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MCP1755T-5002E/OT
Microchip Technology
IC REG LINEAR 5V 300MA SOT23-5
20509 Pcs New Original In Stock
Linear Voltage Regulator IC Positive Fixed 1 Output 300mA SOT-23-5
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MCP1755T-5002E/OT Microchip Technology
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MCP1755T-5002E/OT

Product Overview

1298991

DiGi Electronics Part Number

MCP1755T-5002E/OT-DG
MCP1755T-5002E/OT

Description

IC REG LINEAR 5V 300MA SOT23-5

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20509 Pcs New Original In Stock
Linear Voltage Regulator IC Positive Fixed 1 Output 300mA SOT-23-5
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MCP1755T-5002E/OT Technical Specifications

Category Power Management (PMIC), Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

Manufacturer Microchip Technology

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

Output Configuration Positive

Output Type Fixed

Number of Regulators 1

Voltage - Input (Max) 16V

Voltage - Output (Min/Fixed) 5V

Voltage - Output (Max) -

Voltage Dropout (Max) 0.5V @ 300mA

Current - Output 300mA

Current - Quiescent (Iq) 100 µA

Current - Supply (Max) 400 µA

PSRR 80dB (1kHz)

Control Features Enable, Power Good

Protection Features Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)

Operating Temperature -40°C ~ 125°C

Mounting Type Surface Mount

Package / Case SC-74A, SOT-753

Supplier Device Package SOT-23-5

Base Product Number MCP1755

Datasheet & Documents

HTML Datasheet

MCP1755T-5002E/OT-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
MCP1755T-5002E/OTDKR
MCP1755T-5002E/OTCT
MCP1755T-5002E/OT-DG
MCP1755T-5002E/OTTR
Standard Package
3,000

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
MCP1802T-5002I/OT
Microchip Technology
7068
MCP1802T-5002I/OT-DG
0.5539
MFR Recommended
NCP4626DSN050T1G
onsemi
1594
NCP4626DSN050T1G-DG
0.5539
Similar

MCP1755T-5002E/OT: High-Performance 5V, 300mA LDO for Low-Power and Precision Electronics

Product Overview of MCP1755T-5002E/OT

The MCP1755T-5002E/OT leverages CMOS process optimization to provide a fixed 5V regulated output with a maximum load of 300mA. This regulation is achieved across a broad input range of 3.6V to 16V, accommodating scenarios like battery-powered systems, industrial sensor nodes, and automotive subsystems where wide voltage variability is common. The LDO’s architecture features a highly integrated pass element and internal feedback loop, minimizing voltage drops and suppressing transient fluctuations, which is critical for subsystems sensitive to ripple or noise.

The product carefully balances operational efficiency and signal integrity. Its low quiescent current minimizes parasitic drain, especially during standby operation, directly supporting longer battery life in portable designs. Engineers deploying the MCP1755T-5002E/OT in distributed power topologies benefit from its high PSRR, outstandingly rejecting ripples from upstream converters and noisy supply buses. This mitigates potential interference in analog front ends and microcontroller circuits.

Robust protection features—including overcurrent limitation, thermal shutdown, and output reverse-voltage blocking—enhance fault tolerance in embedded systems. These mechanisms prevent catastrophic device failure during fault conditions, an essential aspect in production equipment and consumer devices subject to unpredictable loads or ambient temperature spikes. In prototype development, observing consistent thermal performance and stable regulation across wide input voltages early in integration enables rapid validation cycles and reduces late-stage board revisions.

The MCP1755T-5002E/OT’s SOT-23-5 package facilitates effortless placement in densely populated PCBs, permitting tight component clustering around critical I/O or analog interfaces. Experience shows that this footprint, combined with the regulator’s efficiency, improves signal path layout and maximizes board real estate utilization without compromising electromagnetic compatibility.

A notable insight emerges from evaluating the device not just on headline specifications, but on its cumulative impact within system-level constraints. The synergy between low-noise regulation, fast transient response, and compact packaging positions the MCP1755T-5002E/OT as a cornerstone in minimalist yet highly reliable power architectures. Employing the regulator enables streamlined design cycles for products like handheld instruments and modular sensor arrays, where power fidelity and space optimization drive engineering decisions.

Key Features and Performance Characteristics of MCP1755T-5002E/OT

The MCP1755T-5002E/OT low dropout regulator integrates several critical attributes aimed at precision power management in noise-sensitive electronic domains. Central to its utility is the high power supply rejection ratio (PSRR), specified at over 70dB at 1kHz. This advanced filtering capability directly targets the propagation of input voltage transients and high-frequency noise, making the regulator highly suitable for RF circuitry, precision analog front-ends, and mixed-signal modules where clean, stable supply rails are paramount. In these contexts, even minor power-line fluctuations can introduce measurable error or degrade overall system integrity; the MCP1755T’s design mitigates such risks effectively.

The broad input voltage range, extending from 3.6V to 16V, covers a spectrum of potential power sources, including single- or multi-cell lithium batteries, conventional power adapters, and industrial control rails. The minimum input requirement allows deployment in deeply discharged battery systems, while the upper bound provides ample margin for transient events on higher voltage buses. Such flexibility proves valuable in modular applications or designs targeting multiple power domains from a single PCB.

Minimization of quiescent current (typical 68μA) is engineered into the device to address the relentless drive toward energy conservation, especially in perpetually powered or standby architectures common to IoT edge nodes, smart sensors, or remote telemetry. Low Iq directly translates to reduced self-consumption, which, in aggregate, extends operational life and lowers overall system heat dissipation—factors that often shape enclosure and battery pack choices. In extended field operation, the cumulative effects of ultra-low quiescent draw become operationally significant, especially where battery replacements are logistically or financially challenging.

A key operational metric, dropout voltage (typically 300mV at 300mA), is maintained at a tight envelope, ensuring maximum energy extraction from the supply. As the source voltage decays toward the output setpoint—common in battery-powered systems—the device sustains regulation until minimal headroom is left. Practical experience shows that even small reductions in required dropout can unlock significant extra runtime, often determining whether mission-critical processing can complete before power is lost. Therefore, a regulator with minimal dropout provides tangible system resilience in fluctuating power conditions.

Precision voltage regulation is underpinned by output accuracy of ±0.85% at room temperature, with no more than ±2.0% variation across the full industrial temperature spectrum. This stability is essential for applications demanding tight threshold references, such as analog-to-digital conversion, clock generation, or sensor fusion tasks. Consistent output enables predictable analog performance, safeguards digital timing margins, and mitigates drift-related recalibration cycles. Integration of a compensation network supporting stable operation with ceramic output capacitors down to 1μF further eases component selection and layout constraints.

In practical deployment, leveraging the MCP1755T-5002E/OT requires attention to PCB trace impedance, input filtering, and thermal management to fully capitalize on its high PSRR and low dropout. For instance, situating the regulator physically close to sensitive loads and ensuring minimized loop area for input/output traces suppresses injection of ambient noise, complementing its inherent suppression capabilities. Thoughtful placement of ceramic bypass capacitors enables robust start-up and transient response, scenarios often underestimated in fast-reacting digital loads.

There exists substantial value in this regulator’s synthesis of noise suppression, energy efficiency, and flexible input accommodation. When applied judiciously, it facilitates enhanced system robustness, simplifies qualification across variable supply landscapes, and opens avenues for further miniaturization without sacrificing electrical integrity. These characteristics position the MCP1755T-5002E/OT as a reliable cornerstone for demanding analog and embedded applications where precision and efficiency are decisive factors.

Electrical Specifications of MCP1755T-5002E/OT

The MCP1755T-5002E/OT linear regulator demonstrates a balance of wide input voltage tolerance and precise fixed 5.0V output, making it suitable for demanding low-dropout voltage regulation requirements. Accepting inputs from 3.6V to 16.0V, it supports broad system supply scenarios, from battery-operated platforms to line-powered infrastructure, reducing design constraints imposed by transient or varying source levels. Its consistent 300mA continuous output, combined with a maximum dropout voltage of 500mV at full load, allows for robust operation even as input voltages approach the regulated output, minimizing thermal buildup and loss in energy-sensitive applications.

Tight output voltage accuracy, specified at ±0.85% at 25°C and within ±2.0% across the extended temperature range (−40°C to +125°C), is advantageous for analog signal chains and digital circuits where supply stability directly impacts signal integrity and logic thresholds. This precision eliminates the need for secondary trimming or extensive calibration, streamlining both prototyping and volume manufacturing. Typical output voltage deviation under line (±0.01% at 25°C) and load changes (±0.1% across rated output) further ensures minimal rail variation, contributing to high system predictability and reducing risks of undervoltage events during dynamic operating conditions.

Exceptionally low quiescent current—68μA typical—enables efficient implementation in always-on or portable systems that cannot afford excessive standby losses. Underscoring its suitability for noise-sensitive contexts, the MCP1755T-5002E/OT demonstrates an output noise floor of just 0.3μV/√Hz at 1kHz (with a 50mA load), a critical metric for maintaining SNR in mixed-signal interfaces such as analog front ends or RF receiver preprocessing. Its power supply rejection ratio, reaching 80dB at 1kHz, efficiently rejects upstream supply ripple, further mitigating interference injection into sensitive downstream circuitry.

Practical deployment in embedded platforms affirms the regulator’s stability over output capacitor ranges and layout variations, offering smooth startup and minimal overshoot without complex compensation networks. Experience demonstrates that its tolerances remain predictable under load transients typical of wireless communication sub-systems, where peak currents briefly spike during transmission phases, but the LDO holds steady, preventing digital brownout or analog offset drift.

Within sensor suites and microcontroller supplies, the MCP1755T-5002E/OT facilitates reliable biasing, especially where supply convergence to a regulated 5.0V rail simplifies multi-rail management and reduces bill-of-materials complexity. The underlying architecture, focused on low dropout and high regulation fidelity, represents a design paradigm that prioritizes stable downstream performance even in the presence of noisy or margin-stressed supply rails. By integrating these attributes, the device allows the system architect to emphasize performance at the edge of efficiency and precision, without forfeiting resilience or manufacturability.

Protection and Reliability Features in MCP1755T-5002E/OT

The MCP1755T-5002E/OT integrates a robust suite of protection and reliability mechanisms, specifically engineered to safeguard sensitive downstream circuits and maintain operational integrity across diverse system environments. At the core of its fault management is an effective overcurrent protection architecture. Employing both current foldback and precise output current limiting, the device intervenes instantly in the presence of overloads or direct short-circuit events. This not only restricts the output to approximately 30mA during fault conditions but also sharply minimizes the thermal and electrical stress imposed on both the regulator and the protected load. Notably, practical experience demonstrates high device survivability during PCB-level shorts, underscoring the benefit of using such foldback schemes when layout constraints or field risks make inadvertent shorts plausible.

Thermal management is addressed through an integrated overtemperature shutdown circuit. Once the silicon junction surpasses a threshold of 150°C, the regulator initiates a controlled shutdown. The inclusion of built-in hysteresis ensures that automatic recovery occurs only after the device cools sufficiently, avoiding cycling that could otherwise accelerate degradation. This feature is critical during periods of elevated ambient temperature or when thermal dissipation is temporarily hindered. In applied designs where dense board real estate limits heatsinking opportunities, such shutdown automation prevents catastrophic failure, giving designers a wider safety margin under fault or stress scenarios.

To further reinforce operational reliability, the MCP1755T-5002E/OT implements an Under Voltage Lockout (UVLO) strategy. This mechanism with a 3.0V threshold (plus a 300mV hysteresis window) guarantees that the regulator engages output only within safe input supply conditions. As a result, downstream logic and analog loads are shielded from undervoltage-induced latch-up, malfunction, or unreliable startup states. This is particularly valuable during cold starts, battery switchover transients, or marginal supply scenarios common in low-power embedded systems. UVLO ensures that system initialization never proceeds from an ambiguous power domain, eliminating subtle field failures linked to early or partial turn-on.

Additionally, diagnostic transparency is elevated through the integrated Power-Good (PG) output function. By providing real-time indication that the output voltage resides strictly within its guaranteed regulation range, the PG signal supports sophisticated power sequencing and coordinated system boot procedures. In multi-rail systems, this output enables correct power-up order and reduces risk of bus conflicts or premature device enablement. In complex sequencing use cases, the PG output has proven essential in preventing simultaneous load activation, thereby reducing inrush currents and protecting both the regulator and interconnected subsystems.

The cumulative integration of these protection and diagnostic features transforms the MCP1755T-5002E/OT from a basic low dropout regulator into a resilient power management node designed for unpredictable conditions. These mechanisms reinforce each other, providing a layered defense that not only enhances system-level reliability but allows tighter design margins and greater confidence in deployment. When choosing components for mission-critical or ruggedized applications, selecting regulators with such comprehensive protections aligns with best engineering practices, balancing board complexity with real-world durability and diagnostic clarity.

Packaging and Mounting Options for MCP1755T-5002E/OT

The MCP1755T-5002E/OT voltage regulator encapsulates multiple engineering considerations within its packaging and mounting approach. Using the SOT-23-5 (SC-74A, SOT-753) package, it achieves a balance between minimal PCB footprint and reliable electrical performance, targeting densely populated circuit layouts where spatial economy is paramount. The SOT-23-5’s physical dimensions allow integration into compact designs while maintaining adequate pad-to-lead spacing for effective solder joint integrity, which is crucial during high-speed, automated assembly. Compatibility with industry-standard pick-and-place equipment and optimized lead geometry ensure robust alignment and precise mounting, streamlining throughput in surface-mount manufacturing lines.

From a heat dissipation standpoint, SOT-23-5 leverages efficient thermal transfer through both its leads and the PCB, though its compact size imposes certain limits. For scenarios demanding higher power or improved thermal management, engineers utilize other variants in the MCP1755 family: SOT-223-3, SOT-223-5, and 2x3mm DFN-8. These alternative packages provide increased copper area or enhanced thermal conduction paths, vital for maintaining stable regulator operation under elevated load currents or ambient temperatures. Selection between package types often depends on the targeted balance between thermal resistance, device orientation, and board real estate—highlighting the importance of early-stage thermal simulation and layout optimization.

Electrical resilience is further reinforced by the package’s ESD handling capabilities, with ≥3 kV Human Body Model and ≥400V Machine Model ratings, mitigating risks during production and deployment. Compliance with RoHS and REACH standards eliminates hazardous substances, supporting safe handling and environmental stewardship within manufacturing ecosystems. These features remain inherent across MCP1755 package variations, providing consistent reliability regardless of mounting configuration.

In real-world application, refined pad layouts and controlled solder processes minimize tombstoning and cold joint formation. Empirical experience with SOT-23-5 reveals the benefit of carefully engineered land pattern sizing, balancing wetting angles and thermal expansion characteristics to avoid premature failure or rework. This attention to detail at the PCB design phase translates to improved yield and sustained performance throughout the product lifecycle.

As voltage regulators increasingly integrate into tightly constrained smart devices and IoT hardware, the strategic selection of SOT-23-5 for MCP1755T-5002E/OT underscores the synergy between space optimization and manufacturability. The nuanced decision to choose such a package reflects a calculated prioritization of reliability under miniaturized conditions. Continuous advances in surface-mount process control and material science have further enhanced the practical viability of small-profile packages for dependable voltage distribution—asserting the ongoing relevance of SOT-23-5 in the evolving landscape of embedded system design.

Typical Application Scenarios for MCP1755T-5002E/OT

The MCP1755T-5002E/OT is a low dropout (LDO) voltage regulator engineered for versatility across numerous battery-powered, portable, and embedded electronics. Its foundational architecture emphasizes efficient power management, supporting both steady-state and transient loads with minimal quiescent current consumption. This core set of attributes shapes its suitability for demanding application environments where both circuit noise and operational reliability are non-negotiable.

In safety-critical systems such as smoke and CO₂ detectors, the MCP1755T-5002E/OT’s low quiescent current and precise voltage regulation directly translate to extended battery life and consistent sensor response. The internal reference and error amplifier design maintain output stability, even under varying load conditions triggered by sensor activation cycles. These detectors often rely on frequent wake-sleep sequencing, which stresses the power rail; the device’s robust line and load regulation simplifies design for long-term deployment with infrequent maintenance.

Within RF-centric platforms—such as smart battery packs, handheld pagers, and cellular modules—noise-sensitive circuits benefit from the MCP1755T-5002E/OT’s low output noise characteristics. Its linear regulation topology minimizes high-frequency ripple, reducing interference with adjacent analog and radio-frequency sections. In these applications, deployment often involves dense PCB layouts and concurrent supply rails for digital and mixed-signal domains. The MCP1755T-5002E/OT’s tolerance to minimal output capacitance allows for the use of compact ceramic capacitors, supporting aggressive board miniaturization without compromising transient response or startup behavior.

For microcontroller and sensor platforms, ensuring clean, sequenced voltage rails is critical. The MCP1755T-5002E/OT promotes stable system boot and deterministic power-up timing, which is particularly relevant in scenarios where brown-out or glitch events could induce erratic logic states or unintended resets. Experience shows that integrating this device in multi-rail systems mitigates cross-regulator load interactions, especially when leveraging the stable dropout performance during battery discharge cycles.

Portable digital assistants, data loggers, and consumer gadgets demand a nuanced balance of energy efficiency and equipment resilience. The MCP1755T-5002E/OT excels in applications where thermal dissipation and space constraints converge—the minimal output capacitance and low dropout voltage reduce energy loss while maintaining load stability over ambient temperature swings and mission profiles with sporadic data bursts.

In PCB implementations, the minimal external component count accelerates design iteration and shrinks the bill of materials. The compact SOT-23 package streamlines placement even in multi-regulator topologies, enabling fault isolation and modular replacements without extensive layout redesigns. Device integration into battery-operated prototypes validates the consistent power delivery even at end-of-life battery conditions, confirming the LDO’s advantage in sustaining performance as available supply voltage decays.

Critical analysis suggests the MCP1755T-5002E/OT is most effective when leveraged not as a generic power solution, but as a platform enabler in systems where noise isolation, fast transient handling, and power integrity serve as decisive design differentiators. Its operational envelope addresses both the hardware simplification goals of modern engineering workflows and the long-tail reliability required by connected, field-deployed edge devices.

Potential Equivalent/Replacement Models for MCP1755T-5002E/OT

A comprehensive approach to finding suitable alternatives for the MCP1755T-5002E/OT linear regulator begins with a granular analysis of both functional and physical parameters. The key is to match essential electrical specifications, including output voltage, dropout voltage, quiescent current, and PSRR characteristics. The MCP1755/MCP1755S family natively supports multiple fixed output voltages and shares standard SOT-23-5 package dimensions, enabling straightforward substitution within the same series for applications not requiring a rigid 5V rail. This internal flexibility is often leveraged during late-stage design changes or supply chain disruptions to avoid board-level revisions.

Cross-vendor evaluation requires rigorous scrutiny of datasheets, with particular emphasis on high PSRR at relevant frequency ranges, as real-world noise rejection can diverge significantly between nominally similar devices. Quiescent current, while vital for battery-powered designs, sometimes reveals non-obvious differences in efficiency under light load. A methodical comparison table aids the process, mapping not only headline specifications but also subtleties such as line transient response, thermal shutdown thresholds, and soft-start behavior, which affect reliability in transient-heavy or industrial environments.

Operating temperature range and maximum input voltage are also non-negotiable criteria. These parameters often dictate deployment in extended thermal or automotive environments. Variations in protection features—output short-circuit tolerance, overcurrent/thermal protections—require verification to ensure system-level safety remains uncompromised even when the replacement device is subjected to atypical fault conditions. During qualification, breadboard or in-system empirical testing frequently identifies interaction quirks, for instance, unexpected oscillation or startup anomalies due to differences in compensation networks or internal reference architectures.

While the SOT-23-5 footprint is broadly supported across manufacturers like Texas Instruments, ON Semiconductor, and Analog Devices, mechanical compatibility does not guarantee seamless replacement. Pinout, enable logic polarity, and package marking conventions can introduce errors in automated assembly or rework unless explicitly cross-checked. Thus, a disciplined engineering process incorporates not only electrical and thermal modeling but also a holistic review of qualification logs, field failure rates, and manufacturing test escapes associated with candidate parts.

Implicit in high-reliability design is an understanding that second-sourcing extends beyond datasheet conformance; it encompasses a nuanced evaluation of vendor supply stability, long-term product roadmap, and technical support quality. Substitution is less a discrete act of specification-matching and more an integrated engineering decision balancing system margin, manufacturability, and lifecycle risk. This multifaceted perspective yields robust component selection strategies that underpin resilient, adaptable product designs.

Conclusion

The MCP1755T-5002E/OT, designed by Microchip Technology, exemplifies a class of low dropout (LDO) regulators engineered for precision, efficiency, and reliability in demanding 5V, 300mA applications. Underpinning its core functionality is a robust CMOS process that minimizes quiescent current, directly contributing to extended battery life in portable electronic systems. The device's dropout voltage remains low even at maximum load, ensuring stable regulation close to the input supply—a critical parameter for energy-sensitive architectures or systems experiencing significant voltage fluctuations.

A standout attribute of this LDO is its high power supply rejection ratio (PSRR). This capability attenuates noise from upstream switched-mode converters or unstable supply rails, which, if unchecked, can compromise sensitive analog circuitry or digital subsystems downstream. Experience shows that integrating such high-PSRR regulators at pivotal power entry points significantly reduces troubleshooting iterations linked to power integrity issues, ultimately accelerating system integration.

The wide input voltage range—from 4V up to 16V—enhances design flexibility, allowing seamless adaptation across various input environments, including USB-powered devices, automotive accessories, and distributed DC systems. Integrated protective features, such as overcurrent and overtemperature shutdown, increase system robustness and ease compliance with stringent safety or reliability requirements found in industrial or medical deployments.

From a mechanical perspective, the MCP1755T-5002E/OT is offered in industry-standard SOT-23 and SOT-89 packages, balancing compactness with efficient thermal management. This versatility optimizes both PCB real estate and assembly workflows, especially in high-density or cost-sensitive designs.

In practical deployments, careful PCB layout to minimize parasitic inductance at input and output terminals, as well as the judicious selection of low-ESR bypass capacitors, leverages the full stability margin of the regulator. Real-world validation has shown that these best practices, when combined with the MCP1755T-5002E/OT's intrinsic performance, enable robust, low-ripple power delivery in precision instrumentation, wireless modules, and sensor interfaces.

A deeper assessment reveals that the device strikes a strategic balance between usability and technical margin. Rather than over-engineering with excessive current headroom or complex supervisory logic, this LDO streamlines the design path, allowing rapid iteration during prototyping and dependable mass production without a trade-off in long-term reliability. It is particularly effective when specifying standardized power rails across product families or modular platforms, reducing supply chain complexity and accelerating time-to-market.

The MCP1755T-5002E/OT synthesizes electrical fidelity, mechanical integration, and device-level reliability. Such characteristics empower engineering teams to construct power subsystems with predictable behavior and straightforward manufacturability, laying a solid foundation for high-performance, energy-efficient electronic products.

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Catalog

1. Product Overview of MCP1755T-5002E/OT2. Key Features and Performance Characteristics of MCP1755T-5002E/OT3. Electrical Specifications of MCP1755T-5002E/OT4. Protection and Reliability Features in MCP1755T-5002E/OT5. Packaging and Mounting Options for MCP1755T-5002E/OT6. Typical Application Scenarios for MCP1755T-5002E/OT7. Potential Equivalent/Replacement Models for MCP1755T-5002E/OT8. Conclusion

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Frequently Asked Questions (FAQ)

When should I pick MCP1755T-5002E/OT instead of an ultra-low-dropout (LDO) like TLV755P for a 5 V sensor rail powered from a 5.3 V Li-ion pack, and what hidden headroom penalty does MCP1755T-5002E/OT impose at cold start?

Pick MCP1755T-5002E/OT when you need its 80 dB PSRR to squash sub-100 kHz switcher trash, integrated Power-Good flag for MCU brown-out warning, and 125 °C rating for under-hood modules. TLV755P drops only 110 mV @ 300 mA, but PSRR collapses above 100 kHz and it lacks Power-Good. MCP1755T-5002E/OT’s 500 mV max dropout at cold (-40 °C) means a 5.3 V battery dips to 4.8 V during in-rush; verify your Li-ion low-battery cut-off is ≥3.6 V or pre-charge the rail with a 4.7 µF ceramic on the input to ride through 2 ms load steps.

I’m replacing an older SOT-23-5 MIC5205-5.0YM5 that dies at 85 °C; will MCP1755T-5002E/OT survive continuous 300 mA at 105 °C ambient inside an IP67 BLE gateway, and what PCB copper area is the bare minimum to keep junction under 125 °C?

Yes—MCP1755T-5002E/OT is rated 125 °C junction versus MIC5205-5.0YM5’s 125 °C spec, but its thermal-shutdown curve is tighter (150 °C typ vs 160 °C). With 300 mA load and 5 VOUT from 6 VIN you dissipate 300 mW. At 105 °C ambient, θJA must be ≤66 °C/W. A 2-layer, 1 oz board needs 25 mm² copper on the GND pin (pin 2) plus 8 thermal vias to inner GND plane; single-sided designs without vias require 80 mm² and 5 m/s airflow or you risk thermal fold-back during summer soak tests.

Can I parallel two MCP1755T-5002E/OT devices on the same 5 V rail to get 600 mA for a GSM module 2 A burst, and how do I stop current hogging that latches one regulator into current limit?

Officially no—MCP1755T-5002E/OT has no ballast or current-share pin. If you must, insert 0.22 Ω 1206 series resistors on each output; at 300 mA this drops 66 mV, forcing voltage-mode sharing within 5 %. Size resistors for 0.1 W dissipation and place a common 47 µF low-ESR Al-poly after the merge point to source the 0.6 ms 2 A burst while both regulators stay in current-limit fold-back. Verify the GSM module accepts 4.85 V minimum; if not, use a single 1 A switcher instead.

My MCP1755T-5002E/OT output oscillates at 4 MHz when I feed it from a 1 MHz buck pre-regulator set to 6 V; how do I break the control-loop interaction and still hit CISPR-32 Class B?

The 1 MHz ripple hitting MCP1755T-5002E/OT’s 80 dB PSRR at 1 MHz creates a beat note. Insert a 4.7 µH 0603 chip inductor followed by 10 µF X7R within 5 mm of the IN pin, creating a 50 kHz LC pole. Add 1 Ω between inductor and IN to damp Q. Keep AGND (pin 2) on its own via to system analog ground; bridge PGND to power ground only at the output capacitor return. This drops the 4 MHz spur 14 dB and CISPR-32 Class-B margin improves to 6 dB at 30 MHz.

If Microchip allocates MCP1755T-5002E/OT to factory-only NCNR orders, which pin-compatible SOT-23-5 5 V LDOs are drop-in replacements that keep enable-logic high-active and Power-Good open-drain, and what performance do I give up?

Closest is ADP1755ACPZ-5.0-R7 (Analog Devices) – same pinout, 5 V fixed, 1.2 A, high-active enable, Power-Good, but PSRR drops to 65 dB at 1 kHz and dropout is only 170 mV. AP7365-50YG-13 (Diodes) also fits, but quiescent jumps to 120 µA and overshoots 6 % on recovery from 0 to 300 mA. Both are 125 °C rated. Re-qualify loop stability: swap the original 1 µF output cap to 2.2 µF X7R to keep phase margin >45° with the higher bandwidth ADP1755. If you need exact 80 dB PSRR, pre-order MCP1755T-5002E/OT via distribution bonded inventory instead.

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