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LE58083ABGC
Microchip Technology
IC TELECOM INTERFACE 121BGA
2383 Pcs New Original In Stock
Telecom IC Subscriber Line Interface Concept (SLIC) 121-LFBGA (10x10)
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Minimum 1
Minimum 1
5.0 / 5.0
- (251 Ratings)
LE58083ABGC
Product Overview
1319091
DiGi Electronics Part Number
LE58083ABGC-DGManufacturer
Microchip Technology
LE58083ABGC
Description
IC TELECOM INTERFACE 121BGAInventory
2383 Pcs New Original In Stock
Telecom IC Subscriber Line Interface Concept (SLIC) 121-LFBGA (10x10)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
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Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
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Worldwide Delivery in 3-5 Business Days
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LE58083ABGC Technical Specifications
Category
Interface, Telecom
Packaging
-
Series
-
Product Status
Obsolete
Function
Subscriber Line Interface Concept (SLIC)
Interface
PCI
Number of Circuits
1
Voltage - Supply
3.3V
Current - Supply
-
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
121-LFBGA
Supplier Device Package
121-LFBGA (10x10)
Datasheet & Documents
HTML Datasheet
LE58083ABGC-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
ECCN
OBSOLETE
HTSUS
0000.00.0000
Additional Information
Standard Package
1
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Revenir chez DiGi Electronics est toujours une excellente décision, tant pour le prix que pour l'emballage éco-responsable.
de desembre 02, 2025
Die Produktqualität bei DiGi Electronics bleibt konstant hoch, und die günstigen Preise sind ein großer Pluspunkt.
de desembre 02, 2025
Shopping is a breeze thanks to their intuitive website and great prices.
de desembre 02, 2025
The excellence in their product quality is matched by the efficiency of their delivery.
de desembre 02, 2025
I find their website very easy to use, and the prices are always reasonable.
de desembre 02, 2025
The sturdy design and protective packaging make this a trustworthy choice for long-term use.
de desembre 02, 2025
The timely support provided after our purchases has strengthened our trust in DiGi Electronics.
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Frequently Asked Questions (FAQ)
Can I still use the LE58083ABGC in a new telecom design despite it being marked as obsolete by Microchip?
Using the LE58083ABGC in new designs is strongly discouraged due to its obsolete status, which means Microchip no longer supports it with updates, reliability data, or future availability. While existing inventory may function, you risk supply chain disruption, lack of technical support, and non-compliance with modern telecom standards. For new designs, consider migrating to an active SLIC like the Microchip HV96008 or Texas Instruments TLV320AIC3106, which offer better long-term availability, enhanced integration, and updated compliance certifications.
What are the critical layout and thermal considerations when replacing the LE58083ABGC with a newer SLIC in an existing 10x10 mm BGA footprint?
When replacing the LE58083ABGC with a modern SLIC such as the Zarlink ZL88801 (also in 10x10 LFBGA), ensure that ball pitch, power/ground plane distribution, and decoupling strategies match the original design. The LE58083ABGC’s MSL 3 rating requires strict adherence to 168-hour floor life and reflow profiling to avoid moisture-induced delamination. Newer alternatives may have different thermal resistance (θJA), so verify that your PCB copper pour and via stitching provide adequate heat dissipation—especially under high-line voltage conditions—to prevent thermal shutdown or premature aging.
How does the LE58083ABGC’s 3.3V-only supply requirement impact power system design compared to dual-supply SLICs like the Silicon Labs Si3217x?
The LE58083ABGC’s single 3.3V supply simplifies power architecture but limits flexibility in high-voltage ringing applications, requiring external DC-DC converters or charge pumps for tip/ring drive—increasing BOM cost and board space. In contrast, dual-supply SLICs like the Si32177 accept ±12V or higher, enabling direct high-voltage operation without additional conversion stages. If migrating from the LE58003ABGC, assess whether your system can tolerate added complexity or if a modern integrated solution with built-in high-voltage generation (e.g., Maxim MAX12970) better balances efficiency and design risk.
What reliability risks should I evaluate if I source LE58083ABGC units from third-party distributors for legacy system maintenance?
Sourcing the LE58083ABGC from non-franchised distributors introduces significant reliability risks, including counterfeit parts, degraded moisture sensitivity (exceeding MSL 3 limits), and out-of-spec electrical performance due to improper storage. Always demand full traceability documentation, perform incoming inspection (X-ray, decapsulation if needed), and conduct functional testing under worst-case line conditions. For mission-critical systems, consider redesigning with a pin-compatible, non-obsolete alternative like the Onsemi NCS5651 to eliminate long-term obsolescence and authenticity concerns.
Can the LE58083ABGC interface reliably with modern PCIe-based host controllers, or will signal integrity issues arise due to its legacy PCI interface?
The LE58083ABGC uses a legacy parallel PCI interface (not PCIe), which creates a fundamental incompatibility with modern PCIe-only host systems. Direct connection is not feasible without a PCI-to-PCIe bridge chip (e.g., ASMedia ASM1083), introducing latency, driver complexity, and potential timing violations. In new integrations, this bridge adds failure points and complicates firmware development. Instead, transition to SLICs with native SPI or I²C control (e.g., Infineon ISAC-S XMC) to avoid protocol translation risks and align with current embedded processor architectures.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
LE58083ABGC CAD Models
Microchip Technology LE58083ABGC PCB symbols & footprints
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