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MC9S08AC60CFGE
NXP USA Inc.
IC MCU 8BIT 60KB FLASH 44LQFP
30546 Pcs New Original In Stock
S08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH 44-LQFP (10x10)
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5.0 / 5.0
- (211 Ratings)
MC9S08AC60CFGE
Product Overview
7225534
DiGi Electronics Part Number
MC9S08AC60CFGE-DGManufacturer
NXP USA Inc.
MC9S08AC60CFGE
Description
IC MCU 8BIT 60KB FLASH 44LQFPInventory
30546 Pcs New Original In Stock
S08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH 44-LQFP (10x10)
Quantity
Minimum 1
Minimum 1
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MC9S08AC60CFGE Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
S08
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
S08
Core Size
8-Bit
Speed
40MHz
Connectivity
I2C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number of I/O
34
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
2K x 8
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
44-LQFP (10x10)
Package / Case
44-LQFP
Base Product Number
MC9S08
Datasheet & Documents
HTML Datasheet
MC9S08AC60CFGE-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
935316998557
Standard Package
800
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Fast shipping and careful packing—everything was perfect upon arrival.
de desembre 02, 2025
I appreciate how DiGi Electronics values their customers by providing reliable post-purchase support.
de desembre 02, 2025
Their eco-focused packaging choices are a step towards a sustainable future.
de desembre 02, 2025
The staff’s friendliness at DiGi Electronics makes every visit enjoyable.
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Frequently Asked Questions (FAQ)
What are the key reliability and thermal design considerations when using the MC9S08AC60CFGE in an industrial environment with frequent power cycling?
The MC9S08AC60CFGE operates reliably within -40°C to 85°C, but frequent power cycling can stress the internal voltage regulators and flash memory due to inrush current and thermal cycling. To mitigate this, implement a controlled power-on reset (POR) circuit with a soft-start mechanism and ensure adequate decoupling capacitance (≥100nF ceramic + 10µF bulk) near VDD pins. Avoid operating near the 2.7V lower limit during brownout conditions, as this may cause erratic behavior despite LVD protection. Thermal vias under the 44-LQFP package improve heat dissipation and reduce junction temperature swings during repeated startups.
Can the MC9S08AC60CFGE be used as a drop-in replacement for the older MC68HC908GP32 in legacy automotive control modules, and what firmware risks should I anticipate?
While the MC9S08AC60CFGE offers pin-compatible I/O count and similar voltage range, it is not a direct drop-in for the MC68HC908GP32 due to architectural differences—the S08 core uses a different instruction set, memory map, and peripheral register layout. Critical firmware risks include incompatible interrupt vector tables, differing ADC clocking schemes, and absence of EEPROM (the MC9S08AC60CFGE relies on emulated EEPROM via flash blocks). You must recompile and retest all code using S08-specific toolchains (e.g., CodeWarrior or MCUXpresso), and validate timing-sensitive routines like PWM and SCI baud rate generation, which depend on the 40MHz internal bus clock versus the HC08’s 8MHz typical operation.
How does the internal oscillator accuracy of the MC9S08AC60CFGE impact communication reliability in SPI/I2C networks with strict timing requirements?
The MC9S08AC60CFGE’s internal oscillator has ±2% accuracy over the full voltage and temperature range, which may cause clock drift in long-duration SPI or multi-device I2C systems. For I2C at 400kHz, this drift can lead to setup/hold violations, especially with capacitive bus loading. In time-critical applications (e.g., sensor daisy-chaining), use an external crystal or resonator (±0.1% accuracy) connected to the OSC pins and disable the internal oscillator via the OSCTRIM register. Alternatively, implement software-based clock stretching detection and adaptive baud rate calibration in firmware to compensate for drift, particularly when interfacing with precision peripherals like high-resolution ADCs or real-time clocks.
What are the risks of using the MC9S08AC60CFGE’s flash memory for frequent data logging, and how can I extend its endurance in field-deployed devices?
The MC9S08AC60CFGE’s 60KB flash supports ~10,000 erase/write cycles per block, which is insufficient for frequent data logging (e.g., every few seconds). Writing sensor data directly to flash will wear out blocks prematurely. Instead, implement a wear-leveling algorithm using multiple flash sectors and buffer data in the 2KB RAM until a full page (typically 32–64 bytes) is ready for write. Use the built-in flash controller’s background programming feature to avoid CPU stalls. For high-write applications, consider offloading logging to an external SPI EEPROM (e.g., M95M04) or FRAM (e.g., FM25L16B), reserving internal flash only for firmware and infrequently updated calibration data.
When integrating the MC9S08AC60CFGE into a mixed-signal PCB with high-current motor drivers, how should I manage ground return paths and noise coupling to protect the 10-bit ADC performance?
To preserve ADC accuracy on the MC9S08AC60CFGE in noisy environments, isolate the analog ground (AGND) from the digital ground (DGND) at a single point near the MCU’s ground pin. Route all analog signals (e.g., sensor inputs to the 8-channel ADC) away from high-current traces and switching nodes. Use a dedicated low-impedance ground plane under the MCU and place the ADC reference voltage (if using external VREF) with a 1µF ceramic capacitor directly at the VREF pin. Avoid routing PWM or motor control signals parallel to ADC input traces. Enable the ADC’s internal sample-and-hold settling time extension and perform conversions during quiet periods (e.g., between PWM edges) to minimize switching noise coupling into the 10-bit conversion result.
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MC9S08AC60CFGE CAD Models
NXP USA Inc. MC9S08AC60CFGE PCB symbols & footprints
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