Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
FSAM15SL60
onsemi
SMART POWER MODULE 15A SPM32-AA
36700 Pcs New Original In Stock
Power Driver Module IGBT 3 Phase 600 V 15 A 32-PowerDIP Module (1.370", 34.80mm)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (233 Ratings)
FSAM15SL60
Product Overview
7801028
DiGi Electronics Part Number
FSAM15SL60-DGManufacturer
onsemi
FSAM15SL60
Description
SMART POWER MODULE 15A SPM32-AAInventory
36700 Pcs New Original In Stock
Power Driver Module IGBT 3 Phase 600 V 15 A 32-PowerDIP Module (1.370", 34.80mm)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
FSAM15SL60 Technical Specifications
Category
Power Driver Modules
Packaging
-
Series
SPM®
Product Status
Obsolete
Type
IGBT
Configuration
3 Phase
Current
15 A
Voltage
600 V
Voltage - Isolation
2500Vrms
Mounting Type
Through Hole
Package / Case
32-PowerDIP Module (1.370", 34.80mm)
Base Product Number
FSAM15
Datasheet & Documents
HTML Datasheet
FSAM15SL60-DG
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
FSAM15SL60-NDR
FSAM15SL60_NL-DG
FSAM15SL60_NL
Standard Package
8
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Les prix sont très avantageux et leur service après-vente est toujours prompt et professionnel.
de desembre 02, 2025
Les produits sont bien fabriqués et arrivent toujours à la date prévue.
de desembre 02, 2025
The reliability of their products has saved me from frequent replacements.
de desembre 02, 2025
Always happy with my purchases from DiGi Electronics, especially noting their affordable prices and green packaging.
de desembre 02, 2025
Navigation menus are logically arranged, which helped me find what I needed swiftly.
de desembre 02, 2025
Even in challenging shipping conditions, the product remained undamaged, thanks to excellent packing.
de desembre 02, 2025
Site usability is outstanding, with well-placed menus and clear instructions.
de desembre 02, 2025
DiGi Electronics’s team is always professional and eager to assist, which I greatly appreciate.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
Can the FSAM15SL60 be used as a drop-in replacement for the older FSAM15SH60 in a 3-phase motor drive design, and what layout or thermal risks should I consider?
While the FSAM15SL60 and FSAM15SH60 share the same SPM32-AA package and 15 A / 600 V ratings, the 'L' suffix indicates a lower switching speed IGBT variant, which may increase conduction losses but reduce EMI. You can use the FSAM15SL60 as a functional replacement, but verify gate drive timing compatibility—especially dead time settings—to avoid shoot-through. Additionally, because the FSAM15SL60 is now obsolete, long-term sourcing risk is high; consider redesigning with a modern alternative like the ON Semiconductor NFAM1560L4B (Automotive-grade SPM) if production longevity is required. Ensure your heatsink and PCB copper area meet the thermal resistance requirements, as degraded thermal performance could lead to premature failure under cyclic loads.
What are the critical design constraints when integrating the FSAM15SL60 into a high-vibration industrial inverter, given its through-hole 32-PowerDIP package?
The FSAM15SL60’s 32-PowerDIP through-hole mounting provides good mechanical stability, but in high-vibration environments (e.g., HVAC compressors or conveyor drives), you must reinforce the PCB with additional mounting points near the module and use strain relief on external wiring. Avoid placing heavy components or connectors near the module to prevent mechanical stress on leads. Also, ensure the PCB material has sufficient flexural strength (e.g., FR4 with Tg > 170°C) and consider conformal coating to protect against moisture and particulate ingress. Vibration can exacerbate fatigue at solder joints over time, so inspect for microcracks during reliability testing, especially if operating near the 2500Vrms isolation limit under transient surge conditions.
How does the FSAM15SL60 compare to the Infineon FP15R12W2T7 in terms of reliability and switching performance for a 1.5 kW solar microinverter application?
The FSAM15SL60 (onsemi) and FP15R12W2T7 (Infineon) are both 15 A, 600–1200 V IGBT-based smart power modules, but they target different design philosophies. The FSAM15SL60 uses a slower IGBT optimized for lower EMI and simpler gate driving, making it suitable for cost-sensitive motor drives, while the FP15R12W2T7 employs a faster TRENCHSTOP™ IGBT with lower switching losses, better suited for high-frequency microinverter topologies. For a 1.5 kW solar microinverter, the Infineon part will yield higher efficiency and smaller magnetics, but at a higher BOM cost. However, since the FSAM15SL60 is obsolete, sourcing continuity is a major risk—designing in the FP15R12W2T7 or its successor (e.g., FP15R12W2T7_B11) provides better long-term support and reliability under thermal cycling.
What isolation and creepage considerations are critical when designing a control interface for the FSAM15SL60 in a 400 VAC three-phase system?
Although the FSAM15SL60 provides 2500Vrms functional isolation between the power stage and control logic, your PCB layout must maintain adequate creepage and clearance distances per IEC 61800-5-1 for 400 VAC systems. Maintain at least 6.4 mm creepage and 4.0 mm clearance between primary (power) and secondary (control) sides. Use slotting in the PCB or isolation barriers if space is constrained. Also, ensure that gate drive signals referencing the floating emitter terminals do not create unintended ground loops—use isolated gate drivers or optocouplers with sufficient CMTI (>50 kV/μs). Failure to respect these spacing and isolation rules can lead to arcing or latch-up during high dv/dt transients, especially under humid or polluted environments.
Given that the FSAM15SL60 is marked as obsolete, what are the most reliable second-source or upgrade paths without requiring a full PCB respin?
Since the FSAM15SL60 is obsolete, immediate second-sourcing is limited, but you can evaluate pin-compatible or footprint-adaptable alternatives. The onsemi NFAM1560L4B (SPM32-AA package) is a direct functional upgrade with enhanced thermal performance and automotive qualification, though it may require minor gate resistor adjustments due to different IGBT characteristics. Alternatively, Mitsubishi’s CM15MD-12H offers similar ratings in a comparable DIP package but uses a different pinout—requiring a small adapter PCB. For future-proofing, consider migrating to a surface-mount intelligent power module like the Infineon CIPOS™ Mini IM620A1, which reduces footprint by 40% and improves thermal cycling performance. Always validate switching waveforms and thermal behavior in your actual load profile before finalizing any replacement to avoid unexpected EMI or overcurrent issues.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
FSAM15SL60 CAD Models
onsemi FSAM15SL60 PCB symbols & footprints
productDetail
