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LE89810BSC
Microchip Technology
IC TELECOM INTERFACE 16SOIC
84142 Pcs New Original In Stock
Telecom IC 16-SOIC
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(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (34 Ratings)
LE89810BSC
Product Overview
1365605
DiGi Electronics Part Number
LE89810BSC-DGManufacturer
Microchip Technology
LE89810BSC
Description
IC TELECOM INTERFACE 16SOICInventory
84142 Pcs New Original In Stock
Telecom IC 16-SOIC
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
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LE89810BSC Technical Specifications
Category
Interface, Telecom
Packaging
-
Series
-
Product Status
Obsolete
Function
-
Interface
PCM
Number of Circuits
1
Voltage - Supply
-
Current - Supply
-
Operating Temperature
-
Mounting Type
Surface Mount
Package / Case
-
Supplier Device Package
16-SOIC
Base Product Number
LE89810
Datasheet & Documents
HTML Datasheet
LE89810BSC-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
2,250
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
DiGi Electronics’ broad product offerings give us flexibility in upgrading our educational resources.
de desembre 02, 2025
I am very satisfied with how efficiently they handle logistics and support.
de desembre 02, 2025
DiGi Electronics provides extraordinary value for bulk purchases, maintaining top quality at affordable prices.
de desembre 02, 2025
The packaging from DiGi Electronics is eco-friendly, which makes me proud to support such a sustainable company.
de desembre 02, 2025
Reliable, cost-effective, and high-quality—DiGi Electronics earns my trust every time.
de desembre 02, 2025
Fast shipping combined with premium quality—definitely worth the investment.
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Frequently Asked Questions (FAQ)
Can the LE89810BSC be used as a drop-in replacement for the LE9643AQC in a legacy telecom design, and what are the key differences to watch for?
The LE89810BSC is not a direct drop-in replacement for the LE9643AQC despite both being telecom interface ICs from Microchip. The LE89810BSC supports PCM interface functionality in a 16-SOIC package but lacks integrated BORSCHT functions present in the LE9643AQC, which means external line interface components may be required. Additionally, the LE9643AQC supports more advanced loop-start and ground-start signaling modes. Designers should verify signaling compatibility, power supply requirements, and PCM timing alignment when considering substitution, especially in existing CO or PBX line card designs. Always consult both device application notes before interchange to avoid field reliability issues.
What are the main design-in risks when using the LE89810BSC in a new product given its obsolete status?
Using the LE89810BSC in new designs carries significant supply chain and lifecycle risks due to its obsolete status. While 84,050 units are currently available as New Original stock, long-term availability is not guaranteed, which could jeopardize product sustainment beyond 2–3 years. Additionally, obsolescence increases counterfeit risk from non-franchised suppliers. To mitigate, secure last-time buy quantities early, evaluate form-fit-function alternatives like discrete PCM interface solutions or FPGA-based implementations, and conduct thorough end-of-life (EOL) risk assessment with supply chain stakeholders before committing to high-volume production.
How does the 16-SOIC package of the LE89810BSC impact thermal and board layout considerations in high-density telecom assemblies?
The 16-SOIC package of the LE89810BSC has limited thermal dissipation capability, which becomes critical in high-density telecom line cards where multiple interface ICs operate in proximity. Ensure adequate copper pour around the GND pad for heat spreading and avoid placing heat-sensitive components nearby. For PCB layout, minimize trace lengths for PCM clock and data lines to reduce skew and crosstalk, and isolate analog and digital grounds with a single-point connection near the device. Given no supply voltage or current specs are published, confirm worst-case power dissipation assumptions with Microchip’s technical support to avoid thermal runaway in enclosed environments.
What reliability concerns should be addressed when replacing aging LE89810BSC units in field-deployed telecom equipment?
When replacing LE89810BSC ICs in field equipment, be aware that long-term reliability risks can arise from using new-old-stock (NOS) devices, even if RoHS3 compliant and MSL 1 rated. Devices stored for extended periods may exhibit degraded bond wire integrity or moisture ingress if packaging was compromised. Always perform bake-out per J-STD-033 before reflow, and implement post-installation burn-in and loop diagnostics. Additionally, confirm that replacement units are traceable to original Microchip manufacturing lots, and cross-check with Microchip’s Obsolescence Notice ID to ensure firmware or compatibility updates were not issued prior to discontinuation.
What are the signal integrity challenges when integrating the LE89810BSC into a PCM backplane with mixed analog and digital traces?
Integrating the LE89810BSC into a mixed-signal PCM backplane requires careful attention to signal integrity due to potential crosstalk between high-speed PCM channels and nearby analog signals. Ensure PCM clock (typically 2.048 MHz) and data lines are impedance-controlled with ground shielding, and avoid routing beneath the LE89810BSC to prevent ground bounce. Use series termination resistors close to the driver to damp reflections, and keep analog signal paths short and guarded. Because the LE89810BSC lacks internal slew rate control, verify compatibility with downstream receivers and consider adding filtering on output lines to meet EMI compliance in multi-slot chassis systems.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
LE89810BSC CAD Models
Microchip Technology LE89810BSC PCB symbols & footprints
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