MC56F8145VFGE >
MC56F8145VFGE
NXP USA Inc.
IC MCU 16BIT 128KB FLASH 128LQFP
1215 Pcs New Original In Stock
56800E 56F8xxx Microcontroller IC 16-Bit 40MHz 128KB (64K x 16) FLASH 128-LQFP (14x20)
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MC56F8145VFGE NXP USA Inc.
5.0 / 5.0 - (377 Ratings)

MC56F8145VFGE

Product Overview

7215728

DiGi Electronics Part Number

MC56F8145VFGE-DG

Manufacturer

NXP USA Inc.
MC56F8145VFGE

Description

IC MCU 16BIT 128KB FLASH 128LQFP

Inventory

1215 Pcs New Original In Stock
56800E 56F8xxx Microcontroller IC 16-Bit 40MHz 128KB (64K x 16) FLASH 128-LQFP (14x20)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 15.2504 15.2504
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MC56F8145VFGE Technical Specifications

Category Embedded, Microcontrollers

Manufacturer NXP Semiconductors

Packaging -

Series 56F8xxx

Product Status Active

DiGi-Electronics Programmable Not Verified

Core Processor 56800E

Core Size 16-Bit

Speed 40MHz

Connectivity EBI/EMI, SCI, SPI

Peripherals POR, PWM, WDT

Number of I/O 49

Program Memory Size 128KB (64K x 16)

Program Memory Type FLASH

EEPROM Size -

RAM Size 4K x 16

Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V

Data Converters A/D 16x12b

Oscillator Type External

Operating Temperature -40°C ~ 105°C (TA)

Mounting Type Surface Mount

Supplier Device Package 128-LQFP (14x20)

Package / Case 128-LQFP

Base Product Number MC56F81

Datasheet & Documents

HTML Datasheet

MC56F8145VFGE-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Additional Information

Other Names
2832-MC56F8145VFGE
935309356557
Standard Package
360

Reviews

5.0/5.0-(Show up to 5 Ratings)
Cœur***llant
de desembre 02, 2025
5.0
Leur service client est attentionné et leur livraison est toujours dans les temps.
Blis***Bloom
de desembre 02, 2025
5.0
Their product quality is excellent, and we've rarely encountered any issues with their equipment.
Quie***rmony
de desembre 02, 2025
5.0
Quality and speed are their top priorities, and it shows in both their shipping times and product durability.
Brig***ibes
de desembre 02, 2025
5.0
They go above and beyond to ensure customer satisfaction after the purchase.
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Frequently Asked Questions (FAQ)

Can the MC56F8145VFGE be safely used in a 3.3V automotive control module operating at 105°C ambient, and what design precautions are needed for long-term reliability?

Yes, the MC56F8145VFGE is rated for operation up to 105°C ambient and supports a Vdd range of 2.25V to 3.6V, making it suitable for 3.3V automotive systems. However, at maximum temperature and voltage stress, ensure proper thermal management—use a 4-layer PCB with thermal vias under the 128-LQFP package and maintain adequate airflow. Also, derate peripheral loads (especially PWM and ADC) and validate long-term flash endurance under high-temperature cycling, as sustained operation near 105°C can accelerate wear on internal charge pumps used in flash programming.

What are the key risks when replacing a legacy DSP56800-based controller with the MC56F8145VFGE in an industrial motor drive application, and how can I mitigate compatibility issues?

The MC56F8145VFGE, while part of the 56800E family, has architectural differences from older DSP56800 cores—particularly in interrupt handling, memory mapping, and peripheral register layouts. Direct pin-for-pin or code-drop replacement may fail due to mismatched EBI timing or altered PWM module behavior. To mitigate risk, conduct a full peripheral audit: compare SPI clock polarity settings, SCI baud rate divisors, and ADC trigger modes against your legacy design. Use NXP’s CodeWarrior or MCUXpresso to recompile and simulate legacy code, and prototype on the MC56F8145-EVK before deployment. Also verify that your motor control ISRs fit within the 4K x 16 RAM constraint.

How does the MC56F8145VFGE compare to the newer NXP LPC55S69JBD100 for a cost-sensitive digital power supply design requiring 12-bit ADCs and PWM synchronization?

The MC56F8145VFGE offers superior deterministic real-time performance for digital power conversion due to its unified 56800E core executing DSP and control instructions in parallel, whereas the LPC55S69 (Cortex-M33) uses a more general-purpose architecture with higher latency in interrupt response. While the LPC55S69 has more flash (640KB vs 128KB) and advanced security, it lacks the MC56F8145VFGE’s tightly coupled PWM-to-ADC triggering, critical for cycle-by-cycle current mode control. For sub-$5 BOM targets and proven reliability in switching power supplies, the MC56F8145VFGE remains preferable—but only if your algorithm fits within its 4K x 16 RAM and 128KB flash limits.

What layout and decoupling strategies are essential to prevent ADC inaccuracies on the MC56F8145VFGE when sampling low-level sensor signals in a noisy industrial environment?

The MC56F8145VFGE’s 12-bit ADC is sensitive to power supply noise and ground bounce, especially with only 4K x 16 RAM limiting software filtering options. Use a star-ground topology: separate analog and digital grounds, joined at a single point near the MCU. Place a 100nF ceramic capacitor within 2mm of each Vdd pin (pins 1, 17, 33, etc.) and add a 10µF bulk cap on the main 3.3V rail. Route ADC input traces away from PWM outputs and clock lines; use guard rings tied to analog ground. Enable the internal ADC reference if available, or use an external low-noise reference. Finally, sample during PWM off-times to avoid switching noise coupling through shared power rails.

Is it safe to run the MC56F8145VFGE at 40MHz using an external crystal in a high-vibration automotive environment, and what oscillator design practices reduce failure risk?

Yes, but vibration can cause frequency drift or startup failure in standard crystals. The MC56F8145VFGE requires an external oscillator, and mechanical stress on the crystal can alter load capacitance or crack the package. Use a ruggedized, automotive-qualified crystal (e.g., ECS-200-18-30B-CGN) with a drive level under 1µW to avoid overdriving. Add a 1MΩ feedback resistor across the crystal pins and match load capacitors precisely to the crystal’s specified CL (typically 18pF). For extreme environments, consider replacing the crystal with a MEMS oscillator (e.g., SiT8008) directly driving OSC_IN, which eliminates sensitivity to vibration and improves startup reliability across the -40°C to 105°C range.

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