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FCAS30DN60BB
onsemi
MODULE SPM FOR SRM 600V SPM20-BC
22510 Pcs New Original In Stock
Power Driver Module IGBT 2 Phase 600 V 30 A 20-PowerSIP Module, Formed Leads
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Minimum 1
5.0 / 5.0
- (362 Ratings)
FCAS30DN60BB
Product Overview
7767174
DiGi Electronics Part Number
FCAS30DN60BB-DGManufacturer
onsemi
FCAS30DN60BB
Description
MODULE SPM FOR SRM 600V SPM20-BCInventory
22510 Pcs New Original In Stock
Power Driver Module IGBT 2 Phase 600 V 30 A 20-PowerSIP Module, Formed Leads
Quantity
Minimum 1
Minimum 1
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FCAS30DN60BB Technical Specifications
Category
Power Driver Modules
Packaging
-
Series
SPM®
Product Status
Obsolete
Type
IGBT
Configuration
2 Phase
Current
30 A
Voltage
600 V
Voltage - Isolation
1500Vrms
Mounting Type
Through Hole
Package / Case
20-PowerSIP Module, Formed Leads
Base Product Number
FCAS3
Datasheet & Documents
HTML Datasheet
FCAS30DN60BB-DG
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
11
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
가격 대비 뛰어난 품질과 지속적인 사후 서비스 덕분에 만족스럽습니다.
de desembre 02, 2025
產品一如既往的穩定，讓我的工作更順利。
de desembre 02, 2025
Die Lieferung kam viel früher als erwartet. Toller Service!"
de desembre 02, 2025
Ich bin sehr zufrieden mit der Versandlogistik – alles lief reibungslos.
de desembre 02, 2025
Fast shipping combined with well-protected packaging exceeded my expectations.
de desembre 02, 2025
Fast shipping and durable quality—these are the main reasons I keep choosing DiGi Electronics for my electronic needs.
de desembre 02, 2025
Affordable prices and eco-conscious packaging—DiGi Electronics makes it easy to choose green.
de desembre 02, 2025
The website provides a seamless browsing experience, making it easy to find what I need.
de desembre 02, 2025
Quick shipping times and proactive support made my experience with DiGi Electronics excellent.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the FCAS30DN60BB in new motor control applications given its obsolete status?
Using the FCAS30DN60BB in new designs carries significant supply chain and lifecycle risks due to its obsolete status. While functional for prototypes or repair, long-term availability is uncertain. Engineers should evaluate alternative SPM® modules like the FSL316N or FAM65xxx series early in the design cycle. If proceeding with FCAS30DN60BB, secure lifetime buys and validate second-source availability. Consider pin-compatible alternatives and verify gate drive compatibility and thermal performance under real load conditions to mitigate future obsolescence issues.
How does the FCAS30DN60BB compare to the Mitsubishi PM200DSA060 in 2-phase SRM drives, and can it be used as a drop-in replacement?
The FCAS30DN60BB and PM200DSA060 both support 600 V, 2-phase configurations but differ in packaging and drive requirements. The FCAS30DN60BB uses a 20-PowerSIP through-hole form with integrated drivers, while the PM200DSA060 uses a larger dual-in-line package with isolated substrates. It is not a drop-in replacement—thermal design, footprint, and gate threshold voltages differ. When replacing, ensure gate drive voltage (TTL vs. CMOS logic levels) and desaturation protection circuitry are compatible. Always re-validate switching losses and EMI performance.
What thermal design considerations are critical when integrating the FCAS30DN60BB in high-ambient-temperature environments?
The FCAS30DN60BB requires careful thermal management, especially above 70°C ambient. Due to its through-hole mounting and formed leads, thermal transfer to the PCB is limited. Use thick copper planes (≥2 oz), multiple thermal vias, and an external heatsink if operated near 30 A loads. Monitor case temperature at TP1 test point during full-load testing. Derate current by 15–20% without forced airflow. Avoid using in sealed enclosures without thermal modeling, as hotspots can accelerate IGBT degradation and trigger thermal shutdown.
Can the FCAS30DN60BB reliably drive switched reluctance motors (SRMs) with high inrush current transients, and what protection features should be enabled?
Yes, the FCAS30DN60BB is specifically designed for SRM applications with robust overcurrent handling, but design-in risks include false desaturation triggering during commutation spikes. Ensure the external desaturation detection RC filter is tuned to ignore fast transients not indicative of a fault. Use isolated current sensing for real-time monitoring. Enable soft shutdown via the FAULT pin interface and implement pre-charge circuitry to limit inrush during startup. Avoid hard switching at high DC bus voltages without snubbers to prevent avalanche stress on the IGBTs.
What are the reliability implications of using FCAS30DN60BB in industrial equipment with frequent start-stop cycles?
Frequent start-stop cycles increase thermal cycling stress on the FCAS30DN60BB’s solder joints and wire bonds due to PCB flex and CTE mismatch. With MSL-1 rating, moisture resistance is excellent, but mechanical fatigue from thermal swings is a key failure mode. Designers should limit switching frequency during ramp-up/down and implement dwell timing between cycles. Monitor for gate oxide degradation over time—especially if bus voltage exceeds 540 V regularly. For high-cycle industrial systems, consider newer SPM-6 modules with enhanced robustness, or add predictive maintenance alerts based on temperature logging.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
FCAS30DN60BB CAD Models
onsemi FCAS30DN60BB PCB symbols & footprints
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