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XPC8260VVIFBC
NXP USA Inc.
IC MPU MPC82XX 200MHZ 480TBGA
1269 Pcs New Original In Stock
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5)
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*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (170 Ratings)
XPC8260VVIFBC
Product Overview
7285757
DiGi Electronics Part Number
XPC8260VVIFBC-DGManufacturer
NXP USA Inc.
XPC8260VVIFBC
Description
IC MPU MPC82XX 200MHZ 480TBGAInventory
1269 Pcs New Original In Stock
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
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XPC8260VVIFBC Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
MPC82xx
Product Status
Obsolete
Core Processor
PowerPC G2
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
200MHz
Co-Processors/DSP
Communications; RISC CPM
RAM Controllers
DRAM, SDRAM
Graphics Acceleration
No
Display & Interface Controllers
-
Ethernet
10/100Mbps (3)
SATA
-
USB
-
Voltage - I/O
3.3V
Operating Temperature
0°C ~ 105°C (TA)
Security Features
-
Mounting Type
Surface Mount
Package / Case
480-LBGA Exposed Pad
Supplier Device Package
480-TBGA (37.5x37.5)
Additional Interfaces
I2C, SCC, SMC, SPI, UART, USART
Base Product Number
XPC82
Datasheet & Documents
HTML Datasheet
XPC8260VVIFBC-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A991B4B
HTSUS
8542.31.0001
Additional Information
Other Names
935325391557
Standard Package
21
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
DiGi Electronics의 가격 우위와 빠른 배송 덕분에 계속 구매하게 됩니다.
de desembre 02, 2025
배송 과정도 투명하게 관리되어서 신뢰가 갑니다.
de desembre 02, 2025
The checkout process is designed to be quick and easy, reducing any shopping frustration.
de desembre 02, 2025
Great value for money—products are well-packaged and priced competitively.
de desembre 02, 2025
Their packaging process is meticulous, showing attention to detail.
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Frequently Asked Questions (FAQ)
Can the XPC8260VVIFBC be used as a drop-in replacement for the older MPC8260AZP200 in a legacy telecom control board, and what design risks should I consider given its obsolete status?
While the XPC8260VVIFBC is functionally compatible with the MPC8260AZP200 due to shared PowerPC G2 core architecture and pinout similarity in the 480-TBGA package, it is not a true drop-in replacement without validation. Key risks include potential differences in power sequencing requirements, CPM (Communications Processor Module) timing margins at 200MHz, and long-term availability. Since the XPC8260VVIFBC is marked obsolete by NXP, sourcing authentic units becomes critical—verify supplier traceability to avoid counterfeit parts. Additionally, ensure your PCB layout accounts for the exposed pad thermal design, as improper grounding or thermal vias can lead to overheating under sustained load, especially near the 105°C TA limit.
What are the critical thermal management considerations when designing a system around the XPC8260VVIFBC, particularly in enclosed industrial environments operating near 85°C ambient?
The XPC8260VVIFBC’s maximum operating temperature is 105°C (TA), but sustained operation near this limit—especially in enclosed industrial enclosures—requires aggressive thermal design. The 480-TBGA package with an exposed pad demands a well-designed thermal ground plane with multiple vias to dissipate heat from the die. Without adequate copper pours and airflow, junction temperatures can exceed safe limits, leading to throttling or premature failure. Use thermal simulation tools to model heat dissipation, and consider adding a small heatsink or thermal interface material if natural convection is insufficient. Also, monitor MSL 3 handling: exposure to ambient humidity beyond 168 hours without proper baking increases popcorning risk during reflow.
How does the XPC8260VVIFBC compare to the newer NXP QorIQ P1010 in terms of migration feasibility for a current design requiring similar 32-bit Power Architecture performance and communication peripherals?
The XPC8260VVIFBC and QorIQ P1010 both target embedded communication applications, but the P1010 offers significant advantages: higher performance (up to 800MHz e500 core), integrated SerDes, DDR3 memory support, and active NXP lifecycle support. Migrating from the XPC8260VVIFBC to the P1010 requires a full hardware and software redesign due to architectural differences (e500 vs. G2 core), different memory controllers (SDRAM vs. DDR3), and updated peripheral interfaces. However, the P1010 provides better long-term reliability, lower power consumption, and enhanced security features. If your project demands future-proofing and supply continuity, migration is strongly advised—despite the upfront engineering cost—because the XPC8260VVIFBC’s obsolete status poses increasing procurement and compliance risks.
What signal integrity and PCB layout challenges arise when routing the 10/100 Ethernet interfaces on the XPC8260VVIFBC in a high-noise industrial environment, and how can they be mitigated?
The XPC8260VVIFBC integrates three 10/100 Ethernet MACs, but their performance in electrically noisy environments depends heavily on PCB layout and isolation. Key challenges include maintaining differential pair impedance (100Ω ±10%) for RMII or MII interfaces, minimizing crosstalk between high-speed signals and sensitive analog sections, and ensuring clean power delivery to the I/O banks (3.3V). Route Ethernet traces away from switching regulators and clock lines, use ground planes beneath magnetics, and include TVS diodes on RJ45 connectors for ESD protection. Also, verify that your PHY selection (e.g., Micrel KSZ8041 or similar) matches the XPC8260VVIFBC’s voltage levels and timing requirements—mismatched rise times can cause packet loss under load.
Given that the XPC8260VVIFBC is obsolete and RoHS3 compliant, what are the risks of using it in a new medical device design targeting FDA approval, and are there compliant alternatives?
Using the XPC8260VVIFBC in a new medical device poses significant regulatory and supply chain risks despite its RoHS3 compliance. Its obsolete status means NXP no longer guarantees production continuity, which conflicts with FDA expectations for long-term component availability and change notification (per 21 CFR Part 820). Additionally, lack of ongoing reliability data and errata updates increases validation burden. For new designs, consider migrating to a supported alternative like the NXP Layerscape LX2160A (for higher performance) or QorIQ T1022 (for similar 32-bit Power Architecture needs), both of which offer full documentation, longevity programs, and enhanced functional safety support. If you must use the XPC8260VVIFBC, secure a lifetime buy and implement rigorous incoming inspection and burn-in testing to mitigate field failure risks.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
XPC8260VVIFBC CAD Models
NXP USA Inc. XPC8260VVIFBC PCB symbols & footprints
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