Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
MPC860SRVR50D4
NXP USA Inc.
IC MPU MPC8XX 50MHZ 357BGA
1666 Pcs New Original In Stock
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (346 Ratings)
MPC860SRVR50D4
Product Overview
7262357
DiGi Electronics Part Number
MPC860SRVR50D4-DGManufacturer
NXP USA Inc.
MPC860SRVR50D4
Description
IC MPU MPC8XX 50MHZ 357BGAInventory
1666 Pcs New Original In Stock
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
MPC860SRVR50D4 Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
MPC8xx
Product Status
Obsolete
Core Processor
MPC8xx
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
50MHz
Co-Processors/DSP
Communications; CPM
RAM Controllers
DRAM
Graphics Acceleration
No
Display & Interface Controllers
-
Ethernet
10Mbps (4)
SATA
-
USB
-
Voltage - I/O
3.3V
Operating Temperature
0°C ~ 95°C (TA)
Security Features
-
Mounting Type
Surface Mount
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Additional Interfaces
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Base Product Number
MPC86
Datasheet & Documents
HTML Datasheet
MPC860SRVR50D4-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A991B4B
HTSUS
8542.31.0001
Additional Information
Other Names
2156-MPC860SRVR50D4-568
935324118557
Standard Package
44
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Every interaction with DiGi Electronics reinforces my trust in their brand.
de desembre 02, 2025
The customer service team is always welcoming and eager to help at DiGi Electronics.
de desembre 02, 2025
The customer service at DiGi Electronics is incredibly friendly and always ready to help.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
What are the primary risks and considerations when designing with the obsolete NXP MPC860SRVR50D4 in a new embedded system, given its end-of-life status?
Designing with an obsolete component like the MPC860SRVR50D4 introduces significant risks. The primary concern is long-term supply availability, as NXP will no longer manufacture this part. This necessitates a proactive end-of-life (EOL) strategy, including securing sufficient inventory for the product's lifecycle or identifying a suitable, currently supported alternative. Furthermore, the absence of future firmware updates or technical support from NXP for the MPC860SRVR50D4 means that any encountered bugs or limitations will require internal workarounds or a complete redesign. You should also consider the availability of development tools and compatible peripheral components, as these might also be discontinued or lack modern support when working with the MPC860SRVR50D4.
Can the MPC860SRVR50D4 be directly replaced by a newer NXP processor like the i.MX 6ULL for an existing design that requires 10Mbps Ethernet and basic communication co-processor functionality?
Directly replacing the MPC860SRVR50D4 with an i.MX 6ULL is unlikely to be a drop-in solution. While both offer 32-bit processing and Ethernet, the MPC860SRVR50D4 features a dedicated Communications Processor Module (CPM) which is crucial for its 10Mbps Ethernet performance and specific communication protocols. The i.MX 6ULL has a different architecture and integrated peripherals. A successful replacement would require a thorough analysis of the original design's reliance on the MPC860SRVR50D4's specific CPM functions and potentially a significant firmware and hardware redesign to adapt to the i.MX 6ULL's peripheral set and bus architecture. Thorough emulation or a parallel development effort is recommended before committing to a replacement.
What are the key performance bottlenecks or unexpected behavior users might encounter when pushing the 50MHz MPC860SRVR50D4 to its limits in applications requiring concurrent HDLC/SDLC and SPI data processing?
Pushing the MPC860SRVR50D4 to its limits, especially with concurrent HDLC/SDLC and SPI data processing at 50MHz, can lead to unexpected behavior due to the shared nature of its internal resources. The Communications Processor Module (CPM), while powerful for its era, may become a bottleneck if not managed carefully. High I/O traffic on both HDLC/SDLC and SPI interfaces can contend for bus bandwidth and interrupt handling. Careful code optimization, potentially utilizing DMA where available within the MPC860SRVR50D4's capabilities, and strategic task scheduling are crucial. Monitor CPU utilization and I/O latency closely during development; exceeding the 50MHz clock speed or saturating the CPM can lead to packet loss or communication errors. Consider if the application truly requires simultaneous high-throughput on these interfaces or if a phased approach is feasible.
Given the MPC860SRVR50D4's 0°C ~ 95°C operating temperature range and MSL 3 rating, what are the critical environmental considerations for ensuring long-term reliability in industrial applications exposed to fluctuating temperatures and humidity?
Ensuring the long-term reliability of the MPC860SRVR50D4 in industrial settings requires meticulous attention to its environmental limitations. The 0°C to 95°C operating temperature range is broad, but rapid thermal cycling can stress the 357-PBGA package and lead to solder joint fatigue. Implementing adequate thermal management solutions, such as heat sinks or controlled airflow, is essential to maintain stable junction temperatures within the specified range, especially under heavy load. The Moisture Sensitivity Level 3 (MSL 3) rating means the MPC860SRVR50D4 is susceptible to moisture absorption if not handled properly during assembly. Post-soldering bake-out procedures according to J-STD-020 are critical to prevent popcorning or delamination during reflow. Additionally, consider conformal coating the assembled board to protect against humidity and corrosive elements common in industrial environments.
Are there any known electrical compatibility issues or design pitfalls when interfacing the 3.3V I/O of the MPC860SRVR50D4 with modern, lower-voltage peripheral devices commonly found in networked embedded systems today?
Interfacing the 3.3V I/O of the MPC860SRVR50D4 with modern, lower-voltage peripherals presents potential compatibility issues that require careful design. While 3.3V is a common logic level, many newer devices operate at 1.8V or 2.5V. Directly connecting the 3.3V output of the MPC860SRVR50D4 to a 1.8V input could damage the peripheral. Conversely, a 3.3V tolerant input on the MPC860SRVR50D4 might still have stricter signaling requirements than a lower-voltage device can reliably provide. Level shifting circuits (e.g., using MOSFETs or dedicated level translators) are often necessary to ensure signal integrity and prevent damage. Furthermore, consider the drive strength of the MPC860SRVR50D4's I/O pins and the input capacitance/impedance of the peripheral. Signal integrity issues like reflections or ringing can arise if these parameters are not matched, especially at higher communication speeds achievable with other components.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MPC860SRVR50D4 CAD Models
NXP USA Inc. MPC860SRVR50D4 PCB symbols & footprints
productDetail
