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MCIMX6X3EVK10AB
NXP USA Inc.
IC MPU I.MX6SX 1GHZ 400MAPBGA
2216 Pcs New Original In Stock
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (14x14)
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5.0 / 5.0
- (418 Ratings)
MCIMX6X3EVK10AB
Product Overview
7237879
DiGi Electronics Part Number
MCIMX6X3EVK10AB-DGManufacturer
NXP USA Inc.
MCIMX6X3EVK10AB
Description
IC MPU I.MX6SX 1GHZ 400MAPBGAInventory
2216 Pcs New Original In Stock
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (14x14)
Quantity
Minimum 1
Minimum 1
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MCIMX6X3EVK10AB Technical Specifications
Category
Embedded, Microprocessors
Packaging
Tray
Series
i.MX6SX
Product Status
Active
Core Processor
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width
2 Core, 32-Bit
Speed
227MHz, 1GHz
Co-Processors/DSP
Multimedia; NEON™ MPE
RAM Controllers
LPDDR2, LVDDR3, DDR3
Graphics Acceleration
Yes
Display & Interface Controllers
Keypad, LCD, LVDS
Ethernet
10/100/1000Mbps (2)
SATA
-
USB
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature
-20°C ~ 105°C (TJ)
Security Features
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type
Surface Mount
Package / Case
400-LFBGA
Supplier Device Package
400-MAPBGA (14x14)
Additional Interfaces
AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Base Product Number
MCIMX6
Datasheet & Documents
HTML Datasheet
MCIMX6X3EVK10AB-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
2832-MCIMX6X3EVK10AB
935315799557
Standard Package
152
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
DiGi Electronics bietet eine hervorragende Website-Erfahrung mit freundlichen Preisen, ideal für Studenten.
de desembre 02, 2025
DiGi Electronics liefert pünktlich und bietet einen Support, der schnell und kompetent ist.
de desembre 02, 2025
どの商品も品質の安定感があり、長く使い続けられます。
de desembre 02, 2025
They provided detailed post-sale assistance, helping me troubleshoot complex issues effectively.
de desembre 02, 2025
The after-sales response exceeded my expectations, very reassuring.
de desembre 02, 2025
I feel confident purchasing from DiGi Electronics because of their friendly service.
de desembre 02, 2025
Their commitment to quality and prompt service makes shopping with DiGi Electronics a pleasure.
de desembre 02, 2025
Order processing was swift, and the product’s sturdy design ensures it stays functional in demanding conditions.
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Frequently Asked Questions (FAQ)
Can the MCIMX6X3EVK10AB be safely used in an industrial control system operating at 100°C ambient temperature, and what thermal design precautions are necessary to avoid junction temperature violations?
The MCIMX6X3EVK10AB has a maximum junction temperature (TJ) of 105°C, but operating at 100°C ambient leaves minimal thermal headroom. In practice, power dissipation from dual-core operation (Cortex-A9 at 1GHz and Cortex-M4 at 227MHz) under load can push TJ beyond safe limits without active cooling or a high-efficiency heat spreader. You must perform thermal modeling using the device’s θJA (junction-to-ambient) value from the datasheet and implement a copper pour with thermal vias under the 400-MAPBGA package. For reliable long-term operation above 85°C ambient, consider a heatsink or forced airflow—passive cooling alone is risky in sealed enclosures.
What are the key risks when replacing a Texas Instruments AM3358BZCZ100 with the MCIMX6X3EVK10AB in an existing Linux-based HMI design, and how do I address memory and peripheral compatibility gaps?
Direct replacement of the AM3358BZCZ100 with the MCIMX6X3EVK10AB introduces several integration risks: the i.MX6SX uses LPDDR2/LVDDR3/DDR3 controllers (vs. DDR3-only on AM3358), requiring careful PCB trace impedance matching and power sequencing redesign. Additionally, while both support LCD and Ethernet, the MCIMX6X3EVK10AB’s dual Ethernet MACs and advanced security blocks (CAAM, A-HAB) demand updated device tree configurations in Linux. The Cortex-M4 co-processor adds complexity if your firmware assumes single-core behavior. Mitigate by validating boot sequence timing, reworking DDR layout per NXP’s hardware design guide, and leveraging NXP’s Yocto BSP instead of TI’s StarterWare.
How does the MCIMX6X3EVK10AB’s mixed-signal I/O voltage flexibility (1.8V to 3.15V) impact signal integrity when interfacing with legacy 5V TTL sensors, and what level-shifting strategy minimizes EMI and reliability risks?
Although the MCIMX6X3EVK10AB supports I/O voltages down to 1.8V, directly connecting 5V TTL signals risks damaging the GPIO banks and introduces noise due to impedance mismatches. Never tie 5V signals directly to any pin—even if labeled as ‘tolerant’—because internal ESD structures aren’t designed for sustained overvoltage. Use bidirectional level translators (e.g., TXS0108E or SN74LVC8T245) with separate voltage domains, and place them close to the MCIMX6X3EVK10AB to reduce stub lengths. For high-speed interfaces like SPI or UART, ensure translator propagation delay doesn’t violate timing margins. Also, add series termination resistors (22–33Ω) to dampen reflections on longer traces.
Is the MCIMX6X3EVK10AB suitable for functional safety applications requiring ISO 13849 PLc or IEC 61508 SIL2, and what architectural limitations must be addressed in the system design?
The MCIMX6X3EVK10AB is not certified for functional safety standards out-of-the-box, but its ARM TrustZone, CSU, and SNVS modules provide a foundation for building a safety-compliant system. However, the Cortex-A9 lacks lockstep cores, so you cannot achieve hardware redundancy without external monitoring (e.g., a watchdog MCU). For ISO 13849 PLc, use the Cortex-M4 as a safety monitor running independent diagnostics, and implement software-based fault detection on the A9. Ensure all safety-critical code runs in secure world with JTAG disabled via A-HAB. Note that full certification requires extensive documentation and validation—consider pairing the MCIMX6X3EVK10AB with a certified safety MCU like the NXP S32K144 for critical control paths.
What are the hidden power sequencing requirements for the MCIMX6X3EVK10AB’s multiple voltage rails (core, DDR, I/O), and how can improper sequencing during hot-swap or brownout conditions cause latent failures?
The MCIMX6X3EVK10AB mandates strict power-up/down sequencing: core voltages (typically 1.0–1.2V) must rise before or simultaneously with I/O rails (1.8V/2.5V/3.15V), and DDR voltage must stabilize within ±5% before releasing reset. Violating this sequence—common during brownouts or hot-swap events—can cause latch-up or gradual degradation of the internal PHYs (USB, Ethernet). To mitigate, use a PMIC like the PCA9450C (designed for i.MX6SX) that enforces correct timing, or implement discrete supervisors with sequenced enable lines. Always include bulk decoupling (>100µF) near the BGA and monitor POR (Power-On Reset) timing with an oscilloscope during prototype validation. Ignoring this often leads to field returns attributed to ‘intermittent boot failure’ after months of operation.
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MCIMX6X3EVK10AB CAD Models
NXP USA Inc. MCIMX6X3EVK10AB PCB symbols & footprints
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