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ADC08D1520CIYB
Texas Instruments
IC ADC 8BIT FOLD INTERP 128HLQFP
1253 Pcs New Original In Stock
8 Bit Analog to Digital Converter 2 Input 2 Folding Interpolating 128-HLQFP (20x20)
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5.0 / 5.0
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ADC08D1520CIYB
Product Overview
1376587
DiGi Electronics Part Number
ADC08D1520CIYB-DGManufacturer
Texas Instruments
ADC08D1520CIYB
Description
IC ADC 8BIT FOLD INTERP 128HLQFPInventory
1253 Pcs New Original In Stock
8 Bit Analog to Digital Converter 2 Input 2 Folding Interpolating 128-HLQFP (20x20)
Quantity
Minimum 1
Minimum 1
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ADC08D1520CIYB Technical Specifications
Category
Data Acquisition, Analog to Digital Converters (ADC)
Packaging
-
Series
-
Product Status
Obsolete
Number of Bits
8
Sampling Rate (Per Second)
3G
Number of Inputs
2
Input Type
Differential
Data Interface
LVDS - Parallel
Configuration
MUX-S/H-ADC
Ratio - S/H:ADC
1:1
Number of A/D Converters
2
Architecture
Folding Interpolating
Reference Type
Internal
Voltage - Supply, Analog
1.8V ~ 2V
Voltage - Supply, Digital
1.8V ~ 2V
Features
Simultaneous Sampling
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP Exposed Pad
Supplier Device Package
128-HLQFP (20x20)
Mounting Type
Surface Mount
Base Product Number
ADC08D
Datasheet & Documents
HTML Datasheet
ADC08D1520CIYB-DG
Environmental & Export Classification
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A001A5A1
HTSUS
8542.39.0001
Additional Information
Standard Package
60
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Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
包裝設計非常耐用，讓我對他們的品質充滿信心。
de desembre 02, 2025
Their price advantages allow me to buy more without sacrificing quality.
de desembre 02, 2025
Support team was patient and helpful throughout.
de desembre 02, 2025
DiGi Electronics consistently delivers high-quality products that meet my expectations every time, showcasing their commitment to excellence.
de desembre 02, 2025
Their commitment to quality truly shows in their products; I highly recommend them.
de desembre 02, 2025
The expansive range of products demonstrates their adaptability and market awareness.
de desembre 02, 2025
Delivery was quick and efficient, I didn't have to wait long.
de desembre 02, 2025
I appreciate their proactive communication about shipping schedules and post-sale issues.
de desembre 02, 2025
Whenever I contact their support team, they respond within an hour and provide clear, helpful solutions.
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Frequently Asked Questions (FAQ)
Can the ADC08D1520CIYB be safely used in a new design despite being marked as obsolete by Texas Instruments?
No, the ADC08D1520CIYB should not be used in new designs due to its obsolete status. While 1,160 units may be available in stock, TI no longer guarantees production continuity, long-term support, or reliability data updates. Designing in an obsolete component introduces supply chain risk, potential last-time-buy scenarios, and lack of technical support. For new projects, consider pin-compatible or functionally equivalent alternatives like the ADC08D1520CIYB/NOPB (the RoHS-compliant variant) or evaluate newer architectures such as the ADC08DL1520 for improved power efficiency and support lifecycle.
What are the key risks of replacing the ADC08D1520CIYB with a modern 8-bit 3GSPS ADC like the AD9288 in a high-speed radar signal processing system?
Replacing the ADC08D1520CIYB with the AD9288 introduces significant integration risks due to architectural and interface differences. The ADC08D1520CIYB uses a folding interpolating architecture with LVDS parallel output and simultaneous sampling on two channels, while the AD9288 is a pipelined ADC with CMOS outputs and lower sampling rate (100 MSPS). Direct substitution will fail due to mismatched timing, voltage levels, and data throughput. Additionally, the AD9288 lacks the ultra-high-speed performance required for 3GSPS applications. If replacement is necessary, consider TI’s newer high-speed family like the ADC12DJ3200, but expect substantial firmware and PCB layout rework due to JESD204B interface and higher power demands.
How does the folding interpolating architecture of the ADC08D1520CIYB impact signal integrity in wideband communications applications above 1 GHz?
The folding interpolating architecture in the ADC08D1520CIYB enables high sampling rates (3 GSPS) with relatively low power, but it introduces non-linear artifacts such as spurious harmonics and interleaving spurs, especially when sampling signals above 1 GHz. These artifacts can degrade EVM (Error Vector Magnitude) in wideband QAM systems. To mitigate this, ensure strict adherence to analog input bandwidth matching, use high-linearity baluns, and apply digital calibration algorithms post-conversion. Unlike pipeline or SAR ADCs, folding architectures are more sensitive to input slew rate and require careful termination to avoid metastability. Always validate performance with real-world modulated signals, not just sine waves.
Is the ADC08D1520CIYB suitable for automotive radar applications given its operating temperature range of -40°C to 85°C?
No, the ADC08D1520CIYB is not suitable for most automotive radar applications despite meeting the -40°C to 85°C industrial temperature range. Automotive-grade components must comply with AEC-Q100 qualification, which this device lacks. Additionally, its RoHS non-compliant status and obsolete designation disqualify it from new automotive designs. For 77 GHz radar systems requiring high-speed ADCs, consider AEC-Q100 qualified alternatives like the Texas Instruments ADC32RF45, which offers similar sampling performance with automotive reliability, extended temperature validation, and full documentation for functional safety (ISO 26262) workflows.
What PCB layout considerations are critical when designing with the ADC08D1520CIYB’s 128-HLQFP exposed pad package to avoid thermal and signal integrity issues?
The ADC08D1520CIYB’s 128-HLQFP package with an exposed thermal pad demands careful PCB design to manage heat and maintain signal fidelity. The exposed pad must be soldered to a grounded copper pour with multiple thermal vias (≥16) to dissipate heat from the 1.8V analog and digital supplies, especially at 3 GSPS where power dissipation peaks. Poor thermal management can cause junction temperatures to exceed limits, leading to drift in reference voltage and increased SNR degradation. Additionally, route LVDS pairs with controlled impedance (100 Ω differential), minimize length mismatches (<5 mils), and isolate analog ground from digital return paths using a star ground near the package. Failure to do so results in crosstalk, jitter, and reduced effective number of bits (ENOB).
Quality Assurance (QC)
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ADC08D1520CIYB CAD Models
Texas Instruments ADC08D1520CIYB PCB symbols & footprints
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