P1013NSE2LFB >
P1013NSE2LFB
NXP USA Inc.
IC MPU QORIQ P1 1.055GHZ PBGA689
9249 Pcs New Original In Stock
PowerPC e500v2 Microprocessor IC QorIQ P1 1 Core, 32-Bit 1.055GHz 689-TEPBGA II (31x31)
Request Quote (Ships tomorrow)
*Quantity
Minimum 1
P1013NSE2LFB NXP USA Inc.
5.0 / 5.0 - (248 Ratings)

P1013NSE2LFB

Product Overview

7277830

DiGi Electronics Part Number

P1013NSE2LFB-DG

Manufacturer

NXP USA Inc.
P1013NSE2LFB

Description

IC MPU QORIQ P1 1.055GHZ PBGA689

Inventory

9249 Pcs New Original In Stock
PowerPC e500v2 Microprocessor IC QorIQ P1 1 Core, 32-Bit 1.055GHz 689-TEPBGA II (31x31)
Quantity
Minimum 1

Purchase and inquiry

Quality Assurance

365 - Day Quality Guarantee - Every part fully backed.

90 - Day Refund or Exchange - Defective parts? No hassle.

Limited Stock, Order Now - Get reliable parts without worry.

Global Shipping & Secure Packaging

Worldwide Delivery in 3-5 Business Days

100% ESD Anti-Static Packaging

Real-Time Tracking for Every Order

Secure & Flexible Payment

Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more

All payments encrypted for security

In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 30.6306 30.6306
Better Price by Online RFQ.
Request Quote (Ships tomorrow)
* Quantity
Minimum 1
(*) is mandatory
We'll get back to you within 24 hours

P1013NSE2LFB Technical Specifications

Category Embedded, Microprocessors

Manufacturer NXP Semiconductors

Packaging -

Series QorIQ P1

Product Status Obsolete

Core Processor PowerPC e500v2

Number of Cores/Bus Width 1 Core, 32-Bit

Speed 1.055GHz

Co-Processors/DSP Security; SEC

RAM Controllers DDR2, DDR3

Graphics Acceleration No

Display & Interface Controllers LCD

Ethernet 10/100/1000Mbps (2)

SATA SATA 3Gbps (2)

USB USB 2.0 + PHY (2)

Voltage - I/O -

Operating Temperature 0°C ~ 105°C (TA)

Security Features Cryptography, Random Number Generator

Mounting Type Surface Mount

Package / Case 689-BBGA Exposed Pad

Supplier Device Package 689-TEPBGA II (31x31)

Additional Interfaces DUART, I2C, I2S, MMC/SD, SPI

Base Product Number P1013

Datasheet & Documents

HTML Datasheet

P1013NSE2LFB-DG

PCN Design/Specification

Datasheet Revision 19/Sep/2013

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1 FRE
HTSUS 8542.31.0001

Additional Information

Other Names
2156-P1013NSE2LFB
935321514557
NXPFREP1013NSE2LFB
Standard Package
27

Reviews

5.0/5.0-(Show up to 5 Ratings)
Bris***Lune
de desembre 02, 2025
5.0
La stabilité de leur service de livraison est excellente, même lors de périodes de forte demande.
Suns***eSoul
de desembre 02, 2025
5.0
DiGi Electronics' responsive customer support makes remote work hassle-free.
Evergr***Spirit
de desembre 02, 2025
5.0
Tracking my package was seamless and convenient, I appreciated their transparency.
Whisp***ngMist
de desembre 02, 2025
5.0
DiGi Electronics’ products feel precision-engineered and reliable for professional use.
Publish Evalution
* Product Rating
(Normal/Preferably/Outstanding, default 5 stars)
* Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.

Frequently Asked Questions (FAQ)

What are the key design-in risks when using the P1013NSE2LFB in a new embedded system given its obsolete status?

Using the P1013NSE2LFB in new designs carries significant supply chain risk due to its obsolete status. While 9200 units are available now, future availability is not guaranteed, which could jeopardize long-term production or field serviceability. Engineers should secure lifetime buys or evaluate migration paths to active NXP QorIQ T1 or T2 series processors. Consider obsolescence early in the design phase to avoid costly redesigns later, especially for industrial or transportation applications with 10+ year lifecycle requirements.

How does the P1013NSE2LFB compare to the NXP T1042RDB in terms of performance and peripheral integration for networking applications?

The P1013NSE2LFB offers comparable DDR3 and dual Gigabit Ethernet support to the T1042RDB but lacks advanced packet processing and has a lower 1.055GHz clock versus the T1042's 1.4GHz. The T1042 also supports more PCIe lanes and has better scalability for complex control plane tasks. For new networking designs requiring long-term support and higher throughput, the T1042RDB is preferable. However, the P1013NSE2LFB may still suit lower-bandwidth, cost-sensitive applications where legacy software relies on PowerPC e500v2 architecture.

What thermal design considerations are critical when using the P1013NSE2LFB in a 689-TEPBGA II package at maximum clock speed?

The P1013NSE2LFB's 689-TEPBGA II package has a large thermal pad requiring proper PCB via array and heatsinking to manage junction temperatures, especially under sustained 1.055GHz operation. Operating at up to 105°C ambient demands a minimum 4-layer board with solid thermal ground planes and optimized airflow. Ensure the exposed pad is soldered correctly to prevent delamination or thermal runaway. Use NXP’s thermal resistance data during layout to model θJA and validate with thermal imaging in prototype testing.

Can the P1013NSE2LFB replace the P1023RDB-P in an existing industrial control design, and what are the integration trade-offs?

The P1013NSE2LFB can functionally replace the P1023RDB-P in many control applications since both share the PowerPC e500v2 core and similar peripherals like dual Gigabit Ethernet and USB 2.0. However, the P1023 includes a hardware floating-point unit (FPU) absent in the P1013, impacting math-intensive control algorithms. Additionally, DDR3 support in both requires updated memory calibration. Software porting may require adjustments for register offsets and missing FPU instructions. Verify real-time response in your application before committing to the P1013NSE2LFB due to performance differences.

What reliability concerns should be addressed when deploying the P1013NSE2LFB in automotive or harsh environment applications?

While the P1013NSE2LFB operates from 0°C to 105°C, it's not AEC-Q100 qualified and lacks extended temperature grades needed for under-hood automotive use. Its MSL 3 rating (168-hour floor life) requires strict humidity control during assembly, increasing manufacturing complexity. In harsh environments, ensure conformal coating and controlled power sequencing to avoid latch-up. For mission-critical systems, consider automotive-grade alternatives like NXP's S32V or T series. Use the P1013NSE2LFB only in enclosed, temperature-managed industrial settings with robust ESD protection.

Quality Assurance (QC)

DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.

Quality Assurance
Counterfeit and defect prevention

Counterfeit and defect prevention

Comprehensive screening to identify counterfeit, refurbished, or defective components, ensuring only authentic and compliant parts are delivered.

Visual and packaging inspection

Visual and packaging inspection

Electrical performance verification

Verification of component appearance, markings, date codes, packaging integrity, and label consistency to ensure traceability and conformity.

Life and reliability evaluation

DiGi Certification
Blogs & Posts
P1013NSE2LFB CAD Models
productDetail
Please log in first.
No account yet? Register