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MCIMX31LDVKN5D
NXP Semiconductors
IC MPU I.MX31 532MHZ 457LFBGA
1900 Pcs New Original In Stock
ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 532MHz 457-LFBGA (14x14)
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Minimum 1
5.0 / 5.0
- (78 Ratings)
MCIMX31LDVKN5D
Product Overview
5889251
DiGi Electronics Part Number
MCIMX31LDVKN5D-DGManufacturer
NXP Semiconductors
MCIMX31LDVKN5D
Description
IC MPU I.MX31 532MHZ 457LFBGAInventory
1900 Pcs New Original In Stock
ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 532MHz 457-LFBGA (14x14)
Quantity
Minimum 1
Minimum 1
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MCIMX31LDVKN5D Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
i.MX31
Product Status
Active
Core Processor
ARM1136JF-S
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
532MHz
Co-Processors/DSP
Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers
DDR
Graphics Acceleration
Yes
Display & Interface Controllers
Keyboard, Keypad, LCD
Ethernet
-
SATA
-
USB
USB 2.0 (3)
Voltage - I/O
1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Operating Temperature
-20°C ~ 70°C (TA)
Security Features
Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Mounting Type
Surface Mount
Package / Case
457-LFBGA
Supplier Device Package
457-LFBGA (14x14)
Additional Interfaces
1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Base Product Number
MCIMX31
Datasheet & Documents
HTML Datasheet
MCIMX31LDVKN5D-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
935314018557
Standard Package
760
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
カスタマーレビューが充実しており、選びやすかったです。購入に際しての不安が解消されました。
de desembre 02, 2025
My order arrived very quickly, and the packaging was both professional and reliable.
de desembre 02, 2025
DiGi Electronics offers excellent deals without compromising quality—highly recommend.
de desembre 02, 2025
The team at DiGi Electronics is always attentive, ensuring a smooth and positive experience.
de desembre 02, 2025
The combination of reliable products and quality support makes them a trusted choice.
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Frequently Asked Questions (FAQ)
What are the key thermal and layout design risks when integrating the MCIMX31LDVKN5D into a compact industrial handheld device, and how can they be mitigated?
The MCIMX31LDVKN5D, with its 532MHz ARM1136JF-S core and high pin-count 457-LFBGA package, generates significant heat under sustained multimedia workloads. In compact enclosures, inadequate thermal vias or poor ground plane connectivity can lead to localized hotspots exceeding the 70°C TA rating, risking performance throttling or long-term reliability degradation. To mitigate this, use a 4+ layer PCB with solid ground planes, populate the bottom-side thermal pad with an array of filled vias (≥0.3mm diameter), and ensure airflow or conductive chassis coupling. Thermal simulation during layout is strongly recommended—especially if DDR memory and the IPU are active simultaneously.
Can the MCIMX31LDVKN5D be directly replaced with the newer MCIMX35PDVSLL in an existing automotive infotainment design without major firmware changes?
While both the MCIMX31LDVKN5D and MCIMX35PDVSLL are based on ARM11 cores and share some peripheral similarities (e.g., USB 2.0, LCD controller), direct drop-in replacement is not advised. The MCIMX35PDVSLL uses a different memory controller (supports LPDDR), has a revised clocking architecture, and lacks certain legacy interfaces like PCMCIA present on the MCIMX31LDVKN5D. Additionally, the secure boot and fusebox implementations differ, which may break existing secure firmware flows. A board-level pinout comparison and full HAL validation are required—expect at least moderate driver and power management firmware rework.
How does the MCIMX31LDVKN5D’s limited DDR controller affect system memory bandwidth in video decoding applications, and what design trade-offs should be considered?
The MCIMX31LDVKN5D’s single-channel DDR controller operates at up to 133MHz (DDR266), providing ~532MB/s peak bandwidth. While sufficient for basic MPEG-4 decoding via the integrated IPU, it becomes a bottleneck when handling high-bitrate video or concurrent display processing (e.g., overlaying UI on video). Designers should prioritize efficient memory access patterns, minimize unnecessary frame buffering, and consider using the IPU’s hardware scaling and color space conversion to reduce CPU and memory load. Avoid software-based video post-processing; instead, leverage the GPU and IPU co-processors to stay within bandwidth limits and maintain real-time performance.
What reliability concerns arise from operating the MCIMX31LDVKN5D near its -20°C lower temperature limit in outdoor IoT edge devices, and how can signal integrity be preserved?
At -20°C, the MCIMX31LDVKN5D’s LFBGA package is susceptible to increased mechanical stress due to CTE mismatch with the PCB, potentially causing solder joint fatigue over thermal cycles—especially in vibration-prone outdoor environments. Additionally, colder silicon exhibits higher propagation delays, which can skew DDR timing margins if not accounted for in the PHY tuning. Mitigate this by using low-CTE PCB materials (e.g., high-Tg FR4 or polyimide), performing cold-start signal integrity validation, and implementing conservative DDR training routines that include temperature-compensated delay settings. Also ensure conformal coating doesn’t trap moisture, which could freeze and crack joints.
Is it safe to disable the MCIMX31LDVKN5D’s Secure JTAG and Secure Fusebox features in a cost-sensitive consumer product to simplify development, and what are the long-term risks?
Disabling the MCIMX31LDVKN5D’s Secure JTAG and Secure Fusebox may reduce BOM complexity and ease debugging, but it significantly increases vulnerability to firmware extraction, cloning, and unauthorized field updates—especially in connected devices. Without these features, there is no hardware-enforced root of trust, making the system susceptible to malicious code injection. For consumer products with any network connectivity or IP value, retaining secure boot via the fusebox and locking JTAG post-production is strongly recommended. If cost is critical, consider using the RTIC (Real-Time Integrity Checker) for runtime tamper detection as a compensating control, but do not treat it as a full replacement for hardware security.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MCIMX31LDVKN5D CAD Models
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