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MPC8349VVAJFB
NXP USA Inc.
IC MPU MPC83XX 533MHZ 672LBGA
1710 Pcs New Original In Stock
PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 533MHz 672-LBGA (35x35)
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Minimum 1
5.0 / 5.0
- (102 Ratings)
MPC8349VVAJFB
Product Overview
7263818
DiGi Electronics Part Number
MPC8349VVAJFB-DGManufacturer
NXP USA Inc.
MPC8349VVAJFB
Description
IC MPU MPC83XX 533MHZ 672LBGAInventory
1710 Pcs New Original In Stock
PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 533MHz 672-LBGA (35x35)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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365 - Day Quality Guarantee - Every part fully backed.
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MPC8349VVAJFB Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
MPC83xx
Product Status
Obsolete
Core Processor
PowerPC e300
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
533MHz
Co-Processors/DSP
-
RAM Controllers
DDR, DDR2
Graphics Acceleration
No
Display & Interface Controllers
-
Ethernet
10/100/1000Mbps (2)
SATA
-
USB
USB 2.0 + PHY (2)
Voltage - I/O
1.8V, 2.5V, 3.3V
Operating Temperature
0°C ~ 105°C (TA)
Security Features
-
Mounting Type
Surface Mount
Package / Case
672-LBGA
Supplier Device Package
672-LBGA (35x35)
Additional Interfaces
DUART, I2C, PCI, SPI
Base Product Number
MPC8349
Datasheet & Documents
HTML Datasheet
MPC8349VVAJFB-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
935319176557
Standard Package
120
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Die persönliche Beratung hat meinen Einkauf bei DiGi Electronics deutlich verbessert.
de desembre 02, 2025
DiGi Electronics truly values customer satisfaction through quality and on-time delivery.
de desembre 02, 2025
The efficiency of their order system means less waiting and more teaching time for us.
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Frequently Asked Questions (FAQ)
Can the MPC8349VVAJFB be used as a drop-in replacement for the MPC8347ECVVAJFA in an existing industrial control design, and what are the key risks to evaluate?
While the MPC8349VVAJFB shares the same PowerPC e300 core and many peripherals with the MPC8347ECVVAJFA, it is not a guaranteed drop-in replacement due to differences in default boot configuration, clocking options, and I/O voltage tolerances. The MPC8349VVAJFB supports 1.8V, 2.5V, and 3.3V I/O levels, whereas the MPC8347ECVVAJFA may have different power sequencing requirements. Additionally, pin multiplexing and reset configuration must be verified against your board’s schematic. Because the MPC8349VVAJFB is obsolete, long-term supply risk is high—consider redesigning with a modern NXP Layerscape part like the LS1021A if lifecycle continuity is critical.
What are the thermal and layout challenges when designing a PCB around the MPC8349VVAJFB in a compact embedded system with limited airflow?
The MPC8349VVAJFB dissipates significant heat under load due to its 533MHz operation and dense 672-LBGA package, especially when driving dual Gigabit Ethernet and DDR2 memory simultaneously. Without proper thermal management, junction temperatures can exceed safe limits even within the 0°C to 105°C ambient range. Use a solid ground plane beneath the package, thermal vias under the die pad, and consider a small heatsink if enclosure airflow is restricted. Also, maintain strict impedance control on DDR2 and high-speed Ethernet traces—poor layout can increase power consumption and EMI, further exacerbating thermal issues.
Is it safe to operate the MPC8349VVAJFB near its maximum temperature rating of 105°C in a mission-critical automotive application, and what derating practices should be followed?
Operating the MPC8349VVAJFB continuously at or near 105°C ambient significantly reduces long-term reliability and increases the risk of electromigration and solder joint fatigue, especially given its MSL3 moisture sensitivity. For automotive or mission-critical use, apply a derating strategy: target ≤85°C ambient with headroom for internal heating. Monitor junction temperature using on-die thermal sensors if available, and ensure conformal coating is applied if humidity exposure is expected. Given that the part is obsolete and not qualified to AEC-Q100, consider migrating to an automotive-grade alternative like the NXP QorIQ T1022 for new designs.
How does the MPC8349VVAJFB compare to the newer NXP LS1021A in terms of software compatibility and migration effort for a legacy PowerPC-based networking appliance?
The MPC8349VVAJFB runs on the PowerPC e300 core with a classic Book E architecture, while the LS1021A uses an ARM Cortex-A7 dual-core design, meaning there is no binary compatibility. Migration requires a full software stack rewrite—from bootloader (U-Boot) to OS (Linux kernel) and application layer. However, the LS1021A offers superior performance per watt, integrated security engines, and active lifecycle support. If your current design relies heavily on the MPC8349VVAJFB’s dual Gigabit Ethernet and PCI bus, the LS1021A provides similar interfaces but with modern SerDes-based architecture. Plan for significant validation effort, especially around real-time performance and interrupt latency.
What precautions should be taken when sourcing the MPC8349VVAJFB due to its obsolete status, and how can counterfeit or degraded units be identified during integration?
Because the MPC8349VVAJFB is marked obsolete by NXP and only available through secondary distributors, the risk of receiving counterfeit, relabeled, or moisture-damaged units is high. Always procure from authorized brokers with traceable lot codes and request original packaging with intact MSL3 moisture barrier bags and desiccant. Perform X-ray inspection to verify die size and bond wire layout, and run power-on self-tests to check for abnormal current draw or boot failures—symptoms of degraded silicon. Given the 168-hour floor life after bag opening, assemble promptly in a controlled environment to avoid popcorning during reflow. For critical systems, consider last-time buy planning or redesigning with a supported successor.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MPC8349VVAJFB CAD Models
NXP USA Inc. MPC8349VVAJFB PCB symbols & footprints
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