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74ALVCH32973ZKER
Texas Instruments
IC BUF NON-INVERT 3.6V 96PBGA
1337 Pcs New Original In Stock
Buffer, Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 96-PBGA MICROSTAR (13.6x5.6)
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5.0 / 5.0
- (228 Ratings)
74ALVCH32973ZKER
Product Overview
1247031
DiGi Electronics Part Number
74ALVCH32973ZKER-DGManufacturer
Texas Instruments
74ALVCH32973ZKER
Description
IC BUF NON-INVERT 3.6V 96PBGAInventory
1337 Pcs New Original In Stock
Buffer, Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 96-PBGA MICROSTAR (13.6x5.6)
Quantity
Minimum 1
Minimum 1
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74ALVCH32973ZKER Technical Specifications
Category
Logic, Buffers, Drivers, Receivers, Transceivers
Packaging
-
Series
74ALVCH
Product Status
Obsolete
Logic Type
Buffer, Transceiver, Non-Inverting
Number of Elements
2
Number of Bits per Element
8
Input Type
-
Output Type
3-State
Current - Output High, Low
24mA, 24mA
Voltage - Supply
1.65V ~ 3.6V
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
96-LFBGA
Supplier Device Package
96-PBGA MICROSTAR (13.6x5.6)
Base Product Number
74ALVCH32973
Datasheet & Documents
HTML Datasheet
74ALVCH32973ZKER-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
-296-18282-1
296-18282-6
296-18282-2
-296-18282-1-DG
TEXTIS74ALVCH32973ZKER
-74ALVCH32973ZKER-NDR
2156-74ALVCH32973ZKER
296-18282-1
Standard Package
1,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
생활의 만족도를 높여준 디지 일렉트로닉스의 서비스에 감사드립니다.
de desembre 02, 2025
Très satisfaite par la politique écologique et les prix frontaliers, parfait service.
de desembre 02, 2025
Fast, efficient, and friendly – that sums up my experience with DiGi Electronics.
de desembre 02, 2025
Their pricing advantages help me manage my remote work budget effectively.
de desembre 02, 2025
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de desembre 02, 2025
I am always pleased with their variety and transparent prices, which suit my needs.
de desembre 02, 2025
The people at DiGi Electronics are friendly and always eager to ensure customer satisfaction.
de desembre 02, 2025
Timely delivery enables us to stay on schedule smoothly.
de desembre 02, 2025
Their commitment to providing affordable, high-quality products is commendable.
de desembre 02, 2025
The entire delivery process was smooth, confirming their excellent logistical coordination.
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Frequently Asked Questions (FAQ)
Can the 74ALVCH32973ZKER be used as a drop-in replacement for the 74LVT24245 in a mixed-voltage 3.3V to 2.5V level-shifting application, and what design risks should I consider?
The 74ALVCH32973ZKER is not a direct drop-in replacement for the 74LVT24245 due to differences in voltage translation architecture and output drive. While both operate in the 3.3V range, the 74ALVCH32973ZKER supports true dual-supply level translation using VCC(A) and VCC(B), whereas the 74LVT24245 requires external biasing for lower voltage translation and lacks isolated supplies. A key risk is level compatibility on the input side when interfacing 3.3V signals to a 2.5V system—ensure the 74ALVCH32973ZKER's inputs are referenced to the correct VCC(A) to avoid overvoltage. Additionally, verify signal integrity on high-speed lines due to the 74ALVCH32973ZKER’s 3-state output impedance, which may require series termination in point-to-point topologies. Always confirm pinout alignment—despite similar function, pin mappings differ significantly between these devices.
What are the critical PCB layout considerations when designing in the 74ALVCH32973ZKER to prevent signal integrity issues in high-speed 8-bit bus applications?
When laying out the 74ALVCH32973ZKER, prioritize controlled impedance routing for all signal traces, especially on bidirectional 8-bit buses, to minimize reflections. Use a minimum of four-layer stack-up with solid ground and power planes to ensure low-inductance return paths. Due to the 96-PBGA MICROSTAR package's fine pitch (0.5mm), adhere strictly to IPC-7351 footprint guidelines and include thermal vias under the exposed pad for thermal dissipation and reflow reliability. Route signals in serpentine patterns only if bus skew matching is required, but avoid unnecessary lengthening. Place 0.1μF ceramic decoupling capacitors within 5mm of each VCC pin and use stitching vias to reduce ground bounce. Avoid placing sensitive analog traces underneath or adjacent to the 74ALVCH32973ZKER to prevent coupling noise.
How does the obsolete status of the 74ALVCH32973ZKER impact long-term reliability and lifecycle planning in new designs?
Using the 74ALVCH32973ZKER in new designs poses significant lifecycle risks due to its 'Obsolete' status from Texas Instruments. While current stock (1255 pcs) is available, future supply shortages or complete unavailability can disrupt production and increase obsolescence management costs. For long-term reliability, consider that testing and quality assurance may diminish over time as TI phases out support. Mitigate this by validating alternative buffers such as the SN74AVCH8T245 or SN74LXCH16245A—with similar voltage translation and 3-state output—but note that these require redesign due to different pinouts and electrical characteristics. Engage TI’s PDIP (Product Discontinuance Information Package) to assess last-time-buy (LTB) dates and plan for mid-cycle redesigns.
What thermal management strategies are required when operating the 74ALVCH32973ZKER at 85°C ambient with maximum I/O switching activity?
When operating the 74ALVCH32973ZKER at max ambient temperature (85°C), thermal performance depends heavily on PCB design. The 96-PBGA MICROSTAR package has a junction-to-board thermal resistance (ψJT) of ~15°C/W, so without proper thermal vias and copper planes, junction temperatures can exceed reliability limits even at moderate power levels. Use a minimum 6x6 array of thermal vias under the central thermal pad connected to internal ground planes to enhance heat transfer. Increase surrounding copper pour on both top and inner layers for additional conduction cooling. Monitor power dissipation using worst-case DC load plus dynamic switching current—especially under 24mA drive per output with capacitive loads >30pF. Consider derating I/O activity or adding local airflow if operating near thermal limits.
How does the 3-state output behavior of the 74ALVCH32973ZKER affect bus contention risks in a multi-slave memory interface, and how can it be mitigated?
The 3-state output of the 74ALVCH32973ZKER introduces bus contention risks in multi-slave configurations if output enable (OE) timing is not precisely controlled across all devices. A key issue arises during state transitions—when multiple 74ALVCH32973ZKER devices transition out of high-impedance too closely in time, momentary bus fights can occur, leading to voltage glitches or excess current draw. Mitigate this by ensuring strict synchronization of OE signals using matched trace lengths and avoiding simultaneous enables through time-multiplexed control logic. Add small series resistors (22–33Ω) near the outputs to limit transient current during switching. Additionally, confirm that all slaves have power-rail sequencing aligned to avoid back-powering through I/Os, which can disable the 3-state function unexpectedly.
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74ALVCH32973ZKER CAD Models
Texas Instruments 74ALVCH32973ZKER PCB symbols & footprints
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