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Product Overview: MIC2019YM6-TR Power Switch
The MIC2019YM6-TR power switch leverages a P-channel MOSFET design to implement high-side switching with minimal voltage drop and efficient power management. By embedding active current limiting, the device dynamically controls fault conditions such as output short circuits or overloads. The programmable current limit—configurable via an external resistor—enables precise tailoring to diverse downstream load profiles, reducing nuisance trips and optimizing system reliability.
Integrated thermal shutdown circuitry increases the robustness of the MIC2019YM6-TR. This feature reacts rapidly to excessive junction temperatures, automatically disconnecting the load to prevent MOSFET damage and to circumvent potential hazards in densely populated boards where thermal management is critical. Operational stability is further enhanced by internal charge-pump and logic control mechanisms, which ensure rapid, glitch-free switching even during power-up sequences or transient load events.
Control is simplified through enable/disable logic compatible with standard microcontrollers and low-voltage digital logic. This enables seamless integration into complex power domains managed by embedded systems, where staged power sequencing and remote control are crucial for minimizing inrush currents and sequencing peripherals safely.
Design flexibility is further boosted by the device’s compatibility with a wide 2.5V to 5.5V input range. This supports deployment in USB power distribution, hot-swap backplanes, portable instrumentation, and industrial controls—environments where compactness and reliability must coexist. The SOT-23-6 footprint allows for direct replacement of legacy discrete implementations, permitting significant board area savings and improved manufacturability. In practice, the reduction in external component count and thermal dissipation allows for greater circuit density without compromising safety margins.
A key technical distinction in the MIC2019YM6-TR is its fast fault response architecture. Rapid current cut-off and reset capabilities preserve both the protected load and the upstream power supply, a critical requirement in distributed systems where cascading faults jeopardize multiple nodes. In applications such as USB power ports, these attributes also contribute to compliance with regulatory standards regarding fault isolation and device safety.
Routine deployment in tightly packed consumer and industrial systems underscores the switch’s resilience against voltage spikes and electrostatic events. Field experience demonstrates that robust ON/OFF control and predictable fault handling directly reduce warranty claims and support cost. Through careful PCB layout—positioning the switch close to connector loads and maintaining solid ground returns—designers enhance both transient protection and radiated EMI performance.
At the architectural level, the MIC2019YM6-TR demonstrates a refined balance between compact integration and multilayered protection strategies. Its design encourages a system-level approach that leverages built-in features for both preventive and responsive safety, unlocking new possibilities for compact, power-dense solutions that maintain operational security even under unexpected loading or environmental stress.
Key Features of MIC2019YM6-TR
The MIC2019YM6-TR integrates several advanced features engineered to address the multifaceted requirements of modern power distribution applications. Central to its design is a precision programmable current limiting mechanism, adjustable from 0.2A to 2.0A through an external resistor. This enables robust circuit protection across a spectrum of load conditions. The underlying current sense architecture is optimized for fast response, minimizing the risk of device or load damage during fault events or unexpected shorts. Notably, the calibration flexibility permits tailoring the current threshold to the unique demands of downstream components, such as FPGAs or USB peripherals, without sacrificing either system uptime or serviceability.
A key attribute of the device is its ultra-low typical on-resistance—measured at 70mΩ when operating at 5V. Such low RDS(ON) ensures negligible voltage loss and heat rise during full-load operation. This characteristic is particularly advantageous in densely populated boards or passively cooled enclosures, where thermal budgets are strict. In practical system layouts, this enables increased packing density and reduces the need for oversized copper planes or heat spreading materials.
The broad 2.5V to 5.5V input range covers an array of standard logic and USB voltage domains, simplifying BOM management and maximizing interoperability. In multi-rail designs, the device’s under-voltage lock-out (UVLO) not only prevents undervoltage-related malfunction but also allows designers to fine-tune the UVLO threshold according to specific application requirements. This adaptive UVLO configuration is achieved externally, ensuring consistent startup sequencing in systems featuring staggered rail activation—a frequent scenario in embedded and communication equipment.
Thermal management is reinforced with an embedded thermal shutdown circuit that asserts at 145°C and auto-recovers once the temperature falls below 135°C. This hysteresis strategy avoids chattering during borderline thermal cycling while offering well-defined thermal fault reporting. In prototyping scenarios, this behavior has demonstrated strong resilience under stacked fault conditions, such as concurrent overloads and ambient temperature spikes, by reliably isolating the output until safe operation is restored.
One of its most distinctive features is the proprietary Kickstart™ technology, designed to handle the challenging requirements of loads with substantial inrush currents—such as those with high-capacitance input stages or cold-start motors—without erroneously tripping current limit protection. The device momentarily supports current spikes, then seamlessly reverts to the programmed steady-state limit. Field observations confirm that this functionality dramatically reduces nuisance shutdowns during power-up, especially in USB hub applications or systems employing bulk capacitance filtering.
Fault handling is further enhanced by integrated reporting mechanisms. The open-drain FAULT/ output, coupled with noise-immune blanking delays, ensures accurate signaling to system controllers while filtering out transient anomalies. This attribute proves useful during heavy load switching or ESD/EMI events, which might otherwise generate false alarms.
The inclusion of programmable soft-start and output slew rate control marks another significant advantage. By moderating the initial voltage ramp, these features mitigate inrush currents directed to capacitive or sensitive loads, thereby extending field reliability and simplifying compliance with upstream power supply constraints. Adjustable ramp parameters are particularly relevant in applications where shared rails power both digital and analog domains; careful tuning can prevent cross-domain interaction and minimize susceptibility to brownouts.
Flexible interfacing is realized via a logic-compatible ENABLE pin, which can be configured for either active high or active low operation, streamlining integration across diverse logic families. When designing multi-channel modular power architectures, the open-drain nature of the FAULT/ output and the programmable polarity of ENABLE simplify bused interconnection and fault coordination, reducing both latency and external component count.
These layered features demonstrate a thoughtful balance between configurability, protection, and ease of implementation. In systems with stringent protection requirements, constrained form factors, or variable load profiles—such as industrial controllers, USB charging stations, or embedded compute modules—the MIC2019YM6-TR delivers a high degree of engineering confidence. Its architecture sets a benchmark for combining fast-acting protection, thermal resilience, and practical integration, highlighting the ongoing evolution of load switch solutions toward smarter and more adaptive power management.
Core Functions and Operating Principles of MIC2019YM6-TR
Core operating mechanisms of the MIC2019YM6-TR center on precise electronic switching, current management, and robust circuit protection, underpinned by a high-side N-channel MOSFET driven by specialized internal logic. This structure permits direct integration into DC power rails, facilitating real-time control of load connectivity in advanced digital systems. The MOSFET is deployed high-side, bridging VIN and VOUT, and isolates or couples the supply rail to downstream circuitry according to control logic levels. This configuration not only streamlines load switching but also inherently reduces voltage drop compared to mechanical relays or low-side schemes, contributing to system efficiency and thermal management.
The MIC2019YM6-TR achieves true bi-directionality within specified conditions: with the switch enabled, current can propagate from input to output under standard forward conduction. When VOUT exceeds VIN, the architecture supports limited reverse conduction—subject to MOSFET and body diode behavior—while maintaining stringent isolation when disabled. This bi-directional paradigm extends applicability to scenarios involving battery-load balancing, hot-swapping, or power-sharing nodes, minimizing reverse leakage and parasitic power loss.
Integrated current sensing leverages an on-die current mirror, essential for both instantaneous protection and accurate system-level telemetry. The device enforces a programmable current limit, acting preemptively to throttle output in excess-load or fault conditions such as downstream shorts. This protection quickly manifests in practice, significantly reducing the risks of copper trace overheating, device damage, or upstream supply collapse during fault events. The real-time response distinguishes the device from discrete or slower analog current limiting solutions.
The innovative Kickstart™ feature is engineered for applications characterized by non-linear inrush behavior, most notably with electro-mechanical loads or bulk capacitances. On enable, the device temporarily elevates the current threshold—typically for 128ms—to accommodate large transient currents without premature current-limiting intervention. For system engineers, this function eliminates the perennial tradeoff between overprotective current limits and reliable peripheral spin-up, supporting seamless startup of disk drives, printers, or large sensor arrays. In performance-critical designs, observed startup glitches and undervoltage resets are markedly reduced using this dynamic current-limiting window.
A tightly monitored under-voltage lock-out circuit ensures system stability by actively disabling the output stage if VIN descends below a guarded threshold of 2V–2.5V. This mitigates erratic downstream behavior and inadvertent MOSFET conduction during brownouts or supply transitions, which is especially valuable in mobile or USB-powered applications subject to cable drops and input instability.
Precision fault reporting is realized via the open-drain FAULT/ output, which asserts in response to sustained overcurrent or thermal shutdown states after a set delay. The delay is programmable, fostering noise immunity and preventing spurious fault flagging during brief transients such as capacitive charging. In field deployments, this capability enables intelligent syslog capture, system-level event correlation, and real-time user notifications without excessive nuisance tripping.
The MIC2019YM6-TR thus provides layered protection and control, giving practical benefits in high-availability platforms. Its design implicitly encourages a systems approach to power-path engineering, supporting modular expansion, peripheral hot-plugging, and adaptive load management. Embedded in digital infrastructure, the device simplifies regulatory compliance and promotes predictable, maintainable system behavior under both routine and abnormal conditions, differentiating itself from less-integrated discrete approaches through rapid response, configurability, and robust signaling.
Application Scenarios for MIC2019YM6-TR
The MIC2019YM6-TR power distribution switch is engineered to address the complex demands of modern electronic systems, particularly those requiring precise control of power up-sequencing and comprehensive protection mechanisms. At its core, the device integrates advanced current limiting and thermal shutdown functions with low RDS(ON) MOSFETs, ensuring minimal voltage drop and efficient heat dissipation even under continuous load. This foundation supports reliable circuit behavior across a spectrum of operating conditions, maintaining system stability during transients or fault events.
In digital televisions, set-top boxes, and printers, the MIC2019YM6-TR excels in managing the challenging inrush currents caused by onboard peripherals at power-up. The internal soft-start mitigates excessive voltage overshoot, while the programmable current-limit threshold adapts to varying peripheral profiles, preventing nuisance trips yet ensuring critical components remain protected. Experience from practical deployments indicates that leveraging the adjustable current limit effectively addresses peripheral variance—particularly where board-level customization is necessary due to evolving hardware configurations.
For USB and IEEE 1394 port protection, strict compliance with established current-limiting and overcurrent requirements is essential. The device’s fast fault response and accurate shutdown thresholds align with host controller specifications, safeguarding both the upstream controller and connected client devices. This forms a vital protection barrier against unregulated short circuits or cable faults, simultaneously maintaining user safety and hardware integrity. The MIC2019YM6-TR’s internal circuit architecture is optimized for low standby power, aligning with energy efficiency mandates often imposed by regulatory frameworks.
Portable electronics, including notebook PCs, docking stations, and mobile gaming platforms, leverage the MIC2019YM6-TR for enhanced battery management and peripheral hot-plugging resilience. The switch’s soft-start feature, aside from suppressing inrush, facilitates seamless connection, minimizing brownout and instability risks—especially in battery-powered designs with aggressive power budgets. Site-level feedback reflects that embedding this device in such systems consistently reduces customer field failures related to connector arcing and excessive transient currents during accessory attachment.
Industrial controllers, test instruments, and embedded applications benefit from robust hot-swap and capacitive load management. The MIC2019YM6-TR’s flexible enable control and fault reporting streamline integration into complex supervisory architectures, enabling dynamic power domain management. Its small package footprint supports dense board layouts, a non-trivial advantage as enclosure sizes shrink and channel counts escalate. Subtle improvements in uptime and serviceability arise from this integration, with reduced manual intervention required during board maintenance or expansion cycles.
Viewed holistically, the MIC2019YM6-TR’s system-level impact lies in its synthesis of protection, adaptability, and integration. Its design not only buffers sensitive electronics from unpredictable operating hazards but also anchors intelligent power sequencing strategies fundamental to next-generation device architectures. Selecting components with this level of functional density is a forward-looking approach—anticipating both immediate application requirements and long-term system evolution.
Electrical and Thermal Performance of MIC2019YM6-TR
Electrical and thermal characteristics of the MIC2019YM6-TR define its reliability and efficiency under demanding operational conditions. The absolute maximum voltage specifications—VIN and VOUT constrained between -0.3V and +6V, with other pins limited to 5.5V—highlight the device’s tolerance to transient events and the critical need for voltage margin control at every interface. Ensuring signals and supply rails remain within these thresholds is essential for avoiding stress-induced degradation and safeguarding long-term device integrity, particularly in systems exposed to unpredictable power sources or noise.
Continuous output current capability reaches up to 2.1A when adequate thermal management is implemented. This rating positions the component as viable for contemporary high-power delivery protocols, such as for USB ports or power regulation in compact embedded platforms. Observed current ratings in real-world assemblies indicate that consistent performance at the upper limit is tightly coupled to the underlying PCB layout, heat dissipation structures, and component spacing. Empirical tests show that dense board population and limited airflow necessitate enhanced copper pours and strategic thermal vias under and around SOT-23-6 footprints to maintain junction temperatures well below safety thresholds.
On-resistance, measured at a typical 70mΩ at 5V, inherently reduces conduction losses and heat generation during normal load conditions. This low resistance footprint directly translates to heightened efficiency, especially in battery-powered devices where energy conservation is paramount. The resulting power dissipation (P=I²R) remains contained, minimizing unwarranted thermal rise and maximizing overall system longevity. Projects targeting mobile or fanless applications benefit distinctly from this attribute as it allows for tighter thermal design windows without compromising operational stability.
Thermal resistance stands at 230°C/W for the SOT-23-6 package, underscoring the pronounced influence of environmental and layout factors. High thermal impedance means junction temperatures can escalate rapidly under load if thermal paths are neglected. Simulation studies and measured prototypes confirm that extending ground planes, maximizing copper area, and optimizing component arrangement are decisive in achieving rated output without triggering protective mechanisms. This thermal behavior must be engineered with foresight, considering application heat sources and ambient constraints.
The integrated thermal shutdown function first disables device output at 145°C junction temperature, then automatically restarts after cooling to 135°C. This mechanism delivers active resilience against overheating, particularly valuable during fault scenarios such as extended overcurrent situations or elevated ambient temperatures. Fast response cycles have been shown to prevent repetitive thermal cycling stress, shielding downstream circuitry and preserving critical interface specifications.
Optimal exploitation of MIC2019YM6-TR performance demands holistic coordination of electrical limits, thermal engineering, and layout refinement. Subtle deviations in board design rapidly manifest as thermal saturation or voltage excursions, reinforcing the necessity for meticulous prototyping and iterative design validation. Implementing robust margin checks, disciplined routing, and proactive heat management not only elevates device reliability but unlocks operational territory closer to specification limits, enabling aggressive power delivery with sustained safety.
Design and Implementation Considerations for MIC2019YM6-TR
Optimizing MIC2019YM6-TR deployment demands rigorous alignment of circuit parameters with system-level constraints. Device programmability centers on precise current limit configuration via RSET impedance. Selection calls for referencing tolerance statistics provided by the manufacturer, then margining results against worst-case application load. Empirically, meticulous bench validation can uncover real-world deviation from theoretical values, reinforcing the importance of periodically verifying current protection thresholds on assembled boards. Such attention preempts nuisance trips and avoids power overstress.
Thermal dissipation emerges as a bottleneck where sustained output exceeds 1A or under environments with elevated ambient temperature and restricted airflow. Practical PCB layouts harness expansive copper planes beneath and adjacent to VIN and GND terminals, substantially reducing junction-to-ambient thermal resistance. Engineers leveraging MLF packaging attain lower thermal impedance, especially evident during high-frequency switching or short-duration current excursions. Experience shows that optimizing via density and minimizing thermal islands directly correlates to lower package temperature rise, enhancing operational longevity.
Input supply stability hinges on strategic capacitor deployment. A low-ESR 1μF ceramic placed within millimeters of VIN and GND mitigates high-frequency noise and resists voltage droop, critical during load transients. Supplementing with sub-microfarad capacitance further attenuates high-speed switching artifacts, especially in applications sensitive to supply-induced perturbations. Design iterations typically involve scope-based validation of transient events to refine final capacitance values in-circuit.
Managing output slew rate via CSLEW capacitance introduces multidimensional trade-offs. For loads susceptible to inrush current, ramp tailoring avoids exceeding upstream supply limits. The designer must balance response with protection: excessive capacitance risks delayed fault reaction in event of a hard short. Real-world implementation benefits from gradual capacitance incrementing during prototyping, observing live output overshoot and fault latency, then adjusting to meet system stability targets.
Undervoltage lockout (UVLO) configuration by resistor divider demands a systematic approach. Calculated VUVLO setpoints must sit safely above minimum operational thresholds of both the regulator and downstream logic, factoring startup voltage dip and battery profiles. Tuning achieves preemptive cutoff before brownout can propagate erroneous system behavior. In multi-voltage environments, staggered UVLO points provide hierarchical protection, verified through repeatable lab-induced voltage sag scenarios.
Fault reporting via FAULT/ integration merits special attention in synchronous monitoring environments. Pull-up design not only ensures valid logic levels but accommodates multi-unit signaling via wire-OR topology, a frequent choice in redundant and high-availability systems. Oscilloscope-based monitoring of FAULT/ pulse width and propagation delay under simulated fault reinforce robust interconnection choices for comprehensive system diagnostics.
PCB layout underpins both electrical and thermal integrity. Minimizing trace resistance and inductance across the main current path ensures rapid fault isolation and minimizes parasitic voltage drop during high current transients. Direct interface between exposed pad and thermal conduction planes yields notable reductions in steady-state package temperature, validated through IR thermography in prototype assemblies.
Strategic system-level integration relies on continually reassessing the correlation between electrical protection, thermal dynamics, and expected operating profiles. A tightly-coupled design approach, informed by iterative empirical measurement and simulation, ensures MIC2019YM6-TR performance aligns with both reliability and fault-tolerance objectives even in demanding application spaces. Unique insight can be drawn from blending simulation with extended actual load testing, closing the loop between theoretical design parameters and live system behavior in dynamic scenarios.
Package and Integration Details of MIC2019YM6-TR
The MIC2019YM6-TR leverages the compact SOT-23-6 package, aligning with the stringent footprint requirements typical of modern high-density PCB design. This package choice streamlines component placement in portable and space-limited systems, facilitating denser circuit aggregation without compromising assembly yield or manufacturability. The SOT-23-6’s standardized pad layout expedites automated assembly, ensuring compatibility with prevalent reflow soldering techniques and minimizing solder joint defects—a critical consideration for high-reliability products.
Pin allocation on the MIC2019YM6-TR is engineered for pragmatic board routing, with power, logic, and control lines intuitively grouped to reduce trace complexity. This organizational philosophy not only simplifies schematic capture and PCB layout but also curtails impedance discontinuities and unintended coupling, thus supporting signal integrity across the device’s operating envelope. Strategic pin placement further eases the introduction of test points and layout for external passive elements, particularly in applications sensitive to transient response or EMI.
Thermal management remains integral to deploying any compact device. While the SOT-23-6 affords satisfactory dissipation for moderate currents, its thermal resistance constrains long-duration, high-current uses. Within the MIC20xx series, device selection can pivot to packages with enhanced thermal pads or larger leadframes, scaling up current capacity and improving heat spreading. In practice, optimizing copper pours beneath and around the device—combined with via stitching—can enhance local heat removal significantly, often extending performance margins without board area penalties.
Integration into broader assembly flows is further reinforced by the Pb-free, JEDEC-compliant packaging standard, which accommodates both leaded and lead-free processes. This adaptability facilitates cross-platform deployment and eases regulatory certification in diverse geographies. The package’s mechanical robustness withstands multiple reflow cycles, a notable advantage during proto-assembly rework or multi-step manufacturing.
Observed in deployment, careful component orientation and aligning critical nets for short, direct traces consistently mitigates parasitic effects. This becomes especially vital in densely-packed, battery-powered systems where efficiency and noise immunity carry heightened importance. Unique to SOT-23-6, its balance of small size with sufficient lead count offers a sweet spot for integrating moderate-complexity power switching and protection functions, avoiding the trade-offs seen in more minimalistic footprints.
Ultimately, the MIC2019YM6-TR’s packaging and integration characteristics translate directly to expedited design cycles and robust field reliability in demanding form factor-constrained solutions. Its ease of inclusion within standard SMD flows and thoughtful pinout planning reduce friction from early prototyping through to volume production, driving both engineering productivity and long-term board-level reliability.
Potential Equivalent/Replacement Models for MIC2019YM6-TR
The MIC2019YM6-TR is part of Microchip Technology’s MIC20XX family, a suite of high-side power switches engineered for precise current limiting, load protection, and robust system integration. The underlying architecture of these devices centers on an integrated MOSFET driver paired with fast over-current protection and thermal shutdown, making them suitable for hot-swap, USB port power management, and local power distribution in embedded platforms.
Identifying functionally equivalent or replacement models requires a layered examination of both macro and micro-level compatibility. Devices such as the MIC2009YM6-TR share core features, notably adjustable current limiting and comprehensive fault safeguarding, but may exhibit subtle divergences in control logic (active high versus active low enable), package type, or thermal performance. Reviewing the exact control signal polarity and output status conventions is crucial to avoid mismatches with existing system firmware or PCB routing. Nuances in package outlines (SOT-23-6, MSOP-8, or DFN variants) can drive layout constraints or necessitate mechanical design adjustments, especially in space-limited assemblies.
Broadening the selection within the MIC20XX family, alternatives like the MIC2005, MIC2015, or MIC2019A are optimized for scenarios demanding fixed current limits or modified start-up behaviors, as seen in non-Kickstart™ versions. Specifying these parts is most effective when the application has deterministic load characteristics or where the thermal profile is tightly enveloped by ambient conditions. Intrinsic to successful replacement is a disciplined cross-check of the device’s electrical characteristics—feedback current thresholds, fault timing, and quiescent consumption must meet system requirements without introducing latent compatibility risks.
In practice, direct substitutability is achieved only when every layer of specification aligns: on-paper electrical ratings; control logic interface; and mechanical fit. Effective evaluation leverages comparison tables supplied by the manufacturer, scrutinizing pin mapping, thermal ratings, and functional flags (such as error output behavior or startup mode). The application environment often imposes further constraints—high-side switch installation in USB port power delivery or battery management modules demands not only stringent protection but also consistency in latch-off behavior and output voltage tracking under load transients.
Integrating replacement devices into mature systems often reveals implicit dependencies on timing sequences and fault propagation paths not captured in datasheets. Empirical validation in representative load conditions uncovers differences in protection cycling, tolerance to voltage excursions, and response under repeated inrush or short-circuit events. Unique insights emerge from iterative testing: some MIC20XX variants offer unexpectedly fast recovery after faults or lower leakage in shutdown mode, subtly improving system endurance and efficiency. These performance deltas become critical in high-uptime or safety-intensive applications.
A methodical approach—rooted in aligning current management topology, interface logic, and package compatibility—enables engineering teams to exploit the full breadth of replacement options in the MIC20XX series. This extends system longevity and performance while mitigating risks inherent in supply chain fluctuations or evolving technical standards.
Conclusion
The MIC2019YM6-TR power switch exemplifies modern electronic power control through the integration of precise current management, thermal stability, and active fault protection in a compact form factor. At its core, programmable current limiting provides granular control over downstream load profiles, allowing precise adaptation to varying short-term and steady-state consumptions. Adjustable thresholds can compensate for diverse peripheral requirements, minimizing nuisance tripping while preserving component reliability.
Embedded protection mechanisms—short-circuit, under-voltage, and thermal shutdown—operate autonomously, isolating faults rapidly without microcontroller intervention. The low RDS(on) of the internal MOSFET reduces conduction losses, supporting higher current densities and improving conversion efficiency in space-constrained systems. Kickstart™ mode further differentiates the solution by supporting inrush-heavy loads, such as bulk capacitors or motor drivers, without overspecifying infrastructure; this transient override balances startup demand with long-term circuit safety, an essential feature when dealing with hybrid digital-analog loads or distributed power rails.
Application deployment benefits from this architecture by streamlining compliance with stringent system safety criteria, especially in distributed USB and automotive subsystems where overcurrent tolerance and load hot-plugging occur routinely. Real-world integration highlights the necessity of optimizing PCB copper area under thermal stress and carefully selecting surrounding bypass components to maximize transient response. Observations reveal that, when coupled with purpose-matched current sense resistors and meticulous routing, the MIC2019YM6-TR sustains reliable protection even under aggressive transient loading, minimizing late-stage design revisions.
Ultimately, the device offers not just a collection of protection features but an engineered platform enabling deterministic power management. This blend of flexibility and robustness, underpinned by nuanced configuration options, positions the MIC2019YM6-TR as a control node adaptable to both conventional and forward-leaning embedded architectures. Integrators thus acquire an effective path to balancing operational resilience with the evolving requirements of modern electronics.
