MPC8248ZQTIEA >
MPC8248ZQTIEA
NXP Semiconductors
IC MPU MPC82XX 400MHZ PBGA516
1702 Pcs New Original In Stock
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27)
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MPC8248ZQTIEA NXP Semiconductors
5.0 / 5.0 - (208 Ratings)

MPC8248ZQTIEA

Product Overview

5890622

DiGi Electronics Part Number

MPC8248ZQTIEA-DG
MPC8248ZQTIEA

Description

IC MPU MPC82XX 400MHZ PBGA516

Inventory

1702 Pcs New Original In Stock
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27)
Quantity
Minimum 1

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In Stock (All prices are in USD)
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  • 1 56.3625 56.3625
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MPC8248ZQTIEA Technical Specifications

Category Embedded, Microprocessors

Manufacturer NXP Semiconductors

Packaging -

Series MPC82xx

Product Status Obsolete

Core Processor PowerPC G2_LE

Number of Cores/Bus Width 1 Core, 32-Bit

Speed 400MHz

Co-Processors/DSP Communications; RISC CPM, Security; SEC

RAM Controllers DRAM, SDRAM

Graphics Acceleration No

Display & Interface Controllers -

Ethernet 10/100Mbps (2)

SATA -

USB USB 2.0 (1)

Voltage - I/O 3.3V

Operating Temperature 0°C ~ 105°C (TA)

Security Features Cryptography, Random Number Generator

Mounting Type Surface Mount

Package / Case 516-BBGA

Supplier Device Package 516-PBGA (27x27)

Additional Interfaces I2C, SCC, SMC, SPI, UART, USART

Base Product Number MPC82

Datasheet & Documents

HTML Datasheet

MPC8248ZQTIEA-DG

Environmental & Export Classification

RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1 FRE
HTSUS 8542.31.0001

Additional Information

Other Names
935322711557
Standard Package
40

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
MPC8248VRTIEA
NXP USA Inc.
1354
MPC8248VRTIEA-DG
4.6202
Direct

Reviews

5.0/5.0-(Show up to 5 Ratings)
Auror***réale
de desembre 02, 2025
5.0
Nous sommes impressionnés par leur capacité à livrer rapidement tout en maintenant une qualité exceptionnelle.
Tra***afen
de desembre 02, 2025
5.0
DiGi Electronics bietet unschlagbare Preise sowie einen außerordentlich reaktionsschnellen Service.
Gold***unset
de desembre 02, 2025
5.0
Their promptness and product resilience help me focus on innovation rather than replacements.
Nebu***reams
de desembre 02, 2025
5.0
Their unwavering quality and consistency help me feel confident in their brand.
Star***ibes
de desembre 02, 2025
5.0
I appreciate their commitment to fast delivery.
Gol***Wave
de desembre 02, 2025
5.0
The electronic parts are highly precise, which significantly improved the quality of my creations.
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Frequently Asked Questions (FAQ)

Can the MPC8248ZQTIEA be safely replaced with the MPC8248VRTIEA in an existing 3.3V industrial control system without hardware modifications?

While the MPC8248VRTIEA is listed as a substitute for the MPC8248ZQTIEA, it operates at a lower core voltage (1.8V vs. 2.5V on the ZQ variant), which may require adjustments to the power delivery network and I/O level translation if your system relies on precise voltage thresholds. Although both share the same 516-PBGA footprint and 400MHz performance, the VRT version’s reduced power consumption comes with tighter noise margins—verify signal integrity on critical buses like DDR and PCI. Conduct a full power-on reset (POR) timing analysis and validate boot ROM compatibility before committing to drop-in replacement.

What are the key reliability risks when designing a long-lifecycle embedded system around the MPC8248ZQTIEA given its obsolete status and RoHS non-compliance?

The MPC8248ZQTIEA’s obsolete status from NXP means no future silicon revisions or errata updates, increasing long-term supply chain risk. Its RoHS non-compliant composition (likely leaded solder) may conflict with modern assembly processes and export regulations, especially in EU markets. Additionally, MSL 3 rating requires strict moisture control during storage and assembly—exceeding 168 hours exposure demands baking. For lifecycle-critical applications, secure last-time buy quantities and implement a qualified second-source strategy using pin-compatible alternatives like the MPC8270 or modern NXP Layerscape parts with emulation layers.

How should thermal management be approached for the MPC8248ZQTIEA in a sealed enclosure operating near 105°C ambient, given its 516-PBGA package and lack of integrated heat spreader?

The 516-PBGA (27x27mm) package of the MPC8248ZQTIEA has limited natural convection cooling capability, and junction temperatures can exceed safe limits in sealed enclosures at high ambient temps. You must use a thermal via array under the package connected to an internal ground plane acting as a heat spreader, and consider a thin thermal interface material (TIM) to an external chassis. Monitor real-world power dissipation under worst-case workloads—CPM and SEC co-processor activity can spike dynamic current. Derate maximum frequency or implement dynamic thermal throttling via external monitoring ICs if sustained operation above 95°C TA is unavoidable.

Is it feasible to interface the MPC8248ZQTIEA’s 3.3V I/O directly with modern 1.8V FPGAs or ASICs on a mixed-voltage PCB, and what signal integrity issues should be anticipated?

Direct connection between the MPC8248ZQTIEA’s 3.3V I/O and 1.8V logic is not recommended due to potential overvoltage stress on the lower-voltage device. Even if the FPGA claims 3.3V-tolerant inputs, long-term reliability may suffer from gate oxide degradation. Use bidirectional level shifters (e.g., TXS0108E) on bidirectional buses like I2C or SPI, and unidirectional shifters (e.g., SN74LVC8T245) for control signals. Pay special attention to rise-time control—the MPC8248’s fast edge rates can cause ringing on lightly loaded lines; series termination resistors (22–33Ω) near the driver are advised to dampen reflections on longer traces.

What debug and bring-up challenges are unique to the MPC8248ZQTIEA when porting legacy PowerPC code to a new PCB design with DDR2 memory and dual Ethernet ports?

Bring-up of the MPC8248ZQTIEA often stalls on DDR2 initialization due to sensitivity to trace length matching, impedance control, and power sequencing—ensure VDD_CORE (2.5V) ramps before VDD_IO (3.3V). The dual 10/100 Ethernet MACs share PHY interface pins with other peripherals; confirm pin muxing in the SIU configuration registers early. Legacy code may assume Big-Endian byte ordering, but the G2_LE core is Little-Endian—audit data structure alignments and network packet handling. Use the JTAG interface with a BDI3000 or Lauterbach debugger to halt execution before main() and validate CPM firmware loading, as corrupted boot code can silently disable critical subsystems like the SEC engine.

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