significantly.
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Frequently Asked Questions (FAQ)

What are the key design-in risks when using the ADC3444IRTQT in a high-channel-density data acquisition system operating at 125MSPS?

When integrating the ADC3444IRTQT into a high-channel-density design, one major risk is crosstalk between the four simultaneous-sampling channels due to shared power and ground planes. Given its 1.7V–1.9V dual supply requirements and LVDS serial output, poor layout isolation can degrade SNR and increase jitter. To mitigate this, use dedicated LDOs for analog and digital supplies, implement a solid ground plane with careful via stitching, and route LVDS pairs differentially with controlled impedance (100Ω ±10%) to minimize skew. Also, ensure the external reference is low-noise (<10µV RMS) and properly decoupled to maintain 14-bit accuracy.

Can the ADC3444IRTQT replace the AD9249-125 in an existing medical imaging system, and what are the critical interface differences to address?

Yes, the ADC3444IRTQT can serve as a functional upgrade from the AD9249-125 in multi-channel medical imaging applications due to its similar 14-bit resolution and 125MSPS rate. However, key differences exist: the ADC3444IRTQT uses serial LVDS output versus the AD9249-125's parallel CMOS, requiring redesign of the FPGA capture logic and layout routing. Additionally, the ADC3444IRTQT offers internal and external reference options, enabling better noise control, but demands tighter power supply ripple tolerance (<30mVpp). Ensure the FPGA supports JESD204B or equivalent serial framing, and validate timing margins using the ADC3444IRTQT's programmable output delay feature.

How does the internal reference option in the ADC3444IRTQT impact system-level noise performance in a low-signal-conditioning chain?

The ADC3444IRTQT's internal reference simplifies design by removing the need for an external precision reference, but it increases sensitivity to supply and substrate noise, especially in low-level signal acquisition (e.g., <1Vpp differential). In such cases, switching noise from digital outputs can couple into the internal reference, degrading effective resolution by up to 0.5 bits. To maintain optimal SNR, use the internal reference only in noise-controlled environments with clean power supplies. For better performance, switch to an external ultra-low-noise reference like the REF5025 and bypass the internal reference, particularly in applications like ultrasound front-ends where dynamic range is critical.

What are the reliability concerns when the ADC3444IRTQT operates near its maximum junction temperature in an enclosed industrial enclosure?

Operating the ADC3444IRTQT near its 85°C ambient limit in a sealed industrial enclosure risks exceeding the maximum junction temperature (typically 125°C), especially given its 56-QFN package with exposed thermal pad. Prolonged thermal stress can accelerate electromigration and reduce long-term reliability. To ensure safety margins, verify thermal dissipation using a 4-layer PCB with thermal vias under the exposed pad connected to a ground plane, and consider adding local airflow or a heatsink. Monitor die temperature via the internal sensor (if accessible) or use a simulation tool like TI's SPICE model to estimate power dissipation under sustained 125MSPS operation.

What PCB layout trade-offs arise when routing LVDS serial outputs from the ADC3444IRTQT to a distant FPGA in a noisy industrial environment?

Routing ADC3444IRTQT's LVDS serial outputs over long traces (>10cm) in noisy environments risks signal integrity degradation due to EMI coupling and impedance mismatches. The 14-bit performance demands low jitter (<1ps RMS), which can be compromised without proper layout. Use controlled-impedance differential pairs (100Ω), minimize stub lengths, and avoid crossing split planes. For longer runs, consider LVDS buffer ICs (e.g., SN65LVDS21) and shielded micro-coaxial cables. Also, terminate LVDS lines close to the receiver with 100Ω resistors and keep return paths uninterrupted by using adjacent ground layers, ensuring robust clock-data recovery in the FPGA.

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