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MPC870CVR133
NXP Semiconductors
IC MPU MPC8XX 133MHZ 256BGA
2190 Pcs New Original In Stock
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)
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5.0 / 5.0
- (431 Ratings)
MPC870CVR133
Product Overview
5895005
DiGi Electronics Part Number
MPC870CVR133-DGManufacturer
NXP Semiconductors
MPC870CVR133
Description
IC MPU MPC8XX 133MHZ 256BGAInventory
2190 Pcs New Original In Stock
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)
Quantity
Minimum 1
Minimum 1
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MPC870CVR133 Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
MPC8xx
Product Status
Obsolete
Core Processor
MPC8xx
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
133MHz
Co-Processors/DSP
Communications; CPM
RAM Controllers
DRAM
Graphics Acceleration
No
Display & Interface Controllers
-
Ethernet
10/100Mbps (2)
SATA
-
USB
USB 2.0 (1)
Voltage - I/O
3.3V
Operating Temperature
-40°C ~ 100°C (TA)
Security Features
-
Mounting Type
Surface Mount
Package / Case
256-BBGA
Supplier Device Package
256-PBGA (23x23)
Additional Interfaces
I2C, PCMCIA, SPI, TDM, UART
Base Product Number
MPC87
Datasheet & Documents
HTML Datasheet
MPC870CVR133-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
2832-MPC870CVR133
935309613557
Standard Package
60
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Le service client de DiGi Electronics est toujours discret, courtois et efficace.
de desembre 02, 2025
Ich vertraue auf die Qualität von DiGi Electronics, weil ihre Produkte langlebig und robust sind.
de desembre 02, 2025
Customer support was easily accessible, and the entire process was smooth.
de desembre 02, 2025
Their products stand out for their excellent craftsmanship and value.
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Frequently Asked Questions (FAQ)
Can the MPC870CVR133 be used as a drop-in replacement for the MPC860TZQ133 in a legacy telecom control board, and what are the key integration risks?
The MPC870CVR133 is not a direct drop-in replacement for the MPC860TZQ133 due to differences in pinout, power sequencing requirements, and internal peripheral configurations—despite both being part of the MPC8xx family and sharing a 133MHz core. The MPC870CVR133 integrates a Communications Processor Module (CPM) optimized for lower-power applications, whereas the MPC860TZQ133 targets higher I/O throughput with enhanced SCC channels. Key risks include mismatched memory interface timing (especially DRAM controller settings), altered interrupt handling behavior, and potential incompatibility with existing boot ROM code that assumes MPC860-specific register mappings. Always validate power-on reset timing and recompile boot firmware using the MPC870CVR133’s reference manual before deployment.
What are the critical thermal and layout considerations when designing a PCB around the MPC870CVR133 in an industrial enclosure with ambient temperatures up to 85°C?
The MPC870CVR133 has an operating temperature range of -40°C to 100°C (TA), but sustained operation near the upper limit requires careful thermal management due to its 256-PBGA package and lack of integrated heat spreader. At 85°C ambient, junction temperature can exceed safe limits without proper airflow or thermal vias under the package. Designers must implement a solid ground plane beneath the BGA, use ≥8 thermal vias (0.3mm drill) connected to internal ground layers, and maintain adequate spacing from high-power components. Additionally, signal integrity degrades at elevated temperatures—ensure impedance-controlled routing for the 133MHz bus and avoid long stubs on high-speed lines like the 10/100 Ethernet interfaces to prevent timing violations.
How does the MPC870CVR133 compare to the newer NXP QorIQ P1010 in terms of long-term availability, software migration effort, and suitability for new designs despite its obsolete status?
Although the MPC870CVR133 is marked obsolete, it remains viable for sustaining legacy systems, but it is not recommended for new designs due to lack of future support and limited ecosystem tools. In contrast, the QorIQ P1010 offers a modern ARM-based architecture, higher performance (up to 800MHz), integrated security engine, and active lifecycle support. Migrating from the MPC870CVR133 to the P1010 requires significant software rework—the Power Architecture e300 core differs substantially from ARM Cortex-A5, and legacy CPM-based drivers (e.g., for TDM or SPI) must be rewritten for Linux or bare-metal frameworks on the P1010. If redesigning, factor in BOM cost, power efficiency, and long-term supply chain risks; for existing MPC870CVR133 deployments, secure last-time buys and consider emulation or FPGA-based pin-compatible bridges if obsolescence becomes critical.
What are the risks of using the MPC870CVR133’s USB 2.0 interface in a field-upgradable device exposed to frequent plug/unplug cycles in harsh environments?
The MPC870CVR133’s single USB 2.0 controller is functional but lacks advanced fault protection features found in modern SoCs, making it susceptible to ESD, overcurrent, and signal integrity issues in rugged field environments. Repeated plugging/unplugging without robust external protection can degrade the PHY layer or cause latch-up, especially if the host or peripheral devices violate USB voltage tolerances. To mitigate risk, always include TVS diodes (e.g., NXP IP4234CZ6) on D+/D− lines, implement current-limiting circuitry on VBUS, and use shielded connectors with proper grounding. Additionally, firmware must handle USB suspend/resume states carefully—the MPC870CVR133’s limited RAM may struggle with large descriptor tables during enumeration, so keep USB stack configurations minimal and test thoroughly under brown-out conditions.
Can the MPC870CVR133 support real-time deterministic communication over its dual 10/100 Ethernet ports for industrial automation applications requiring sub-millisecond response times?
The MPC870CVR133’s dual 10/100 Ethernet controllers are managed by the integrated CPM and can handle basic industrial protocols, but they lack hardware timestamping, time-sensitive networking (TSN) support, or dedicated real-time queues—critical for sub-millisecond determinism. While you can achieve moderate real-time performance using prioritized interrupts and optimized driver code, jitter and latency will vary due to shared memory bandwidth between the core, CPM, and external DRAM. For true deterministic behavior, consider offloading time-critical tasks to an external FPGA or switching to a modern platform like the NXP LS1021A. If committed to the MPC870CVR133, minimize background tasks, lock cache lines for Ethernet buffers, and use polling instead of interrupts where feasible to reduce scheduling uncertainty.
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MPC870CVR133 CAD Models
NXP Semiconductors MPC870CVR133 PCB symbols & footprints
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