FPDB50PH60 >
FPDB50PH60
onsemi
MODULE SPM 600V 30A SPMHA
1420 Pcs New Original In Stock
Power Driver Module IGBT 2 Phase 600 V 30 A 27-PowerDIP Module (1.205", 30.60mm)
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FPDB50PH60 onsemi
5.0 / 5.0 - (231 Ratings)

FPDB50PH60

Product Overview

7800916

DiGi Electronics Part Number

FPDB50PH60-DG

Manufacturer

onsemi
FPDB50PH60

Description

MODULE SPM 600V 30A SPMHA

Inventory

1420 Pcs New Original In Stock
Power Driver Module IGBT 2 Phase 600 V 30 A 27-PowerDIP Module (1.205", 30.60mm)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 52.1560 52.1560
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FPDB50PH60 Technical Specifications

Category Power Driver Modules

Manufacturer onsemi

Packaging -

Series PFC SPM® 3

Product Status Obsolete

Type IGBT

Configuration 2 Phase

Current 30 A

Voltage 600 V

Voltage - Isolation 2500Vrms

Mounting Type Through Hole

Package / Case 27-PowerDIP Module (1.205", 30.60mm)

Base Product Number FPDB50

Datasheet & Documents

HTML Datasheet

FPDB50PH60-DG

Environmental & Export Classification

Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
2266-FPDB50PH60
Standard Package
60

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
FPDB60PH60B
onsemi
3647
FPDB60PH60B-DG
15.1950
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Reviews

5.0/5.0-(Show up to 5 Ratings)
陽***者
de desembre 02, 2025
5.0
產品非常耐用,經過多次使用仍然沒有任何損壞,證明製造品質非常可靠。
彩***者
de desembre 02, 2025
5.0
寄送速度超快,服務效率值得讚賞,每次合作都很愉快!
Sil***Lark
de desembre 02, 2025
5.0
The staff is genuinely friendly and eager to help, making shopping hassle-free.
Gold***ield
de desembre 02, 2025
5.0
The complete and professional packaging enhances my overall experience.
Fabl***nder
de desembre 02, 2025
5.0
I would recommend DiGi Electronics to anyone seeking reliable solutions.
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Frequently Asked Questions (FAQ)

Can FPDB50PH60 be used as a direct replacement for FPDB60PH60B in an existing PFC stage design, and what design-in risks should I consider?

While FPDB50PH60 and FPDB60PH60B share similar voltage (600 V) and current (30 A) ratings and both belong to onsemi’s SPM® 3 family, they are not guaranteed pin-to-pin or electrically identical replacements. The FPDB60PH60B includes updated internal protection features and potentially different gate drive characteristics. Substituting FPDB50PH60—especially in a design originally validated with FPDB60PH60B—risks altered thermal performance, increased EMI, or degraded short-circuit protection. Since FPDB50PH60 is marked as obsolete, long-term supply is also a concern. Always verify gate threshold compatibility, thermal derating, and protection circuit thresholds before using FPDB50PH60 as a drop-in substitute; consider redesigning with an active-status equivalent if reliability is critical.

What are the most critical PCB layout practices to follow when integrating the FPDB50PH60 into a high-frequency PFC circuit?

When designing with the FPDB50PH60, minimizing gate loop inductance is critical to prevent voltage spikes and switching losses. Use short, wide gate traces with tight coupling to the driver ground, and place the gate resistor as close as possible to the module’s input pins. Shield high-current AC paths like the phase outputs using ground planes to reduce EMI. Given the 27-pin PowerDIP package, ensure adequate copper thickness (≥2 oz) on power layers to handle 30 A without excessive temperature rise. Also, respect the 2500Vrms isolation rating by maintaining proper creepage and clearance distances (>4 mm) between primary and secondary sides—especially across isolation barriers in the control circuitry.

How does the obsolete status of FPDB50PH60 impact reliability and long-term system support in industrial applications?

The obsolete status of FPDB50PH60 introduces significant lifecycle risks for industrial or medical applications requiring long-term serviceability. Although current stock exists, future re-spins may face component unavailability, forcing redesigns under time pressure. Furthermore, obsolete parts are less likely to receive technical support or reliability updates from onsemi. If using FPDB50PH60, secure extended lifecycle buy quantities and verify replacement compatibility early—preferably with active-status alternatives like FPDB60PH60B or newer SPM® generations. Monitor onsemi’s PDN (Product Discontinuance Notice) bulletins to avoid last-minute supply disruptions.

What thermal design margin should I assume when operating FPDB50PH60 at 30 A in a 60°C ambient environment?

Operating FPDB50PH60 at its rated 30 A in a 60°C ambient requires careful thermal management. The module lacks an integrated heatsink, so junction temperature depends entirely on external PCB layout and airflow. In still air, even with a 3 oz copper pad, thermal resistance can exceed 4°C/W, leading to junction temperatures over 120°C under full load—close to the maximum recommended operating limit. To ensure reliability, derate current to 20–22 A or implement forced airflow (≥200 LFM) and an external heatsink. Include a local NTC near the FPDB50PH60 mounting area to enable thermal foldback and prevent thermal runaway during load transients.

How does the FPDB50PH60 compare to discrete IGBT solutions in terms of system-level integration and protection for motor drive applications?

Compared to discrete IGBTs, the FPDB50PH60 offers integrated gate drivers, bootstrap diodes, and overcurrent protection in a single 2-phase module, reducing board complexity and improving timing consistency between phases. It simplifies design-in by eliminating individual gate driver ICs and current sensing resistors. However, discrete solutions offer greater flexibility in thermal management and per-leg customization. The FPDB50PH60’s compact PowerDIP package may limit heat dissipation in space-constrained designs. Also, since it lacks real-time temperature feedback pins, external thermal sensing is required for robust thermal protection—unlike some discrete IGBTs with built-in NTCs. Weigh integration benefits against upgradeability and cooling scalability based on system requirements.

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