Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
ADC12DJ3200AAV
Texas Instruments
IC ADC 12BIT FLASH 144FCBGA
1434 Pcs New Original In Stock
12 Bit Analog to Digital Converter 1, 2 Input 2 Flash 144-FCBGA (10x10)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (371 Ratings)
ADC12DJ3200AAV
Product Overview
1229011
DiGi Electronics Part Number
ADC12DJ3200AAV-DGManufacturer
Texas Instruments
ADC12DJ3200AAV
Description
IC ADC 12BIT FLASH 144FCBGAInventory
1434 Pcs New Original In Stock
12 Bit Analog to Digital Converter 1, 2 Input 2 Flash 144-FCBGA (10x10)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
ADC12DJ3200AAV Technical Specifications
Category
Data Acquisition, Analog to Digital Converters (ADC)
Packaging
Tray
Series
-
Product Status
Active
Number of Bits
12
Sampling Rate (Per Second)
3.2G
Number of Inputs
1, 2
Input Type
Differential, Single Ended
Data Interface
JESD204B
Configuration
MUX-ADC
Ratio - S/H:ADC
0:1
Number of A/D Converters
2
Architecture
Flash
Reference Type
Internal
Voltage - Supply, Analog
1.05V ~ 1.15V, 1.8V ~ 2V
Voltage - Supply, Digital
1.05V ~ 1.15V
Features
Simultaneous Sampling
Operating Temperature
-40°C ~ 85°C
Package / Case
144-FBGA, FCBGA
Supplier Device Package
144-FCBGA (10x10)
Mounting Type
Surface Mount
Base Product Number
ADC12DJ3200
Datasheet & Documents
Manufacturer Product Page
ADC12DJ3200AAV Specifications
HTML Datasheet
ADC12DJ3200AAV-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A001A5A3
HTSUS
8542.39.0001
Additional Information
Other Names
296-47440
ADC12DJ3200AAV-DG
-296-47440-DG
Standard Package
168
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
They handle every inquiry professionally and with a caring attitude.
de desembre 02, 2025
Their support team is proactive and attentive, ensuring I always have the assistance I need.
de desembre 02, 2025
Excellent shipping speed, with a package that was securely sealed and well protected.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
What are the critical power supply design considerations for the ADC12DJ3200AAV to avoid performance degradation in high-speed sampling applications?
For the ADC12DJ3200AAV, maintaining clean and stable analog and digital supplies is critical due to its 3.2GSPS sampling rate and sensitive 12-bit resolution. Use separate low-noise LDOs for the analog (1.05V–1.15V and 1.8V–2V) and digital (1.05V–1.15V) rails, and implement robust decoupling with a mix of 0.1μF, 1μF, and bulk capacitors near each supply pin. Pay special attention to the 1.8V analog supply, as noise here directly impacts SNR. Route analog and digital grounds separately, connecting them only under the ADC with a low-impedance plane to minimize ground bounce and crosstalk in high-speed MUX-ADC configurations. Power integrity simulations are recommended when integrating the ADC12DJ3200AAV into dense PCBs to avoid unexpected jitter or distortion.
How does the ADC12DJ3200AAV compare to the AD9689-3200 when selecting for wideband radar systems with dual-channel synchronization?
When comparing the ADC12DJ3200AAV to the AD9689-3200 for wideband radar, the ADC12DJ3200AAV offers superior jitter performance (55 fs typical) and lower power consumption at 3.2 GSPS, making it better suited for high dynamic range applications. The ADC12DJ3200AAV supports simultaneous sampling on both channels, enabling precise phase coherence where the AD9689-3200 may require external SYSREF tuning. Additionally, the ADC12DJ3200AAV’s internal reference reduces external component count and potential drift. However, ensure your FPGA supports JESD204B subclass 1 deterministic latency, as mismatched lane alignment can negate timing advantages in coherent systems using the ADC12DJ3200AAV.
What PCB layout techniques minimize signal integrity risks when driving high-frequency inputs into the ADC12DJ3200AAV?
To preserve signal integrity with the ADC12DJ3200AAV, use controlled-impedance differential microstrip traces (typically 100Ω) from driver amplifiers to the ADC inputs, keeping traces as short and symmetrical as possible. Avoid vias in signal paths, or if unavoidable, use back-drilled vias to reduce stub resonance. Surround analog input traces with grounded guard rings to reduce crosstalk. Use the ADC12DJ3200AAV’s differential input capability with a high-linearity balun or amplifier like the LMH6401 to convert single-ended signals. Impedance mismatches or poor return paths can cause reflections that degrade ENOB at Nyquist, especially above 1 GHz input bandwidth.
Can the ADC12DJ3200AAV replace the ADC12DJ5200 in an existing design, and what system-level adjustments are required?
Replacing the ADC12DJ5200 with the ADC12DJ3200AAV is feasible for designs needing lower sampling rates (3.2 GSPS vs. 5.2 GSPS), but requires careful system validation. The ADC12DJ3200AAV has lower maximum input bandwidth and different JESD204B lane rate configurations, so verify that your FPGA or ASIC can support the adjusted link parameters (lane count, subclass, and octets per frame). The supply voltages are compatible, but PCB routing changes may be needed due to identical but non-interchangeable pinouts—perform a pin compatibility check. Also, re-characterize clock jitter sensitivity since the ADC12DJ3200AAV may exhibit different phase noise response at lower sampling rates.
What reliability risks should be considered when deploying the ADC12DJ3200AAV in harsh environments with wide temperature cycling?
When using the ADC12DJ3200AAV in harsh environments (-40°C to 85°C), thermal cycling can induce solder fatigue due to CTE mismatch between the 144-FCBGA package and PCB. Mitigate this by following IPC-7095 guidelines for area array packages, including proper stencil design, void control, and minimizing board flex. The MSL3 rating means the device must be reflowed within 168 hours of exposure unless baked, so manage humidity-sensitive handling during assembly. Avoid thermal shock during rework and ensure consistent airflow for thermal management—even though the ADC12DJ3200AAV has excellent thermal performance, hotspots can degrade long-term reliability. Consider conformal coating in high-humidity environments to prevent leakage currents affecting offset stability.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
ADC12DJ3200AAV CAD Models
Texas Instruments ADC12DJ3200AAV PCB symbols & footprints
productDetail
