DBTC16-282LX+ >
DBTC16-282LX+
Mini-Circuits
DIR COUP, 5 - 2850 MHZ, 50
1643 Pcs New Original In Stock
RF Directional Coupler Cellular, DECT, GSM, PCN 5MHz ~ 2.85GHz 16.8dB 6-SMD, Flat Leads, 5 Leads
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DBTC16-282LX+ Mini-Circuits
5.0 / 5.0 - (368 Ratings)

DBTC16-282LX+

Product Overview

2553399

DiGi Electronics Part Number

DBTC16-282LX+-DG

Manufacturer

Mini-Circuits
DBTC16-282LX+

Description

DIR COUP, 5 - 2850 MHZ, 50

Inventory

1643 Pcs New Original In Stock
RF Directional Coupler Cellular, DECT, GSM, PCN 5MHz ~ 2.85GHz 16.8dB 6-SMD, Flat Leads, 5 Leads
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 6.7725 6.7725
  • 10 5.9640 59.6400
  • 30 5.4699 164.0970
  • 100 5.0558 505.5800
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DBTC16-282LX+ Technical Specifications

Category RF Directional Coupler

Manufacturer Mini-Circuits

Packaging Tape & Reel (TR)

Series -

Product Status Active

Coupler Type Standard

Frequency 5MHz ~ 2.85GHz

Coupling Factor 16.8dB

Applications Cellular, DECT, GSM, PCN

Insertion Loss -

Power - Max -

Isolation -

Return Loss 24dB

Package / Case 6-SMD, Flat Leads, 5 Leads

Supplier Device Package -

Datasheet & Documents

HTML Datasheet

DBTC16-282LX+-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Additional Information

Other Names
3157-DBTC16-282LX+CT
3157-DBTC16-282LX+DKR
3157-DBTC16-282LX+TR
Standard Package
1,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
꽃***자
de desembre 02, 2025
5.0
디지 일렉트로닉스는 고객을 위한 세심한 사후 서비스로 유명합니다. 언제든 도움을 받을 수 있어 안심이 됩니다.
Energi***tdecker
de desembre 02, 2025
5.0
Ich bin beeindruckt von der exzellenten Betreuung durch das Team von DiGi Electronics. Schnelle Antworten und klare Kommunikation sind garantiert.
風***やき
de desembre 02, 2025
5.0
注文から配送まで迅速で、さらにアフターサポートも素晴らしいです。おすすめです!
Drea***tcher
de desembre 02, 2025
5.0
DiGi's customer support team is very responsive and provides helpful guidance whenever I reach out.
Star***ight
de desembre 02, 2025
5.0
Every purchase from DiGi exceeds my expectations in quality and value.
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Frequently Asked Questions (FAQ)

When designing a multi-band cellular front-end with the DBTC16-282LX+, how should I handle impedance matching across its 5MHz to 2.85GHz range to avoid degraded coupling accuracy and return loss?

The DBTC16-282LX+ is optimized for 50Ω systems, but its coupling factor (16.8dB) and return loss (24dB) can degrade at band edges if impedance mismatches exist. Use broadband matching networks—such as pi- or T-networks with high-Q components—at both input and coupled ports, especially when interfacing with non-50Ω stages like PA outputs or LNA inputs. Simulate S-parameters across the full band in ADS or AWR, and validate with a VNA; even small discontinuities below 100MHz or above 2.5GHz can cause VSWR spikes that reduce effective isolation and increase insertion loss unpredictably.

Can I replace the DBTC16-282LX+ with a lower-cost coupler like the TDK HHM1595A1 in a GSM/DECT monitoring path without compromising system reliability?

While the TDK HHM1595A1 offers similar frequency coverage (up to 3GHz) and coupling (~17dB), it has significantly lower isolation (typically 18dB vs. DBTC16-282LX+’s >24dB return loss equivalent) and inferior power handling. In high-power GSM transmit paths (>30dBm), this reduced isolation may allow forward signal leakage into the coupled port, distorting power measurements or saturating downstream detectors. The DBTC16-282LX+’s superior port-to-port isolation and MSL-1 rating make it more reliable in dense SMD assemblies exposed to thermal cycling—stick with it for mission-critical monitoring or where calibration accuracy is paramount.

What layout precautions are critical when placing the DBTC16-282LX+ on a high-density RF PCB to maintain its specified 24dB return loss and prevent coupling drift?

The DBTC16-282LX+ uses a 6-SMD flat-lead package sensitive to parasitic inductance and ground plane discontinuities. Maintain a solid, unbroken ground plane beneath the device, avoid stitching vias too close to signal traces (which can introduce stubs), and keep input/output traces symmetrical and impedance-controlled (50Ω). Route coupled and isolated ports away from high-current digital lines or switching regulators—even minor crosstalk can manifest as coupling factor instability above 2GHz. Use guard traces with via fencing if necessary, and ensure solder mask clearance per Mini-Circuits’ recommended footprint to prevent dielectric loading that shifts effective coupling.

Is the DBTC16-282LX+ suitable for use in a DECT handset’s power control loop given its 16.8dB coupling factor and lack of specified max power handling?

Yes, but with caveats. While the DBTC16-282LX+ isn’t rated for high average power, DECT handsets typically transmit at +24dBm peak (≈250mW), which is within safe limits for this coupler’s internal structure—provided duty cycling (10% in DECT) is considered. However, the 16.8dB coupling means the coupled port sees ~7–8dBm, which may overload sensitive detector diodes without attenuation. Add a 3–6dB pad at the coupled output to protect downstream circuitry. Also, verify thermal performance in your enclosure; prolonged operation near max power without adequate copper pour can degrade long-term reliability despite the MSL-1 rating.

How does the DBTC16-282LX+ perform in a multi-carrier PCN base station environment where intermodulation distortion could affect adjacent channels?

The DBTC16-282LX+ is a passive, linear coupler and does not generate intermodulation products itself, making it inherently suitable for multi-carrier systems. However, its performance depends heavily on external factors: poor PCB layout, nonlinear solder joints, or nearby ferromagnetic materials can induce passive intermodulation (PIM). To mitigate risk, use gold-plated or tin-lead finishes (avoid pure tin), ensure tight solder joints without voids, and keep the coupler away from high-compression fasteners or steel enclosures. Validate PIM performance (< -150 dBc at 2×43dBm tones) in your final assembly—the DBTC16-282LX+’s flat-lead SMD design minimizes PIM risk compared to wire-bonded alternatives, but system-level practices dominate real-world behavior.

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