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MPC8358VRAGDGA
NXP USA Inc.
IC MPU MPC83XX 400MHZ 668BGA
1329 Pcs New Original In Stock
PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 668-PBGA-PGE (29x29)
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5.0 / 5.0
- (398 Ratings)
MPC8358VRAGDGA
Product Overview
7264347
DiGi Electronics Part Number
MPC8358VRAGDGA-DGManufacturer
NXP USA Inc.
MPC8358VRAGDGA
Description
IC MPU MPC83XX 400MHZ 668BGAInventory
1329 Pcs New Original In Stock
PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 668-PBGA-PGE (29x29)
Quantity
Minimum 1
Minimum 1
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MPC8358VRAGDGA Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
MPC83xx
Product Status
Active
Core Processor
PowerPC e300
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
400MHz
Co-Processors/DSP
Communications; QUICC Engine
RAM Controllers
DDR, DDR2
Graphics Acceleration
No
Display & Interface Controllers
-
Ethernet
10/100/1000Mbps (1)
SATA
-
USB
USB 1.x (1)
Voltage - I/O
1.8V, 2.5V, 3.3V
Operating Temperature
0°C ~ 105°C (TA)
Security Features
-
Mounting Type
Surface Mount
Package / Case
668-BBGA Exposed Pad
Supplier Device Package
668-PBGA-PGE (29x29)
Additional Interfaces
DUART, HDLC, I2C, PCI, SPI, UART
Base Product Number
MPC8358
Datasheet & Documents
HTML Datasheet
MPC8358VRAGDGA-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
935325439557
Standard Package
36
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
모든 구매 과정에서 가격 우위와 서비스가 최고였습니다. 매우 만족스러워요.
de desembre 02, 2025
プロフェッショナルな対応と価格優位性に感動しました。今後も利用します。
de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing a Freescale MPC8349EA with an NXP MPC8358VRAGDGA in an existing industrial control board, and how do I validate compatibility?
The MPC8358VRAGDGA offers enhanced features like a faster 400MHz e300 core and integrated QUICC Engine for communications, but pin-to-pin compatibility with the MPC8349EA is not guaranteed due to differences in the 668-ball BGA layout and I/O voltage domains (1.8V, 2.5V, 3.3V). Critical risks include mismatched DDR/DDR2 memory controller timing, altered PCI bus configuration, and differences in power sequencing requirements. To mitigate, perform a full pinout comparison using NXP’s migration guides, revalidate DDR2 termination and layout rules, and test bootloader initialization under worst-case voltage and temperature conditions. Always prototype with in-circuit emulation to catch subtle signal integrity or timing issues early.
Can the MPC8358VRAGDGA safely operate in a -40°C environment despite its specified operating temperature range of 0°C to 105°C?
No, the MPC8358VRAGDGA is not rated for operation below 0°C (TA), and using it at -40°C violates its datasheet specifications, risking latch-up, timing violations, or permanent damage. While some units might appear functional during short-term testing, long-term reliability—especially in automotive or outdoor industrial applications—cannot be assured. For cold-environment deployments, consider NXP’s automotive-grade alternatives like the MPC8308 or MPC8315E, which are rated down to -40°C. If you must use the MPC8358VRAGDGA, implement active thermal management and conduct extensive HALT (Highly Accelerated Life Testing) to assess failure modes, but understand this voids warranty and compliance claims.
How does the QUICC Engine in the MPC8358VRAGDGA compare to a discrete communication processor like the Freescale SCC-based MPC859T, and what integration challenges should I expect?
The integrated QUICC Engine in the MPC8358VRAGDGA consolidates legacy protocols like HDLC, UART, and SPI into a programmable co-processor, reducing BOM cost and board space versus using a discrete MPC859T. However, it lacks the full flexibility of the older SCC modules and requires firmware configuration via the UCC (Universal Communication Controllers). Key integration risks include limited real-time determinism under heavy CPU load, shared memory bandwidth contention with the e300 core, and more complex driver development. When migrating from an MPC859T-based design, expect to rewrite low-level comms firmware and validate protocol timing margins—especially for TDM or synchronous serial interfaces—using logic analyzers during bring-up.
Is it safe to run the MPC8358VRAGDGA at 400MHz continuously in a sealed enclosure with limited airflow, given its power dissipation and MSL-3 rating?
Continuous operation at 400MHz in a sealed, low-airflow environment requires careful thermal design. The MPC8358VRAGDGA can dissipate over 3W under full load, and without proper heatsinking or thermal vias in the 668-PBGA-PGE package, junction temperatures may exceed safe limits even if ambient stays below 105°C. The MSL-3 rating (168 hours floor life) also implies sensitivity to moisture during assembly—improper reflow can cause popcorning, leading to latent thermal failures. Mitigate by using a thermal pad with exposed die attach, adding a small heatsink or thermal interface material, and performing IR thermal imaging under max load. Always derate performance if passive cooling is insufficient, or consider underclocking to improve long-term reliability.
What precautions are needed when designing the DDR2 memory interface for the MPC8358VRAGDGA to avoid signal integrity issues in a high-noise industrial environment?
Designing a robust DDR2 interface for the MPC8358VRAGDGA in electrically noisy environments demands strict adherence to length-matching (±50 mils), impedance control (50Ω single-ended), and power integrity practices. The memory controller supports DDR2-400, but simultaneous switching noise (SSN) from the 668-ball BGA can couple into sensitive traces if ground return paths are inadequate. Use a solid ground plane beneath the DDR2 bus, place decoupling capacitors (<5mm from VDD pins), and avoid routing DDR signals near high-speed comms lines like Gigabit Ethernet. Additionally, enable on-die termination (ODT) in software and validate eye diagrams with a high-bandwidth oscilloscope during prototype testing—especially under temperature extremes (0°C to 105°C), where trace impedance and IC timing margins shift significantly.
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MPC8358VRAGDGA CAD Models
NXP USA Inc. MPC8358VRAGDGA PCB symbols & footprints
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