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MCP2003-E/MD
Microchip Technology
IC TRANSCEIVER HALF 1/1 8DFN
1441 Pcs New Original In Stock
1/1 Transceiver Half LINbus 8-DFN (4x4)
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MCP2003-E/MD
Product Overview
1477024
DiGi Electronics Part Number
MCP2003-E/MD-DGManufacturer
Microchip Technology
MCP2003-E/MD
Description
IC TRANSCEIVER HALF 1/1 8DFNInventory
1441 Pcs New Original In Stock
1/1 Transceiver Half LINbus 8-DFN (4x4)
Quantity
Minimum 1
Minimum 1
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MCP2003-E/MD Technical Specifications
Category
Interface, Drivers, Receivers, Transceivers
Packaging
Tube
Series
-
Product Status
Active
Type
Transceiver
Protocol
LINbus
Number of Drivers/Receivers
1/1
Duplex
Half
Receiver Hysteresis
175 mV
Data Rate
-
Voltage - Supply
6V ~ 27V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-VDFN Exposed Pad
Supplier Device Package
8-DFN (4x4)
Base Product Number
MCP2003
Datasheet & Documents
HTML Datasheet
MCP2003-E/MD-DG
PCN Design/Specification
MCP2003,4(A) Datasheet Update 18/Nov/2014
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
MCP2003EMD
Standard Package
91
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
配送スタッフの対応も良く、気持ちよく商品を受け取ることができました。
de desembre 02, 2025
Their customer support team is always approachable and helpful.
de desembre 02, 2025
The clarity of their communication and the professionalism of their staff make working with them effortless.
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Frequently Asked Questions (FAQ)
Can the MCP2003-E/MD be safely used in a 12V automotive system with frequent load dump transients exceeding 40V, and what protection circuitry is recommended to avoid damage?
The MCP2003-E/MD has a maximum supply voltage of 27V, making it vulnerable to automotive load dump events that can reach 40V or higher. While its robust design supports operation up to 27V, sustained overvoltage will damage the device. To safely use the MCP2003-E/MD in such environments, implement a TVS diode (e.g., SMAJ33A) rated for 33V clamping voltage and a series current-limiting resistor or PTC fuse on the VBAT line. Additionally, consider an LC filter or active load dump suppressor (like the LDO-based MIC94090) upstream to ensure input voltage stays within spec during transient events.
Is the MCP2003-E/MD suitable as a drop-in replacement for the TJA1020T in a LIN 2.0 network, and what firmware or hardware changes might be required?
The MCP2003-E/MD is not a direct drop-in replacement for the NXP TJA1020T due to differences in wake-up behavior, slope control, and internal biasing. While both support LIN 2.0, the TJA1020T includes integrated slope control and a dedicated INH pin for power management, which the MCP2003-E/MD lacks. Replacing the TJA1020T with the MCP2003-E/MD may require external RC networks for slew rate control and modifications to the microcontroller’s wake-up detection logic. Verify timing margins and bus dominance thresholds during validation, especially in low-power sleep/wake scenarios.
How does the MCP2003-E/MD handle bus contention when multiple nodes attempt to transmit simultaneously on a LIN network, and what are the risks of using it in multi-slave configurations without proper termination?
The MCP2003-E/MD uses standard LIN physical layer arbitration, where the dominant state (low) overrides recessive (high), allowing natural collision resolution. However, in multi-slave LIN networks, improper termination—such as missing the required 1kΩ pull-up to VBAT on the master node or excessive stub lengths—can cause signal reflections and bit errors. The MCP2003-E/MD’s 175 mV receiver hysteresis helps reject noise, but without correct termination (typically 1kΩ + 30pF to ground at the master), voltage levels may not meet LIN specifications, leading to communication failures. Always follow LIN physical layer guidelines and validate eye diagrams during prototype testing.
What are the thermal implications of using the MCP2003-E/MD in an 8-DFN exposed pad package under continuous high-current bus fault conditions, and how should PCB layout be optimized to prevent overheating?
The MCP2003-E/MD in the 8-DFN (4x4) exposed pad package relies heavily on PCB copper for heat dissipation. Under fault conditions like sustained bus shorts, internal current limiting activates, but power dissipation can still exceed 500 mW, raising junction temperature significantly. To mitigate thermal risk, connect the exposed pad to a solid ground plane with multiple thermal vias (e.g., 6–9 vias of 0.3mm diameter) and ensure adequate copper area on the top and inner layers. Avoid placing heat-sensitive components nearby, and consider ambient temperature derating—especially near the 125°C maximum operating limit—in enclosed automotive modules.
Can the MCP2003-E/MD operate reliably in a 24V truck electrical system where the nominal voltage is 28V during charging, and how does this impact long-term reliability compared to industrial-grade LIN transceivers?
Although the MCP2003-E/MD supports up to 27V supply voltage, operating it continuously at 28V in a 24V truck system exceeds its absolute maximum rating and risks premature failure due to oxide stress and electromigration. While brief charging surges may be tolerated with external clamping, sustained overvoltage accelerates aging. For 24V systems, consider using a transceiver rated for 40V operation, such as the MCP2021A or TLE7259-3GE, which are designed for heavy-duty vehicles. If using the MCP2003-E/MD is unavoidable, implement a regulated pre-supply (e.g., buck converter to 12V) or a Zener-based clamp circuit to ensure voltage never exceeds 27V under any condition.
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MCP2003-E/MD CAD Models
Microchip Technology MCP2003-E/MD PCB symbols & footprints
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