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MIC2800-G4MYML-TR
Microchip Technology
IC REG TRPL BUCK/LNR 2MHZ 16QFN
4398 Pcs New Original In Stock
PMIC - Voltage Regulators - Linear Switching 3 Output Step-Down (Buck) (1), Linear (LDO) (2) 2MHz 16-QFN (3x3)
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5.0 / 5.0
- (82 Ratings)
MIC2800-G4MYML-TR
Product Overview
1312588
DiGi Electronics Part Number
MIC2800-G4MYML-TR-DGManufacturer
Microchip Technology
MIC2800-G4MYML-TR
Description
IC REG TRPL BUCK/LNR 2MHZ 16QFNInventory
4398 Pcs New Original In Stock
PMIC - Voltage Regulators - Linear Switching 3 Output Step-Down (Buck) (1), Linear (LDO) (2) 2MHz 16-QFN (3x3)
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1
Minimum 1
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MIC2800-G4MYML-TR Technical Specifications
Category
Power Management (PMIC), Voltage Regulators - Linear + Switching
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Topology
Step-Down (Buck) (1), Linear (LDO) (2)
Number of Outputs
3
Frequency - Switching
2MHz
Voltage/Current - Output 1
1.8V, 600mA
Voltage/Current - Output 2
1.2V, 300mA
Voltage/Current - Output 3
2.8V, 300mA
w/LED Driver
No
w/Supervisor
No
w/Sequencer
No
Voltage - Supply
2.7V ~ 5.5V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-VFQFN
Supplier Device Package
16-QFN (3x3)
Base Product Number
MIC2800
Datasheet & Documents
HTML Datasheet
MIC2800-G4MYML-TR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
MIC2800G4MYMLTR
MIC2800-G4MYMLTR
576-1500-2
MIC2800-G4MYML TR
576-1500-1
Standard Package
5,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
La recherche par critères est très précise, elle m’a permis de filtrer rapidement mes options.
de desembre 02, 2025
Höchste Zufriedenheit mit den günstigen Angeboten und der schnellen Betreuung.
de desembre 02, 2025
Fast and dependable logistics make collaborating with DiGi Electronics very convenient.
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Frequently Asked Questions (FAQ)
How does the MIC2800-G4MYML-TR perform in high-noise automotive environments where EMI from switching regulators can interfere with sensitive analog circuits?
The MIC2800-G4MYML-TR combines one 2MHz switching buck regulator with two low-noise LDOs, making it well-suited for mixed-signal automotive applications. Operating the buck converter at 2MHz pushes switching noise above the AM band, reducing interference with RF and analog sensors. To mitigate EMI risks, use tight PCB layout practices: minimize high-current loop areas, place input capacitors close to VIN and PGND pins, and route sensitive traces away from SW. The integrated LDOs (1.2V and 2.8V outputs) further isolate noise-sensitive loads like sensors or RF modules from the buck regulator’s ripple, improving overall system signal integrity in harsh electrical environments.
Can the MIC2800-G4MYML-TR reliably power a 1.8V FPGA core and dual-rail MCU supply while maintaining thermal stability in a sealed enclosure?
Yes, the MIC2800-G4MYML-TR can power FPGA and MCU loads with its 1.8V/600mA buck output and dual LDOs, but thermal performance must be carefully evaluated. In a sealed enclosure with limited airflow and ambient temperatures reaching 85°C, the power dissipation from the buck and LDOs (especially under high dropout conditions) can lead to die temperatures approaching 125°C. To ensure reliability: optimize copper pour for thermal dissipation (use thermal vias under the exposed pad), avoid placing heat sources nearby, and verify worst-case power loss—particularly on the 2.8V LDO if supplying a 300mA load from a 5V input. If thermal margin is insufficient, consider external heat spreading or a lower dropout solution.
What are the key design-in risks when replacing the TPS62231 with the MIC2800-G4MYML-TR in a space-constrained IoT sensor node?
Replacing the single-output TPS62231 with the MIC2800-G4MYML-TR introduces integration complexity despite space and power savings. The MIC2800-G4MYML-TR integrates three regulators in a 3x3mm QFN, saving board area, but requires careful power sequencing and load management since it lacks built-in sequencing or supervisor logic. Unlike the TPS62231, which has standalone operation, the MIC2800-G4MYML-TR’s three outputs may start up simultaneously, risking inrush current if heavily capacitive loads are connected. Designers must verify soft-start behavior, limit output capacitance to ≤10μF per rail, and ensure input supply can handle peak inrush. Additionally, verify that enable timing aligns with system requirements to avoid brown-out events.
How does the efficiency of the MIC2800-G4MYML-TR’s 2MHz buck regulator compare to discrete solutions like the RT6206 when powering a 1.8V IoT radio module?
The MIC2800-G4MYML-TR’s integrated 2MHz, 600mA buck regulator offers comparable efficiency to discrete solutions like the RT6206 under light to medium loads (50–300mA), but with better space efficiency. At 3.7V input to 1.8V output, efficiency peaks around 88–90% due to optimized internal FETs and 2MHz operation. However, discrete solutions may offer slightly better full-load efficiency due to lower RDS(on) MOSFETs. The trade-off is PCB area and BOM complexity—MIC2800-G4MYML-TR reduces component count by integrating inductors externally but minimizing passives. For battery-powered radios, use ceramic capacitors with low ESR and keep inductor DCR <50mΩ to maintain efficiency. Avoid light-load PWM mode if ultra-low quiescent current is critical, as the MIC2800-G4MYML-TR does not auto-transition to power-save modes.
What are the long-term reliability concerns when using the MIC2800-G4MYML-TR in industrial motor control systems with frequent thermal cycling?
In industrial motor control applications, the MIC2800-G4MYML-TR is rated for -40°C to 125°C operation, but thermal cycling can accelerate wear-out mechanisms in the 16-QFN package. The primary reliability risks are solder joint fatigue due to CTE mismatch and die-attach degradation under repeated power cycling. To mitigate: ensure robust PCB thermal design with full thermal pad connection using an array of grounded thermal vias, avoid over-constraining the package during enclosure assembly, and limit temperature swings by managing system power-up sequencing. Additionally, humidity sensitivity level (MSL-3) requires baking if exposed >168 hours in >30% RH environments before reflow. Follow JEDEC J-STD-020 guidelines to prevent popcorning and ensure long-term field reliability in harsh industrial settings.
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MIC2800-G4MYML-TR CAD Models
Microchip Technology MIC2800-G4MYML-TR PCB symbols & footprints
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