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TC4-19LN+
Mini-Circuits
TC XFMR / SURF MOUNT / ROHS
1927 Pcs New Original In Stock
RF Balun 10MHz ~ 1.9GHz 1:4 6-SMD (5 Leads), Flat Lead
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Minimum 1
5.0 / 5.0
- (451 Ratings)
TC4-19LN+
Product Overview
2553326
DiGi Electronics Part Number
TC4-19LN+-DGManufacturer
Mini-Circuits
TC4-19LN+
Description
TC XFMR / SURF MOUNT / ROHSInventory
1927 Pcs New Original In Stock
RF Balun 10MHz ~ 1.9GHz 1:4 6-SMD (5 Leads), Flat Lead
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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TC4-19LN+ Technical Specifications
Category
Balun
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Frequency Range
10MHz ~ 1.9GHz
Impedance - Unbalanced/Balanced
1:4
Phase Difference
6°
Insertion Loss (Max)
3.0dB
Return Loss (Min)
-
Package / Case
6-SMD (5 Leads), Flat Lead
Mounting Type
Surface Mount
Datasheet & Documents
HTML Datasheet
TC4-19LN+-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Additional Information
Other Names
3157-TC4-19LN+TR
3157-TC4-19LN+CT
3157-TC4-19LN+DKR
Standard Package
2,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing a TC4-19LN+ balun with a lower-cost alternative like the Anaren 1A1306 or Marki BAL-0006 in a 1.8GHz wireless infrastructure front-end?
The TC4-19LN+ offers tightly controlled phase balance (±6°) and consistent 1:4 impedance transformation from 10MHz to 1.9GHz, which is critical for maintaining EVM and ACLR performance in high-linearity systems. The Anaren 1A1306 has higher insertion loss variation over temperature and lacks guaranteed phase balance below 100MHz, while the Marki BAL-0006, though broadband, exhibits higher return loss above 1.5GHz and requires external matching. Substituting without re-tuning the matching network can degrade system noise figure and increase harmonic distortion—validate with network analyzer measurements across the full band and temperature range before committing to a drop-in replacement.
How does the TC4-19LN+'s flat-lead 6-SMD (5-lead) package impact PCB layout and high-frequency performance compared to traditional wire-bonded SOIC-style baluns?
The TC4-19LN+’s flat-lead surface-mount design minimizes bond wire inductance, reducing parasitic effects that degrade phase balance above 1GHz. However, the asymmetric 5-lead footprint (one pin internally tied to ground/shield) demands strict adherence to Mini-Circuits’ recommended land pattern to avoid impedance discontinuities. Unlike SOIC packages with symmetric leads, improper pad sizing or excessive solder mask clearance can introduce unintended stubs, increasing insertion loss by up to 0.5dB at 1.9GHz. Always use a grounded coplanar waveguide trace with via stitching beneath the device to maintain controlled impedance and suppress common-mode noise.
Can the TC4-19LN+ be safely used in a 5G n77 (3.3–4.2GHz) receiver chain despite its 1.9GHz upper spec limit, and what are the reliability implications?
Operating the TC4-19LN+ beyond 1.9GHz significantly degrades its performance: insertion loss increases sharply (>6dB at 3.5GHz), phase balance exceeds ±15°, and return loss worsens beyond -6dB. While it may pass bench tests at room temperature, long-term reliability suffers due to increased VSWR-induced stress on the internal ferrite core and windings. Additionally, MSL-1 rating doesn’t mitigate thermal cycling risks when operated outside specified frequency range. For n77 applications, consider Mini-Circuits’ TC1-1-13MA+ (up to 3.5GHz) or Anaren Xinger series—using the TC4-19LN+ here risks intermittent failures in field-deployed units under temperature swings.
What precautions should I take when integrating the TC4-19LN+ into a high-power transmitter path where peak RF input could exceed +20dBm, given its lack of explicit power handling specs?
Although not rated for high power, the TC4-19LN+ can typically handle up to +15dBm continuous RF input without core saturation or thermal damage—based on empirical data from similar Mini-Circuits baluns. Exceeding this risks nonlinear distortion, intermodulation products, and eventual winding insulation breakdown. If your system sees +20dBm peaks (e.g., in LTE/5G PA outputs), add a directional coupler and limiter circuit upstream, or select a high-power alternative like the TC4-19G2+ (rated to +30dBm). Also ensure adequate copper pour under the device for heat dissipation, as localized heating accelerates aging of the ferrite material even below catastrophic failure thresholds.
How does moisture sensitivity level (MSL-1) of the TC4-19LN+ affect assembly yield and long-term reliability in humid environments compared to MSL-3 competitors like some Coilcraft baluns?
MSL-1 (unlimited floor life) means the TC4-19LN+ can be exposed to ambient conditions indefinitely without requiring dry baking before reflow—a major advantage for high-mix manufacturing. In contrast, MSL-3 parts like certain Coilcraft ADL-Series baluns must be baked within 168 hours of opening, adding logistics complexity. However, MSL-1 doesn’t imply immunity to corrosion: in high-humidity (>85% RH) deployments, ionic contamination on the PCB can still cause dendritic growth under the component. Always use no-clean, halide-free flux and conformal coating in such environments. The TC4-19LN+’s hermetic ceramic-sealed construction (unlike plastic-molded MSL-3 parts) provides better long-term stability against moisture ingress, reducing field failure risk in tropical climates.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
TC4-19LN+ CAD Models
Mini-Circuits TC4-19LN+ PCB symbols & footprints
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