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MPC860PVR80D4
NXP USA Inc.
IC MPU MPC8XX 80MHZ 357BGA
1514 Pcs New Original In Stock
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)
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5.0 / 5.0
- (317 Ratings)
MPC860PVR80D4
Product Overview
7242887
DiGi Electronics Part Number
MPC860PVR80D4-DGManufacturer
NXP USA Inc.
MPC860PVR80D4
Description
IC MPU MPC8XX 80MHZ 357BGAInventory
1514 Pcs New Original In Stock
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)
Quantity
Minimum 1
Minimum 1
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MPC860PVR80D4 Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
MPC8xx
Product Status
Obsolete
Core Processor
MPC8xx
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
80MHz
Co-Processors/DSP
Communications; CPM
RAM Controllers
DRAM
Graphics Acceleration
No
Display & Interface Controllers
-
Ethernet
10Mbps (4), 10/100Mbps (1)
SATA
-
USB
-
Voltage - I/O
3.3V
Operating Temperature
0°C ~ 95°C (TA)
Security Features
-
Mounting Type
Surface Mount
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Additional Interfaces
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Base Product Number
MPC86
Datasheet & Documents
HTML Datasheet
MPC860PVR80D4-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A991B4B
HTSUS
8542.31.0001
Additional Information
Other Names
935309602557
2156-MPC860PVR80D4-568
Standard Package
44
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
產品品質一直很穩定，售後服務讓我非常安心與放心。
de desembre 02, 2025
Affordable pricing combined with reliable after-sales makes DiGi stand out.
de desembre 02, 2025
DiGi Electronics consistently delivers products that exceed my quality expectations, showcasing their commitment to excellence.
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Frequently Asked Questions (FAQ)
Can the MPC860PVR80D4 be safely replaced with the newer MPC8270CZQMIEA in an existing industrial communication controller design without major hardware changes?
While both the MPC860PVR80D4 and MPC8270CZQMIEA are from the PowerQUICC II family and share architectural similarities, direct drop-in replacement is not recommended due to differences in pinout, power requirements, and memory interface timing. The MPC8270CZQMIEA operates at higher core frequencies and uses a different BGA footprint (352-ball vs. 357-ball), requiring PCB layout modifications. Additionally, the CPM (Communications Processor Module) behavior differs slightly in DMA arbitration and interrupt handling, which may affect real-time performance in legacy firmware. A full electrical and functional validation is strongly advised before migration, especially in mission-critical applications like telecom base stations or industrial gateways.
What are the key reliability risks when designing a long-lifecycle embedded system around the MPC860PVR80D4, given its obsolete status and MSL 3 rating?
The MPC860PVR80D4’s obsolete status introduces supply chain and long-term support risks, particularly for systems with 10+ year lifecycles. Although it is ROHS3 compliant and REACH unaffected, its Moisture Sensitivity Level (MSL) of 3 (168 hours) demands strict handling during assembly—exceeding floor life without proper baking can lead to popcorning in the 357-PBGA package. Furthermore, NXP no longer provides active development support or errata updates, increasing the risk of undetected silicon bugs affecting field reliability. Designers should implement rigorous in-system diagnostics, consider second-source strategies using pin-compatible alternatives like the MPC880CZP66, and secure lifetime buys or qualified distributors to mitigate obsolescence risk.
How does the integrated CPM (Communications Processor Module) in the MPC860PVR80D4 impact system-level design when implementing multiple HDLC channels alongside Ethernet?
The CPM in the MPC860PVR80D4 offloads protocol processing for HDLC, SDLC, and TDM interfaces, enabling efficient multichannel communication without burdening the main CPU core. However, resource contention arises when simultaneously operating four 10Mbps Ethernet ports and multiple HDLC channels, as they share internal SCC (Serial Communication Controllers) and buffer descriptors. Improper allocation of CPM microcode or buffer memory can lead to dropped packets or timing jitter in time-sensitive applications like T1/E1 gateways. To mitigate this, reserve dedicated SCCs for high-priority protocols and use the internal DRAM controller to allocate separate memory pools for each interface, ensuring deterministic latency and avoiding CPM over-subscription.
Is it feasible to operate the MPC860PVR80D4 at its maximum 95°C ambient temperature in an enclosed industrial enclosure with limited airflow, and what derating practices should be followed?
Operating the MPC860PVR80D4 at 95°C ambient is within its specified range, but thermal derating is critical in enclosed environments. The 357-PBGA package has limited thermal dissipation, and sustained operation near Tjmax (junction temperature) accelerates electromigration and reduces long-term reliability. Use a thermal pad or via array under the package to conduct heat to a ground plane or heatsink, and monitor junction temperature using the on-die thermal sensor if accessible via software. As a best practice, maintain at least a 10–15°C margin below 95°C under full load (e.g., 80MHz CPU + active CPM), especially when combined with other heat-generating components like FPGAs or power regulators. Thermal imaging during prototype testing is highly recommended.
What interface compatibility challenges might arise when integrating the MPC860PVR80D4 with modern 1.8V SPI peripherals, given its 3.3V I/O voltage requirement?
The MPC860PVR80D4’s 3.3V I/O voltage creates a level-shifting challenge when interfacing with low-voltage SPI devices (e.g., sensors or ADCs operating at 1.8V). Direct connection risks damaging the peripheral or causing unreliable logic thresholds due to VIH/VIL mismatches. A bidirectional voltage translator such as the TXB0108PWR or SN74LVC8T245 should be used on all SPI lines (SCLK, MOSI, MISO, CS). Ensure the translator supports the MPC860PVR80D4’s maximum SPI clock rate (typically up to 20–25 MHz with proper layout) and that signal integrity is maintained with controlled impedance traces and minimal stub length. Avoid resistor dividers for MISO lines, as they can introduce timing skew and violate setup/hold times at higher frequencies.
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MPC860PVR80D4 CAD Models
NXP USA Inc. MPC860PVR80D4 PCB symbols & footprints
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